MT9JSF12872AY-1G4D1

MT9JSF12872AY-1G4D1 Datasheet

MT9JSF12872A 1GB

Part	Datasheet
MT9JSF12872AY-1G4D1	MT9JSF12872AY-1G4D1 (pdf)

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1GB x72, ECC, SR 240-Pin DDR3 SDRAM UDIMM Features DDR3 SDRAM UDIMM MT9JSF12872A 1GB For component data sheets, refer to Micron’s Web site: • DDR3 functionality and operations supported as per the component data sheet • 240-pin, unbuffered dual in-line memory module UDIMM • Fast data transfer rates PC3-10600, PC3-8500, or PC3-6400 • 1GB 128 Meg x 72 • VDD = 1.5V ±0.075V • VDDSPD = +3.0V to +3.6V • Supports ECC error detection and correction • Nominal and dynamic on-die termination ODT for data, strobe, and mask signals • Single rank • On-board I2C temperature sensor with integrated serial presence-detect SPD EEPROM • 8 internal device banks • Fixed burst chop BC of 4 and burst length BL of 8 via the mode register set MRS • Selectable BC4 or BL8 on-the-fly OTF • Gold edge contacts • Pb-free • Fly-by topology • Terminated control, command, and address bus Figure 1 240-Pin UDIMM MO-269 R/C D PCB height 30.0mm 1.181in Options • Operating temperature1 Commercial 0°C TA +70°C Industrial TA +85°C • Package 240-pin DIMM • Frequency/CAS latency 1.5ns CL = 8 DDR3-1333 1.5ns CL = 9 DDR3-1333 1.5ns CL = 10 DDR3-1333 2 1.87ns CL = 7 DDR3-1066 1.87ns CL = 8 DDR3-1066 2.5ns CL = 5 DDR3-800 2.5ns CL = 6 DDR3-800 2 Marking None I -1G5 -1G4 -1G3 -1G1 -1G0 -80C -80B Notes Contact Micron for industrial temperature module offerings. Not recommended for new designs. Table 1 Key Timing Parameters Speed Grade -1G5 -1G4 -1G3 -1G1 -1G0 -80C -80B Industry Nomenclature PC3-10600 PC3-10600 PC3-10600 PC3-8500 PC3-8500 PC3-6400 PC3-6400 CL = 10 1333 CL = 9 1333 Data Rate MT/s CL = 8 1333 1066 CL = 7 1066 1066

PDF Datasheet Preview

1GB x72, ECC, SR 240-Pin DDR3 SDRAM UDIMM Features

DDR3 SDRAM UDIMM

MT9JSF12872A 1GB

For component data sheets, refer to Micron’s Web site:
• DDR3 functionality and operations supported as per the component data sheet
• 240-pin, unbuffered dual in-line memory module UDIMM
• Fast data transfer rates PC3-10600, PC3-8500, or PC3-6400
• 1GB 128 Meg x 72
• VDD = 1.5V ±0.075V
• VDDSPD = +3.0V to +3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination ODT for
data, strobe, and mask signals
• Single rank
• On-board I2C temperature sensor with integrated
serial presence-detect SPD EEPROM
• 8 internal device banks
• Fixed burst chop BC of 4 and burst length BL of 8
via the mode register set MRS
• Selectable BC4 or BL8 on-the-fly OTF
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus

Figure 1 240-Pin UDIMM MO-269 R/C D PCB height 30.0mm 1.181in

Options
• Operating temperature1

Commercial 0°C TA +70°C Industrial TA +85°C
• Package
240-pin DIMM
• Frequency/CAS latency
1.5ns CL = 8 DDR3-1333
1.5ns CL = 9 DDR3-1333 1.5ns CL = 10 DDR3-1333 2
1.87ns CL = 7 DDR3-1066
1.87ns CL = 8 DDR3-1066 2.5ns CL = 5 DDR3-800 2.5ns CL = 6 DDR3-800 2

Marking

None I
-1G5 -1G4 -1G3 -1G1 -1G0 -80C -80B

Notes Contact Micron for industrial temperature module offerings.

Not recommended for new designs.

Table 1 Key Timing Parameters

Speed Grade
-1G5 -1G4 -1G3 -1G1 -1G0 -80C -80B

Industry Nomenclature

PC3-10600 PC3-10600 PC3-10600 PC3-8500 PC3-8500 PC3-6400 PC3-6400

CL = 10
1333

CL = 9
1333

Data Rate MT/s

CL = 8
1333 1066

CL = 7
1066
1066

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Datasheet ID: MT9JSF12872AY-1G4D1 648501