76650-0232

76650-0232 Datasheet

Datasheet for 76650-0232

Part	Datasheet
76650-0232	76650-0232 (pdf)

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General Information Kit Part Number Connector Type Solution Molex Family Certificates Country of Origin Specifications Circuit Size Current Rating Mounting Style Orientation Pitch Speed Stack Height Style Voltage Rating Product Hightlights Datasheet for 76650-0232 76650-0232 Board-to-Board, Wire-to-Board High Speed Plateau HS Mezz , SEARAY, SEARAY Slim N/A Kit assembled in U.S.A 18, 200, 300, 400, 48 1.5A, 2.7A PCB Through Hole, SMT Surface Mount Technology Plugs, Vertical Receptacles 1.20mm 1.27mm by 1.27mm 10 Gbps Gigabits Per Second Assorted Stack Heights from 4.5mm-17mm Mezzanine 240V, 30V SEARAY* Slim is a solution armed with the benefits of the standard SEARAY* family but with a width similar to 2 row mezzanine products. The design gives a system a highly compact solution but with speed capabilities of Gbps, a level of performance most other 2 row products cannot achieve today. As system level speeds approach 5Gbps and beyond, SEARAY* is an enticing mezzanine architecture that provides headroom for future generation iterations as protocol speeds continue to increase. Plateau HS Mezz utilizes proprietary Plateau Technology plated gold housing to provide a high-speed high-density mezzanine connector system for differential and single-ended signal applications. The gold-plated plastic shields each differential pair from neighboring pairs, lowering crosstalk and improving signal clarity. Different stack heights and circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the connector. The SEARAY* board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards PCBs . The design of our SEARAY* has superior electrical and mechanical features that are cost competitive. The unique, Molex patented, solder charge technology results in better process yields a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm to 13mm Features and Benefits • Advanced gold-plated housings with integrated shielding system • Two points of contact on each signal • Multiple stack heights • Data rates up to 12.5Gbps provide excellent signal clarity and large bandwidth • Narrow body width comparable to 2 row SMT has a minimal PCB footprint for high density board designs • Robust contact design prevents stubbing and damage in mating interface • Unique patented solder attach is more cost effective and reliable than BGA • SEARAY* footprint is compatible with other 1.27mm .050" by 1.27mm .050" products Applications • Mezzanine add-on cards • Storage Devices • Switches and Hubs • Medical scanning equipment • Memory expansion • Servers and Blade Servers • Military • High and mid-range computers and servers • Mobile base stations • Controller cards Bill of Materials Molex Part No. 75005-0104 75003-0110 46557-4345 46556-4145 45971-3111 45970-3211 1.20mm Pitch Plateau HS Mezz Receptacle, 48 Circuits 1.20mm Pitch Plateau HS Mezz Plug, 48 Circuits, 13.25mm Unmated Height 1.27mm by 1.27mm Pitch, SEARAY* Slim 4 Row Receptacle, 160 Circuits, 6.50mm Unmated Height, with Pegs 1.27mm by 1.27mm Pitch, SEARAYSlim 4-Row Plug, 160 Circuits, 2.00mm Unmated Height, 4 Rows, with Pegs 1.27mm by 1.27mm Pitch, SEARAY Receptacle, 300 Circuits, H = 5.05mm Unmated Height, 10 Rows 1.27mm by 1.27mm Pitch, SEARAY* Plug, 300 Circuits, 2.85mm Unmated Height, 10 Rows Quantity 1 Recommended Molex Tool Molex Part No. Descripition

PDF Datasheet Preview

General Information Kit Part Number Connector Type Solution Molex Family Certificates Country of Origin Specifications Circuit Size Current Rating Mounting Style Orientation Pitch Speed Stack Height Style Voltage Rating Product Hightlights

Datasheet for 76650-0232
76650-0232 Board-to-Board, Wire-to-Board High Speed Plateau HS Mezz , SEARAY*, SEARAY* Slim N/A Kit assembled in U.S.A
18, 200, 300, 400, 48 1.5A, 2.7A PCB Through Hole, SMT Surface Mount Technology Plugs, Vertical Receptacles 1.20mm 1.27mm by 1.27mm 10 Gbps Gigabits Per Second Assorted Stack Heights from 4.5mm-17mm Mezzanine 240V, 30V

SEARAY* Slim is a solution armed with the benefits of the standard SEARAY* family but with a width similar to 2 row mezzanine products. The design gives a system a highly compact solution but with speed capabilities of Gbps, a level of performance most other 2 row products cannot achieve today. As system level speeds approach 5Gbps and beyond, SEARAY* is an enticing mezzanine architecture that provides headroom for future generation iterations as protocol speeds continue to increase. Plateau HS Mezz utilizes proprietary Plateau Technology plated gold housing to provide a high-speed high-density mezzanine connector system for differential and single-ended signal applications. The gold-plated plastic shields each differential pair from neighboring pairs, lowering crosstalk and improving signal clarity. Different stack heights and circuit sizes provide flexibility in design and grounding the conductive housing eliminates the need for individual ground pin designations within the connector. The SEARAY* board-to-board connector is designed for computer, networking, telecom, storage and general market applications with high pin-count devices or memory modules that are mounted on mezzanine or module PC Boards PCBs . The design of our SEARAY* has superior electrical and mechanical features that are cost competitive. The unique, Molex patented, solder charge technology results in better process yields a lower applied cost versus equivalent BGA connector products. Circuit sizes range from 160 through 500 positions, and mated stack heights cover 7mm to 13mm

Features and Benefits
• Advanced gold-plated housings with integrated shielding system
• Two points of contact on each signal
• Multiple stack heights
• Data rates up to 12.5Gbps provide excellent signal clarity and large bandwidth
• Narrow body width comparable to 2 row SMT has a minimal PCB footprint for high density board designs
• Robust contact design prevents stubbing and damage in mating interface
• Unique patented solder attach is more cost effective and reliable than BGA
• SEARAY* footprint is compatible with other 1.27mm .050" by 1.27mm .050" products

Applications
• Mezzanine add-on cards
• Storage Devices
• Switches and Hubs
• Medical scanning equipment
• Memory expansion
• Servers and Blade Servers
• Military
• High and mid-range computers and servers
• Mobile base stations
• Controller cards

Bill of Materials Molex Part No. 75005-0104 75003-0110 46557-4345
46556-4145
45971-3111
45970-3211
1.20mm Pitch Plateau HS Mezz Receptacle, 48 Circuits 1.20mm Pitch Plateau HS Mezz Plug, 48 Circuits, 13.25mm Unmated Height 1.27mm by 1.27mm Pitch, SEARAY* Slim 4 Row Receptacle, 160 Circuits, 6.50mm Unmated Height, with Pegs 1.27mm by 1.27mm Pitch, SEARAY*Slim 4-Row Plug, 160 Circuits, 2.00mm Unmated Height, 4 Rows, with Pegs 1.27mm by 1.27mm Pitch, SEARAY* Receptacle, 300 Circuits, H = 5.05mm Unmated Height, 10 Rows 1.27mm by 1.27mm Pitch, SEARAY* Plug, 300 Circuits, 2.85mm Unmated Height, 10 Rows

Quantity 1

Recommended Molex Tool Molex Part No.

Descripition

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Datasheet ID: 76650-0232 649901