MK40DX256VML7
MK40DX256VML7 Datasheet
Supports MK40DX128VLL7, MK40DX256VLL7, MK40DX128VML7, MK40DX256VML7
| Part | Datasheet |
|---|---|
MK40DX256VML7 |
MK40DX256VML7 (pdf) |
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| Freescale Semiconductor Data Sheet Technical Data K40 Sub-Family Supports MK40DX128VLL7, MK40DX256VLL7, MK40DX128VML7, MK40DX256VML7 Features • Operating Characteristics Voltage range to V Flash write voltage range to V Temperature range ambient -40 to 105°C • Clocks 3 to 32 MHz crystal oscillator 32 kHz crystal oscillator Multi-purpose clock generator • System peripherals 10 low-power modes to provide power optimization based on application requirements 16-channel DMA controller, supporting up to 63 request sources External watchdog monitor Software watchdog Low-leakage wakeup unit • Security and integrity modules Hardware CRC module to support fast cyclic redundancy checks 128-bit unique identification ID number per chip • Human-machine interface Segment LCD controller supporting up to 36 frontplanes and 8 backplanes, or 40 frontplanes and 4 backplanes, depending on the package size Low-power hardware touch sensor interface TSI General-purpose input/output K40P100M72SF1 • Analog modules Two 16-bit SAR ADCs Programmable gain amplifier PGA up to x64 integrated into each ADC 12-bit DAC Three analog comparators CMP containing a 6-bit DAC and programmable reference input Voltage reference • Timers Programmable delay block Eight-channel motor control/general purpose/PWM timer Two 2-channel quadrature decoder/general purpose timers Periodic interrupt timers 16-bit low-power timer Carrier modulator transmitter Real-time clock • Communication interfaces USB full-/low-speed On-the-Go controller with onchip transceiver Controller Area Network CAN module Two SPI modules Two I2C modules Five UART modules I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2012 Freescale Semiconductor, Inc. Table of Contents 1 Ordering 6 Peripheral operating requirements and behaviors....................22 Determining valid orderable Core 2 Part Debug trace timing JTAG System Clock 3 Terminology and Oscillator electrical Definition Operating 32kHz Oscillator Electrical Characteristics............30 Definition Operating Memories and memory Definition: Flash electrical Definition: EzPort Switching Result of exceeding a Security and integrity Relationship between ratings and operating ADC electrical Guidelines for ratings and operating requirements............7 CMP and 6-bit DAC electrical specifications.........45 Definition Typical 12-bit DAC electrical characteristics.....................47 Typical value Voltage reference electrical specifications............50 Thermal handling Communication Moisture handling USB electrical ESD handling USB DCD electrical specifications........................52 Voltage and current operating ratings...............................9 USB VREG electrical specifications......................52 CAN switching AC electrical DSPI switching specifications limited voltage Nonswitching electrical Ordering parts 1 Ordering parts Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to and perform a part number search for the following device numbers PK40 and MK40 2 Part identification Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. Format Part numbers for this device have the following format Q K## A M FFF R T PP CC N Fields This table lists the possible values for each field in the part number not all combinations are valid : Field Q K## A Description Qualification status Kinetis family Key attribute Flash memory type Values • M = Fully qualified, general market flow • P = Prequalification • K40 • D = Cortex-M4 w/ DSP • F = Cortex-M4 w/ DSP and FPU • N = Program flash only • X = Program flash and FlexMemory Table continues on the next page... Freescale Semiconductor, Inc. Terminology and guidelines Field FFF Description Program flash memory size Temperature range °C Package identifier Maximum CPU frequency MHz Packaging type Example This is an example part number MK40DN512ZVMD10 3 Terminology and guidelines Values • 32 = 32 KB • 64 = 64 KB • 128 = 128 KB • 256 = 256 KB • 512 = 512 KB • 1M0 = 1 MB • V = to 105 • C = to 85 • FM = 32 QFN 5 mm x 5 mm • FT = 48 QFN 7 mm x 7 mm • LF = 48 LQFP 7 mm x 7 mm • LH = 64 LQFP 10 mm x 10 mm • MP = 64 MAPBGA 5 mm x 5 mm • LK = 80 LQFP 12 mm x 12 mm • MB = 81 MAPBGA 8 mm x 8 mm • LL = 100 LQFP 14 mm x 14 mm • ML = 104 MAPBGA 8 mm x 8 mm • MC = 121 MAPBGA 8 mm x 8 mm • LQ = 144 LQFP 20 mm x 20 mm • MD = 144 MAPBGA 13 mm x 13 mm • MJ = 256 MAPBGA 17 mm x 17 mm • 5 = 50 MHz • 7 = 72 MHz • 10 = 100 MHz • 12 = 120 MHz • 15 = 150 MHz • R = Tape and reel • Blank = Trays Freescale Semiconductor, Inc. Definition Operating requirement Terminology and guidelines An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. |
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