JANTXV1N6642

JANTXV1N6642 Datasheet


• JEDEC registered 1N6638, 1N6642, and 1N6643.<br>• Ultra fast recovery time.<br>• Very low capacitance.<br>• Metallurgically bonded.<br>• Non-cavity glass package.<br>• JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/578.<br>• Replacements for 1N4148, 1N4148-1, 1N4150, 1N4150-1, and 1N914.<br>• RoHS compliant devices available commercial grade only .

Part Datasheet
JANTXV1N6642 JANTXV1N6642 JANTXV1N6642 (pdf)
PDF Datasheet Preview
1N6638, 1N6642, 1N6643

Available on commercial
versions

VOIDLESS HERMETICALLY SEALED SWITCHING DIODES

Qualified per MIL-PRF-19500/578

These popular JEDEC registered switching/signal diodes are military qualified and available with internal metallurgical bonded construction. These small low capacitance diodes with very fast switching speeds are hermetically sealed and bonded into a “D” package. They may be used in a variety of fast switching applications including computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, as well as decoding or encoding applications, etc. Microsemi also offers a variety of other switching/signal diodes.

Important For the latest information, visit our website
• JEDEC registered 1N6638, 1N6642, and 1N6643.
• Ultra fast recovery time.
• Very low capacitance.
• Metallurgically bonded.
• Non-cavity glass package.
• JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/578.
• Replacements for 1N4148, 1N4148-1, 1N4150, 1N4150-1, and 1N914.
• RoHS compliant devices available commercial grade only .

Qualified Levels JAN, JANTX,

JANTXV and JANS
“D” Package

APPLICATIONS / BENEFITS
• Small size for high density mounting using flexible thru-hole leads see package illustration .
• Ideal for:

High frequency data lines RS-232 & Interface Networks Ethernet 10 Base T Switching core drivers LAN Computers

MAXIMUM RATINGS TA = +25 oC unless otherwise noted.

Also available in:
“B” SQ MELF or D-5B Package
surface mount 1N6638US_42US_43US

Parameters/Test Conditions

Value

Unit

Junction and Storage Temp Thermal Resistance Junction-to-Lead = inch 1 Thermal Resistance Junction-to-Ambient 1 Peak Forward Surge Current TA = +25 oC

Test pulse = ms, half-sine wave. Average Rectified Forward Current TA = +75 oC Derate at mA/oC above TL = +75 oC L = 3/8”

TJ and TSTG IFSM
-65 to +175 150 250
oC/W oC/W

Breakdown Voltage:
1N6638
1N6642
1N6643
1N6638 1N6642

VRWM
1N6643

NOTES TA = +75 °C on printed circuit board PCB , PCB = FR4 - inch mm 1-layer 1-Oz Cu, horizontal, in still air pads for axial = inch mm diameter, strip = inch mm x 1 inch mm long, lead length L inch mm RΘJA with a defined PCB thermal resistance condition included, is measured at IO = 300 mA.

MSC Lawrence 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 Tel 978 620-2600 Fax 978 689-0803

MSC Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel +353 0 65 6840044 Fax +353 0 65 6822298

Website:
2011 Microsemi Corporation

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1N6638, 1N6642, 1N6643

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Datasheet ID: JANTXV1N6642 648571