LE57D111BTCT

LE57D111BTCT Datasheet

Le5711

Part	Datasheet
LE57D111BTCT	LE57D111BTCT (pdf)

Related Parts	Information
LE57D111BTC	LE57D111BTC

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Le5711 Dual Subscriber Line Interface Circuit VE580 Series Data Sheet • Dual-channel SLIC device with small footprint • On-chip Thermal Management TMG feature in Polarity , Standby, and Disconnect • On-hook transmission • Low standby power • to V battery operation • Two-wire impedance set by single external impedance • Device level thermal shutdown • Set on-chip constant-current feed • Programmable ring-trip detect threshold • Only +5 V and battery supply required • Ideal for low cost, high performance linecard applications CO, DLC • Meets requirements for countries such as China, Korea, Japan, Taiwan, and Australia • Fulfills the following China specifications GF0029002.1 TMG2 C22 C12 DET2 CAS IREF DET1 C21 C11 TMG1 Document ID# 081132 Version 5 June 2011 Ordering Information Le57D111BTC 44-pin eTQFP Green 1 Tray2 The green package meets RoHS Directive 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment. For delivery using a tape and reel packing system, add a "T" suffix to the OPN Ordering Part Number when placing an order. the Zarlink QLSLAC device, another member of the VE580 series, combined with the Le5711 device provides a programmable line circuit that can be configured for varying requirements. Related Literature • 080753 Le58QL02/021/031 QLSLAC Data Sheet • 080754 Le58QL061/063 QLSLAC Data Sheet • 080748 Le5711 Evaluation Board User’s Guide The innovative Le5711 dual-channel SLIC device is designed for high-density POTS applications requiring a small footprint SLIC device with significant power savings. By combining the line interface of two channels into one SLIC device, the Le5711 device enables the design of a low cost, high performance, and fully programmable line interface for multiple country applications worldwide. The on-chip Thermal Management TMG feature allows for significantly reduced power dissipation on the device. The Le5711 device is offered in a space-saving package type, 44pin eTQFP. The small footprint of the SLIC device allows designers to save board space, increasing the density of lines on the board. The Le5711 device is also designed to significantly reduce the number of external components required for linecard design. Zarlink offers a range of compatible codec/filters that perform the codec function in a line card. In particular A2 TIP HP2 B2 RING VTX2 RSN2 BGND2 Signal Transmission Off-Hook Detector Power Feed Controller Ring Trip Detector Ring Trip Detector Power Feed Controller Off-Hook Detector Signal Transmission CH2 2-W Interface CH2 Input Decoder and Control Common Bias CH1 Input Decoder and Control CH1 2-W Interface A1 TIP HP1 B1 RING VTX1 RSN1 BGND1 VBAT CDC2 DB2 DAC DB1 CDC1 VCC AGND/ DGND Figure 1 - Block Diagram Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2007-2011, Zarlink Semiconductor Inc. All Rights Reserved. Le5711 Below are the changes from the September 2007 version to the June 2011 version. Item Ordering Information Description Obsoleted Le57D111DJC package. Data Sheet Zarlink Semiconductor Inc. Le5711 Data Sheet Table of Contents Product Description. 5 Block Descriptions 5 Two-Wire Interface 5 Signal Transmission 5 Power Feed Controller and Common Bias 5 Input Decoder and Control 5 Off-Hook Detector 5 Ring-Trip Detector 5 Connection Diagrams 6 Pin Descriptions. 7 Electrical Characteristics 9 Absolute Maximum Ratings. 9 Operating Ranges 10 Specifications. 11 Transmission Performance 11 Crosstalk Between Channels 11 Longitudinal Capability 11 Insertion Loss 12 Line Characteristics 13 Power Supply Rejection Ratio at the Two-Wire Interface, Active Normal State 13 Power Dissipation 13 Supply Currents 13 RFI Rejection. 14 Logic Inputs 14 Logic Output 14 Ring-Trip Detector Input 14 Loop Detector 15 SLIC Device Decoding 15 User-Programmable Components. 16 DC Feed Characteristics 17 Test Circuits. 18 Application Circuit 21 Line card Parts List 22 Physical Dimensions 23 44-Pin eTQFP 23 Zarlink Semiconductor Inc. Le5711 Data Sheet List of Figures Figure 1 - Block Diagram 1 Figure 2 - Feed Programming 18 Figure 3 - Two-to-Four Wire Insertion Loss 18 Figure 4 - Four-to-Two Wire Insertion Loss and Balance Return Signals 18 Figure 5 - Longitudinal Balance 19 Figure 6 - Two-Wire Return Loss Test Circuit 19 Figure 7 - RFI Test Circuit 19 Figure 8 - Le5711 Test Circuit 20 Zarlink Semiconductor Inc. Le5711 Data Sheet Product Description Block Descriptions Two-Wire Interface The two-wire interfaces provide DC current and send voice signals to a telephone apparatus connected to the linecard with a two-wire line. The two-wire interface also receives the returning voice signals from the telephone transmitter. Signal Transmission The RSN input current controls the receive current sent to the two-wire interface. The AC line voltage is sensed by a differential amplifier between the Ai TIP and HPi leads.* The output of this amplifier is equal to the AC metallic components of the line voltages and is output at VTXi. The transmission circuit also contains a longitudinal feedback circuit to shunt longitudinal signals to a DC bias voltage. The longitudinal feedback does not affect metallic signals. *Note "i" denotes channel number Power Feed Controller and Common Bias Input Decoder and Control Off-Hook Detector Ring-Trip Detector In the Disconnect state, the ring-trip detector is active. While the DBi pin is more negative than the DAC pin, the DET pin will be high to indicate on hook. When an off hook condition occurs, the DBi pin becomes more positive than the DAC pin, and the DET pin will go low to indicate off hook during ringing ring-trip has been detected. The system implements the Ringing state using external control of a ring relay in combination with the Disconnect SLIC state, which enables the ring-trip detector. Zarlink Semiconductor Inc. Connection Diagrams Le5711 Data Sheet DET 1 CDC 1 RSN 1 NC VTX 1 NC RSVD

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Le5711

Dual Subscriber Line Interface Circuit VE580 Series Data Sheet
• Dual-channel SLIC device with small footprint
• On-chip Thermal Management TMG feature in

Polarity , Standby, and Disconnect
• On-hook transmission
• Low standby power
• to V battery operation
• Two-wire impedance set by single external
impedance
• Device level thermal shutdown
• Set on-chip constant-current feed
• Programmable ring-trip detect threshold
• Only +5 V and battery supply required
• Ideal for low cost, high performance linecard applications CO, DLC
• Meets requirements for countries such as China, Korea, Japan, Taiwan, and Australia
• Fulfills the following China specifications GF0029002.1

TMG2 C22 C12 DET2 CAS IREF DET1 C21 C11 TMG1

Document ID# 081132

Version 5

June 2011
Ordering Information

Le57D111BTC 44-pin eTQFP Green 1 Tray2

The green package meets RoHS Directive 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment.
For delivery using a tape and reel packing system, add a "T" suffix to the OPN Ordering Part Number when placing an order.
the Zarlink QLSLAC device, another member of the VE580 series, combined with the Le5711 device provides a programmable line circuit that can be configured for varying requirements.

Related Literature
• 080753 Le58QL02/021/031 QLSLAC Data Sheet
• 080754 Le58QL061/063 QLSLAC Data Sheet
• 080748 Le5711 Evaluation Board User’s Guide

The innovative Le5711 dual-channel SLIC device is designed for high-density POTS applications requiring a small footprint SLIC device with significant power savings. By combining the line interface of two channels into one SLIC device, the Le5711 device enables the design of a low cost, high performance, and fully programmable line interface for multiple country applications worldwide. The on-chip Thermal Management TMG feature allows for significantly reduced power dissipation on the device. The Le5711 device is offered in a space-saving package type, 44pin eTQFP. The small footprint of the SLIC device allows designers to save board space, increasing the density of lines on the board. The Le5711 device is also designed to significantly reduce the number of external components required for linecard design.

Zarlink offers a range of compatible codec/filters that perform the codec function in a line card. In particular

A2 TIP HP2

B2 RING

VTX2 RSN2 BGND2

Signal Transmission

Off-Hook Detector Power Feed Controller Ring Trip Detector Ring Trip Detector Power Feed Controller Off-Hook Detector

Signal Transmission

CH2 2-W Interface

CH2 Input Decoder and Control

Common Bias

CH1 Input Decoder and Control

CH1 2-W Interface

A1 TIP HP1 B1 RING

VTX1

RSN1 BGND1

VBAT CDC2

DB2 DAC DB1 CDC1 VCC AGND/ DGND

Figure 1 - Block Diagram

Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.

Copyright 2007-2011, Zarlink Semiconductor Inc. All Rights Reserved.

Le5711

Below are the changes from the September 2007 version to the June 2011 version.
Item Ordering Information

Description Obsoleted Le57D111DJC package.

Data Sheet

Zarlink Semiconductor Inc.

Le5711

Data Sheet

Table of Contents

Product Description. 5

Block Descriptions 5 Two-Wire Interface 5 Signal Transmission 5 Power Feed Controller and Common Bias 5 Input Decoder and Control 5 Off-Hook Detector 5 Ring-Trip Detector 5

Connection Diagrams 6

Pin Descriptions. 7

Electrical Characteristics 9 Absolute Maximum Ratings. 9 Operating Ranges 10

Specifications. 11 Transmission Performance 11 Crosstalk Between Channels 11 Longitudinal Capability 11 Insertion Loss 12 Line Characteristics 13 Power Supply Rejection Ratio at the Two-Wire Interface, Active Normal State 13 Power Dissipation 13 Supply Currents 13 RFI Rejection. 14 Logic Inputs 14 Logic Output 14 Ring-Trip Detector Input 14 Loop Detector 15 SLIC Device Decoding 15 User-Programmable Components. 16 DC Feed Characteristics 17 Test Circuits. 18

Application Circuit 21

Line card Parts List 22

Physical Dimensions 23 44-Pin eTQFP 23

Zarlink Semiconductor Inc.

Le5711

Data Sheet

List of Figures

Figure 1 - Block Diagram 1 Figure 2 - Feed Programming 18 Figure 3 - Two-to-Four Wire Insertion Loss 18 Figure 4 - Four-to-Two Wire Insertion Loss and Balance Return Signals 18 Figure 5 - Longitudinal Balance 19 Figure 6 - Two-Wire Return Loss Test Circuit 19 Figure 7 - RFI Test Circuit 19 Figure 8 - Le5711 Test Circuit 20

Zarlink Semiconductor Inc.

Le5711

Data Sheet

Product Description

Block Descriptions

Two-Wire Interface

The two-wire interfaces provide DC current and send voice signals to a telephone apparatus connected to the linecard with a two-wire line. The two-wire interface also receives the returning voice signals from the telephone transmitter.

Signal Transmission

The RSN input current controls the receive current sent to the two-wire interface. The AC line voltage is sensed by a differential amplifier between the Ai TIP and HPi leads.* The output of this amplifier is equal to the AC metallic components of the line voltages and is output at VTXi. The transmission circuit also contains a longitudinal feedback circuit to shunt longitudinal signals to a DC bias voltage. The longitudinal feedback does not affect metallic signals.
*Note "i" denotes channel number

Power Feed Controller and Common Bias

Input Decoder and Control

Off-Hook Detector

Ring-Trip Detector

In the Disconnect state, the ring-trip detector is active. While the DBi pin is more negative than the DAC pin, the DET pin will be high to indicate on hook. When an off hook condition occurs, the DBi pin becomes more positive than the DAC pin, and the DET pin will go low to indicate off hook during ringing ring-trip has been detected. The system implements the Ringing state using external control of a ring relay in combination with the Disconnect SLIC state, which enables the ring-trip detector.

Zarlink Semiconductor Inc.

Connection Diagrams

Le5711

Data Sheet

DET 1 CDC 1 RSN 1 NC VTX 1 NC RSVD

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Datasheet ID: LE57D111BTCT 648970