MMAD1109E3/TR13

MMAD1109E3/TR13 Datasheet

MMAD1109 and MMAD1109e3

Part	Datasheet
MMAD1109E3/TR13	MMAD1109E3/TR13 (pdf)

Related Parts	Information
MMAD1109/TR13	MMAD1109/TR13

PDF Datasheet Preview
SCOTTSDALE DIVISION MMAD1109 and MMAD1109e3 Switching Diode Array Steering Diode TVS Array .COM APPEARANCE These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated by a planar process and mounted in a 14-PIN package for use as steering diodes protecting up to seven I/O ports from ESD, EFT, or surge by directing them either to the positive side of the power supply line or to ground see figure An external TVS diode may be added between the positive supply line and ground to prevent overvoltage on the supply rail. They may also be used in fast switching core-driver applications. This includes computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding applications. These arrays offer many advantages of integrated circuits such as high-density packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user friendly in PC board mounting. They are available with either Tin-Lead plating terminations or as RoHS Compliant with annealed matte-Tin finish by adding an “e3” suffix to the part number. IMPORTANT For the most current data, consult MICROSEMI’s website: Top Viewing Pin Layout • 7 Diode Array / protects 7 lines • Molded 14-Pin SOIC Package • UL 94V-0 Flammability Classification • Low Capacitance pF per diode • Switching speeds less than 5 ns • RoHS Compliant devices available by adding “e3” suffix • IEC 61000-4 compatible 61000-4-2 ESD Air 15kV, contact 8 kV 61000-4-4 EFT 40A 5/50 ns 61000-4-5 surge 12A, 8/20 µs APPLICATIONS / BENEFITS • Low capacitance steering diode protection for high frequency data lines • RS-232 & RS-422 Interface Networks • Ethernet 10 Base T • Computer I / O Ports • LAN • Switching Core Drivers MAXIMUM RATINGS • Operating Temperature -55°C to +150°C • Storage Temperature -55°C to +150°C • Forward Surge Current 2 Amps ms 12 Amps 8/20 µs • Continuous Forward Current 400 mA one diode • Power Dissipation PD 1500 mW total • Solder Temperature 260°C for 10 s maximum MECHANICAL AND PACKAGING • CASE Void-free transfer molded thermosetting epoxy body meeting UL94V-0 flammability classification • TERMINALS Tin-Lead or RoHS Compliant annealed matte-Tin plating solderable per MIL-STD750 method 2026 • MARKING MSC logo, MMAD1107 or MMAD1107e3 and date code. Pin #1 is to the left of the dot or indent on top of package • WEIGHT grams approximate • Tape & Reel packaging 2500 pcs STANDARD • Carrier tube packaging 55 pcs ELECTRICAL CHARACTERISTICS PER LINE 25°C Unless otherwise specified BREAKDOWN VOLTAGE VBR IBR =100µA WORKING PEAK VRWM V LEAKAGE CURRENT IR TA = 25°C LEAKAGE CURRENT IR TA = 150°C CAPACITANCE TIME trr FORWARD VOLTAGE VF IF = 10 mA FORWARD VOLTAGE VF IF = 100 mA MMAD1109 MMAD1109e3 Microsemi

PDF Datasheet Preview

SCOTTSDALE DIVISION

MMAD1109 and MMAD1109e3

Switching Diode Array Steering Diode TVS Array
.COM

APPEARANCE

These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated by a planar process and mounted in a 14-PIN package for use as steering diodes protecting up to seven I/O ports from ESD, EFT, or surge by directing them either to the positive side of the power supply line or to ground see figure An external TVS diode may be added between the positive supply line and ground to prevent overvoltage on the supply rail. They may also be used in fast switching core-driver applications. This includes computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding applications. These arrays offer many advantages of integrated circuits such as high-density packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user friendly in PC board mounting. They are available with either Tin-Lead plating terminations or as RoHS Compliant with annealed matte-Tin finish by adding an “e3” suffix to the part number.

IMPORTANT For the most current data, consult MICROSEMI’s website:

Top Viewing Pin Layout
• 7 Diode Array / protects 7 lines
• Molded 14-Pin SOIC Package
• UL 94V-0 Flammability Classification
• Low Capacitance pF per diode
• Switching speeds less than 5 ns
• RoHS Compliant devices available by adding “e3” suffix
• IEC 61000-4 compatible
61000-4-2 ESD Air 15kV, contact 8 kV 61000-4-4 EFT 40A 5/50 ns
61000-4-5 surge 12A, 8/20 µs

APPLICATIONS / BENEFITS
• Low capacitance steering diode protection for high frequency data lines
• RS-232 & RS-422 Interface Networks
• Ethernet 10 Base T
• Computer I / O Ports
• LAN
• Switching Core Drivers

MAXIMUM RATINGS
• Operating Temperature -55°C to +150°C
• Storage Temperature -55°C to +150°C
• Forward Surge Current 2 Amps ms
12 Amps 8/20 µs
• Continuous Forward Current 400 mA one diode
• Power Dissipation PD 1500 mW total
• Solder Temperature 260°C for 10 s maximum

MECHANICAL AND PACKAGING
• CASE Void-free transfer molded thermosetting epoxy body meeting UL94V-0 flammability classification
• TERMINALS Tin-Lead or RoHS Compliant annealed matte-Tin plating solderable per MIL-STD750 method 2026
• MARKING MSC logo, MMAD1107 or MMAD1107e3 and date code. Pin #1 is to the left of the dot or indent on top of package
• WEIGHT grams approximate
• Tape & Reel packaging 2500 pcs STANDARD
• Carrier tube packaging 55 pcs

ELECTRICAL CHARACTERISTICS PER LINE 25°C Unless otherwise specified

BREAKDOWN VOLTAGE VBR

IBR =100µA

WORKING PEAK

VRWM V

LEAKAGE CURRENT

IR TA = 25°C

LEAKAGE CURRENT

IR TA = 150°C

CAPACITANCE

TIME trr

FORWARD VOLTAGE

VF IF = 10 mA

FORWARD VOLTAGE

VF IF = 100 mA

MMAD1109 MMAD1109e3

Microsemi

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Datasheet ID: MMAD1109E3/TR13 649065