NCP03YS330J05RL

NCP03YS330J05RL Datasheet

NCP03YS110p05RL NCP03YS220p05RL NCP03YS330p05RL NCP03YS470p05RL NCP03YS680p05RL NCP03YS101p05RL NCP03XH682p05RL NCP03XH103p05RL NCP03XH153p05RL NCP03XH223p05RL NCP03WF333p05RL NCP03WB473p05RL NCP03WL473p05RL NCP03WF683p05RL NCP03WL683p05RL NCP03WF104p05RL NCP03WL104p05RL NCP03WL154p05RL NCP03WL224p05RL

Part	Datasheet
NCP03YS330J05RL	NCP03YS330J05RL (pdf)

PDF Datasheet Preview
!Note etc. R44E9.pdf sl rsdheereintgfo. r product specifications before ordering. 1 NTC Thermistors for Temperature Compensation 0201 0603 Size 0201/0402/0603/0805 sized Chip NTC Thermistor have Ni barrier termination and provide excellent solderability and offer high stability in environment by unique inner construction. s Features Excellent solderability and high stability in environment Excellent long time aging stability High accuracy in resistance and B-constant Reflow soldering possible Lead is not contained in the product. Electrode Ag System + Ni Plating + Sn Plating in mm s Applications Temperature compensation of transistor, IC, crystal oscillator of mobile communications equipment Temperature sensor for rechargeable batteries Temperature compensation of LCD Temperature compensation and sensing of car audio equipment CD, MD, Tuner Temperature compensation of several kinds of circuits NCP03YS110p05RL NCP03YS220p05RL NCP03YS330p05RL NCP03YS470p05RL NCP03YS680p05RL NCP03YS101p05RL NCP03XH682p05RL NCP03XH103p05RL NCP03XH153p05RL NCP03XH223p05RL NCP03WF333p05RL NCP03WB473p05RL NCP03WL473p05RL NCP03WF683p05RL NCP03WL683p05RL NCP03WF104p05RL NCP03WL104p05RL NCP03WL154p05RL NCP03WL224p05RL Resistance 25°C 11ohm 22ohm 33ohm 47ohm 68ohm 100ohm 6.8k ohm 10k ohm 15k ohm 22k ohm 33k ohm 47k ohm 47k ohm 68k ohm 68k ohm 100k ohm 100k ohm 150k ohm 220k ohm B-Constant 25-50°C K 2750 ±3% 2750 ±3% 2750 ±3% 2750 ±3% 2750 ±3% 2750 ±3% 3380 ±3% 3380 ±3% 3380 ±3% 3380 ±3% 4250 ±3% 4050 ±3% 4485 ±3% 4250 ±3% 4485 ±3% 4250 ±3% 4485 ±3% 4485 ±3% 4485 ±3% Permissive Operating Rated Electric Typical Dissipation Current 25°C Power 25°C Constant 25°C mW/°C Operating Temperature Range °C -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 A blank column is filled with resistance tolerance codes. J ±5%, K ±10% !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. s Standard Land Dimensions Chip Solder Resist Land Soldering Methods Reflow Soldering in mm !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. for Temperature Compensation Temperature Characteristics Center Value Part Number NCPppYS110 NCPppYS220 NCPppXC220 NCPppYS330 NCPppXC330 NCPppYS470 NCPppXC470 NCPppYS680 Resistance B-Constant 2750K 2750K 3100K 2750K 3100K 2750K 3100K 2750K Temp. °C Resistance Part Number NCPppXC680 Resistance B-Constant 3100K Temp. °C Resistance NCPppYS101 2750K Resistance NCPppXF101 3250K Resistance NCPppXF151 3250K Resistance NCPppXM221 NCPppXM331 NCPppXQ471 NCPppXQ681 3500K 3500K 3650K 3650K Resistance Continued on the following page. !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. for Temperature Compensation Temperature Characteristics Center Value Continued from the preceding page. Part Number NCPppXQ102 NCPppXW152 NCPppXW222 NCPppXW332 NCPppXM472 NCPppXH682 NCPppXW682 NCPppXH103 Resistance B-Constant 3650K 3950K 3950K 3950K 3500K 3380K 3950K 3380K Temp. °C Resistance Part Number NCPppXV103 NCPppXH153 NCPppXW153 NCPppXH223 NCPppXW223 NCPppWL223 NCPppWB333 NCPppWF333 Resistance B-Constant 3900K 3380K 3950K 3380K 3950K 4485K 4050K 4250K Temp. °C Resistance Continued on the following page. !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. for Temperature Compensation Temperature Characteristics Center Value Continued from the preceding page. Part Number NCPppWL333 NCPppWB473 NCPppWL473 NCPppWD683 NCPppWF683 NCPppWL683 NCPppWF104 NCPppWL104 Resistance B-Constant 4485K 4050K 4485K 4150K 4250K 4485K 4250K∗ 4485K Temp. °C Resistance Part Number NCPppWL154 NCPppWM154 NCPppWL224 NCPppWM224 NCPppWM474 Resistance B-Constant 4485K 4500K 4485K 4500K 4500K Temp. °C Resistance ∗ B-Constant of NCP18WF104F type is 4200K. Please contact us for the detail data. !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. Chip Type !Caution/Notice s !Caution Storage and Operating Conditions This product is designed for application in an ordinary environment normal room temperature, humidity and atmospheric pressure . Do not use under the following conditions because all these factors can deteriorate the product characteristics or cause failures and burn-out. Corrosive gas or deoxidizing gas Chlorine gas, Hydrogen sulfide gas, Ammonia gas, Sulfuric acid gas, Nitric oxide gas, etc. Volatile or flammable gas Dusty conditions Under high or low pressure Wet or humid locations Places with salt water, oils, chemical liquids or organic solvents Strong vibrations Other places where similar hazardous conditions exist s !Caution Others Be sure to provide an appropriate fail-safe function on your product to prevent secondary damages that may be caused by the abnormal function or the failure of our product. s Notice Storage and Operating Conditions To keep solderability of product from declining, the following storage condition is recommended. Storage condition: Temperature -10 to +40 degree C Humidity less than 75%RH not dewing condition Storage term Use this product within 6 months after delivery by first-in and first-out stocking system. Handling after unpacking After unpacking, reseal product promptly or store it in a sealed container with a drying agent. Storage place Do not store this product in corrosive gas sulfuric acid gas, chlorine gas, etc. or in direct sunlight. s Notice Rating Use this product within the specified temperature range. Higher temperature may cause deterioration of the characteristics or the material quality of this product. s Notice Handling The ceramic of this product is fragile, and care must be taken not to load a excessive press-force or not to give a shock at handling. Such forces may cause cracking or chipping. !Note etc. R44E9.pdf sl product specifications before ordering. Chip Type !Caution/Notice s Notice Soldering and Mounting Position Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. [Component Direction] Locate this product horizontal to the direction in which stress acts. [Mounting Close to Board Separation Line] Perforation Holes Slit Keep this product on the PC Board away from the Separation Line. Worst A-C-B-D Better Reflow Soldering Conditions NCP03/NCP15 Series Temperature °C Allowable Reflow Soldering Temperature and Time 280 270 260 250 240 230 220 0 10 20 30 40 50 60 70 80 90 Time sec. Temperature °C NCP18/NCP21 Series Allowable Reflow Soldering Temperature and Time 280 270 260 250 240 230 220 210 0 10 20 30 40 50 60 70 80 90 100110 Time sec. Flow Soldering Conditions NCP18/NCP21 Series Allowable Flow Soldering Temperature and Time Temperature °C 10 20 30 Time sec. Temperature °C Temperature °C Temperature °C Standard Soldering Conditions Preheating in air Soldering Gradual Cooling in air 0 1-2 min. 20sec. max. Preheating 160±10°C, 1-2 min. Soldering 240-270°C, 20sec. max. Standard Soldering Conditions Preheating in air Soldering Gradual Cooling in air 0 1-2 min. 20sec. max. Preheating 160±10°C, 1-2 min. Soldering 230-270°C, 20sec. max. sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. Continued from the preceding page. Solder and Flux 1 Solder and Paste a Reflow Soldering NCP03/15/18/21 Series Use RA/RMA type or equivalent type of solder paste. For your reference, we are using the solder paste below for any internal tests of this product. •RMA9086 90-4-M20 Sn:Pb=63wt%:37wt% Manufactured by Alpha Metals Japan Ltd. •M705-221BM5-42-11 Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt% Manufactured by Senju Metal Industry Co., Ltd. Chip Type !Caution/Notice b Flow Soldering NCP18/21 Series We are using the solder paste below. For any internal tests of this product. •Sn Pb=63wt%:37wt% •Sn Ag Cu=96.5wt% 3.0wt% 0.5wt% 2 Flux Use Rosin-based flux. Do not use strong acidic flux with halide content exceeding 0.2wt% Cleaning Conditions For removing the flux after soldering, observe the following points in order to avoid deterioration of the characteristics or any change of the external electrodes' quality. NCP03/15 NCP18/21 Solvent Isopropyl Alcohol Isopropyl Alcohol Less than 5min. at room Less than 5min. at room Dipping Cleaning temp. or less than 2min. temp. or less than 2min. at 40°C max. at 40°C max. Less than 5min. 20W/r Less than 1min. 20W/r Ultrasonic Cleaning Frequency of 28 to Frequency of several 40kHz. 10kHz to 100kHz. Drying After cleaning, promptly dry this product. Printing Conditions of Solder Paste The amount of solder is critical. Standard height of fillet is shown in the table below. Too much soldering may cause mechanical stress, resulting in cracking, mechanical and/or electronic damage. Reference Optimum Solder Amount Electrode Solder T Solder Part Number NCP03 NCP15 NCP18/NCP21 The solder paste thickness 100µm 100µm 150µm T 1/3EVTVE 1/3EVTVE 0.2mmVTVE Adhesive Application and Curing Thin or insufficient adhesive may result in loose component contact with land during flow soldering. Low viscosity adhesive causes chips to slip after mounting. !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. Chip Type Package Minimum Quantity Guide Quantity pcs. Paper Tape Plastic Tape NCP03 15000 NCP15 10000 NCP18 4000 NCP21 4000 Tape Carrier Packaging Dimensions of Reel Taping Method 1 A tape in a reel contains Leader unit and Trailer unit where products are not packed. Please refer to the figure right. 2 The top and base tapes or, plastic and cover tape are not stuck at the first five pitches minimum. 3 A label should be attached on the reel. MURATA's part number, inspection number and quantity should be marked on the label. 4 Taping reels are packed in a package. W1.0 Y0 in mm W1.0 Y0 40 min. Trailer Unit Leader Unit 190-250 210-250 Vacant Section Top Tape alone Cover Tape alone Chip-mounting Unit Direction of Feed in mm Continued on the following page. !Note etc. R44E9.pdf sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering. Continued from the preceding page. Paper Tape NCP03/15/18 Series NCP15 Series 8mm width 2mm pitch Tape max. Chip Type Package NCP18 Series 8mm width 4mm pitch Tape Direction of Feed NCP03 Series ∗ Reference Value Direction of Feed ∗ Reference Value 1 Other Conditions a Packaging Products are packaged in the cavity of the base tape and sealed by top tape and bottom tape. b Tape Top tape and bottom tape have no joints and products are packaged and sealed in the cavity of the base tape, continuously. 2 Peeling force of top tape 3 Pull Strength Pull strength of top tape is specified at 10N minimum. Pull strength of bottom tape are specified 5N minimum. Direction of Feed ∗ Reference Value in mm 165-180 ° ∗ 1 Peeling angle 165 to 180 degree against the fixed surface of tape. ∗ 2 Peeling speed 300mm/min. ∗ 3 Peeling force - 0.6N Continued on the following page.

PDF Datasheet Preview

!Note etc.

R44E9.pdf
sl rsdheereintgfo. r product specifications before ordering.
1 NTC Thermistors
for Temperature Compensation 0201 0603 Size
0201/0402/0603/0805 sized Chip NTC Thermistor have Ni barrier termination and provide excellent solderability and offer high stability in environment by unique inner construction.
s Features Excellent solderability and high stability in
environment Excellent long time aging stability High accuracy in resistance and B-constant Reflow soldering possible Lead is not contained in the product.

Electrode Ag System + Ni Plating + Sn Plating
in mm
s Applications Temperature compensation of transistor, IC, crystal
oscillator of mobile communications equipment Temperature sensor for rechargeable batteries Temperature compensation of LCD Temperature compensation and sensing of car audio
equipment CD, MD, Tuner Temperature compensation of several kinds of
circuits

NCP03YS110p05RL NCP03YS220p05RL NCP03YS330p05RL NCP03YS470p05RL NCP03YS680p05RL NCP03YS101p05RL NCP03XH682p05RL NCP03XH103p05RL NCP03XH153p05RL NCP03XH223p05RL NCP03WF333p05RL NCP03WB473p05RL NCP03WL473p05RL NCP03WF683p05RL NCP03WL683p05RL NCP03WF104p05RL NCP03WL104p05RL NCP03WL154p05RL NCP03WL224p05RL

Resistance 25°C 11ohm 22ohm 33ohm 47ohm 68ohm 100ohm
6.8k ohm 10k ohm 15k ohm 22k ohm 33k ohm 47k ohm 47k ohm 68k ohm 68k ohm 100k ohm 100k ohm 150k ohm 220k ohm

B-Constant 25-50°C K 2750 ±3% 2750 ±3% 2750 ±3% 2750 ±3% 2750 ±3% 2750 ±3% 3380 ±3% 3380 ±3% 3380 ±3% 3380 ±3% 4250 ±3% 4050 ±3% 4485 ±3% 4250 ±3% 4485 ±3% 4250 ±3% 4485 ±3% 4485 ±3% 4485 ±3%

Permissive Operating Rated Electric Typical Dissipation

Current 25°C

Power 25°C Constant 25°C
mW/°C

Operating Temperature Range
°C -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125 -40 to 125

A blank column is filled with resistance tolerance codes. J ±5%, K ±10%
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.
s Standard Land Dimensions

Chip

Solder Resist Land

Soldering Methods

Reflow Soldering
in mm
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.
for Temperature Compensation Temperature Characteristics Center Value

Part Number NCPppYS110 NCPppYS220 NCPppXC220 NCPppYS330 NCPppXC330 NCPppYS470 NCPppXC470 NCPppYS680

Resistance

B-Constant
2750K
2750K
3100K
2750K
3100K
2750K
3100K
2750K

Temp. °C Resistance

Part Number NCPppXC680

Resistance

B-Constant
3100K

Temp. °C Resistance

NCPppYS101 2750K

Resistance

NCPppXF101 3250K

Resistance

NCPppXF151 3250K

Resistance

NCPppXM221 NCPppXM331 NCPppXQ471 NCPppXQ681
3500K
3500K
3650K
3650K

Resistance

Continued on the following page.
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.
for Temperature Compensation Temperature Characteristics Center Value

Continued from the preceding page.

Part Number NCPppXQ102 NCPppXW152 NCPppXW222 NCPppXW332 NCPppXM472 NCPppXH682 NCPppXW682 NCPppXH103

Resistance

B-Constant
3650K
3950K
3950K
3950K
3500K
3380K
3950K
3380K

Temp. °C Resistance

Part Number NCPppXV103 NCPppXH153 NCPppXW153 NCPppXH223 NCPppXW223 NCPppWL223 NCPppWB333 NCPppWF333

Resistance

B-Constant
3900K
3380K
3950K
3380K
3950K
4485K
4050K
4250K

Temp. °C Resistance

Continued on the following page.
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.
for Temperature Compensation Temperature Characteristics Center Value

Continued from the preceding page.

Part Number NCPppWL333 NCPppWB473 NCPppWL473 NCPppWD683 NCPppWF683 NCPppWL683 NCPppWF104 NCPppWL104

Resistance B-Constant
4485K
4050K
4485K
4150K
4250K
4485K
4250K∗
4485K

Temp. °C Resistance

Part Number NCPppWL154 NCPppWM154 NCPppWL224 NCPppWM224 NCPppWM474

Resistance

B-Constant
4485K
4500K
4485K
4500K
4500K

Temp. °C Resistance
∗ B-Constant of NCP18WF104F type is 4200K. Please contact us for the detail data.
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.

Chip Type !Caution/Notice
s !Caution Storage and Operating Conditions This product is designed for application in an ordinary environment normal room temperature, humidity and atmospheric pressure . Do not use under the following conditions because all these factors can deteriorate the product characteristics or cause failures and burn-out. Corrosive gas or deoxidizing gas

Chlorine gas, Hydrogen sulfide gas, Ammonia gas, Sulfuric acid gas, Nitric oxide gas, etc.

Volatile or flammable gas Dusty conditions Under high or low pressure Wet or humid locations Places with salt water, oils, chemical liquids or
organic solvents Strong vibrations Other places where similar hazardous conditions
exist
s !Caution Others

Be sure to provide an appropriate fail-safe function
on your product to prevent secondary damages that may
be caused by the abnormal function or the failure of
our product.
s Notice Storage and Operating Conditions To keep solderability of product from declining, the following storage condition is recommended. Storage condition:

Temperature -10 to +40 degree C Humidity less than 75%RH not dewing condition Storage term Use this product within 6 months after delivery by first-in and first-out stocking system.

Handling after unpacking After unpacking, reseal product promptly or store it in a sealed container with a drying agent.

Storage place Do not store this product in corrosive gas sulfuric acid gas, chlorine gas, etc. or in direct sunlight.
s Notice Rating Use this product within the specified temperature range. Higher temperature may cause deterioration of the characteristics or the material quality of this product.
s Notice Handling The ceramic of this product is fragile, and care must be taken not to load a excessive press-force or not to give a shock at handling. Such forces may cause cracking or chipping.
!Note etc.

R44E9.pdf
sl product specifications before ordering.

Chip Type !Caution/Notice
s Notice Soldering and Mounting Position

Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]

Locate this product horizontal to the direction in which stress acts.
[Mounting Close to Board Separation Line]

Perforation

Holes

Slit

Keep this product on the PC Board away from the Separation Line. Worst A-C-B-D Better

Reflow Soldering Conditions NCP03/NCP15 Series

Temperature °C

Allowable Reflow Soldering Temperature and Time
280 270 260 250 240 230 220
0 10 20 30 40 50 60 70 80 90 Time sec.

Temperature °C

NCP18/NCP21 Series

Allowable Reflow Soldering Temperature and Time
280 270 260 250 240 230 220 210
0 10 20 30 40 50 60 70 80 90 100110 Time sec.

Flow Soldering Conditions NCP18/NCP21 Series

Allowable Flow Soldering Temperature and Time

Temperature °C
10 20 30

Time sec.

Temperature °C

Temperature °C

Temperature °C

Standard Soldering Conditions

Preheating in air

Soldering

Gradual Cooling in air
0 1-2 min. 20sec. max.

Preheating 160±10°C, 1-2 min. Soldering 240-270°C, 20sec. max.

Standard Soldering Conditions

Preheating in air

Soldering

Gradual Cooling in air
0 1-2 min. 20sec. max.

Preheating 160±10°C, 1-2 min. Soldering 230-270°C, 20sec. max.
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.

Continued from the preceding page.

Solder and Flux 1 Solder and Paste a Reflow Soldering NCP03/15/18/21 Series

Use RA/RMA type or equivalent type of solder paste. For your reference, we are using the solder paste below for any internal tests of this product.
•RMA9086 90-4-M20 Sn:Pb=63wt%:37wt% Manufactured by Alpha Metals Japan Ltd.
•M705-221BM5-42-11 Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt% Manufactured by Senju Metal Industry Co., Ltd.

Chip Type !Caution/Notice
b Flow Soldering NCP18/21 Series We are using the solder paste below. For any internal tests of this product.
•Sn Pb=63wt%:37wt%
•Sn Ag Cu=96.5wt% 3.0wt% 0.5wt%
2 Flux Use Rosin-based flux. Do not use strong acidic flux with halide content exceeding 0.2wt%

Cleaning Conditions For removing the flux after soldering, observe the following points in order to avoid deterioration of the characteristics or any change of the external electrodes' quality.

NCP03/15

NCP18/21

Solvent

Isopropyl Alcohol

Isopropyl Alcohol

Less than 5min. at room Less than 5min. at room

Dipping Cleaning temp. or less than 2min. temp. or less than 2min.
at 40°C max.
at 40°C max.

Less than 5min. 20W/r Less than 1min. 20W/r

Ultrasonic Cleaning Frequency of 28 to

Frequency of several
40kHz.
10kHz to 100kHz.

Drying After cleaning, promptly dry this product.

Printing Conditions of Solder Paste The amount of solder is critical. Standard height of fillet is shown in the table below. Too much soldering may cause mechanical stress, resulting in cracking, mechanical and/or electronic damage.

Reference Optimum Solder Amount

Electrode Solder

T Solder

Part Number NCP03 NCP15 NCP18/NCP21

The solder paste thickness 100µm 100µm 150µm

T 1/3EVTVE 1/3EVTVE 0.2mmVTVE

Adhesive Application and Curing Thin or insufficient adhesive may result in loose component contact with land during flow soldering. Low viscosity adhesive causes chips to slip after mounting.
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.

Chip Type Package

Minimum Quantity Guide

Quantity pcs.

Paper Tape

Plastic Tape

NCP03
15000

NCP15
10000

NCP18
4000

NCP21
4000

Tape Carrier Packaging Dimensions of Reel

Taping Method 1 A tape in a reel contains Leader unit and Trailer unit where
products are not packed. Please refer to the figure right. 2 The top and base tapes or, plastic and cover tape are not
stuck at the first five pitches minimum. 3 A label should be attached on the reel. MURATA's part
number, inspection number and quantity should be marked on the label. 4 Taping reels are packed in a package.

W1.0 Y0
in mm

W1.0 Y0
40 min. Trailer Unit

Leader Unit
190-250
210-250

Vacant Section Top Tape alone Cover Tape alone

Chip-mounting Unit

Direction of Feed
in mm

Continued on the following page.
!Note etc.

R44E9.pdf
sl ethoeuarppprroodvuacl rsdheereintgfo. r product specifications before ordering.

Continued from the preceding page.

Paper Tape NCP03/15/18 Series

NCP15 Series 8mm width 2mm pitch Tape
max.

Chip Type Package

NCP18 Series 8mm width 4mm pitch Tape

Direction of Feed

NCP03 Series
∗ Reference Value

Direction of Feed
∗ Reference Value
1 Other Conditions a Packaging Products are packaged in the cavity of the base tape and sealed by top tape and bottom tape. b Tape Top tape and bottom tape have no joints and products are packaged and sealed in the cavity of the base tape, continuously.
2 Peeling force of top tape
3 Pull Strength Pull strength of top tape is specified at 10N minimum. Pull strength of bottom tape are specified 5N minimum.

Direction of Feed ∗ Reference Value
in mm
165-180 °
∗ 1 Peeling angle 165 to 180 degree against the fixed surface of tape. ∗ 2 Peeling speed 300mm/min. ∗ 3 Peeling force - 0.6N

Continued on the following page.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived NCP03YS330J05RL Datasheet file may be downloaded here without warranties.

Datasheet ID: NCP03YS330J05RL 509983