MT72JSZS4G72LZ-1G9E2C3

MT72JSZS4G72LZ-1G9E2C3 Datasheet

MT72JSZS4G72LZ 32GB

Part	Datasheet
MT72JSZS4G72LZ-1G9E2C3	MT72JSZS4G72LZ-1G9E2C3 (pdf)

PDF Datasheet Preview
32GB x72, ECC, QR 240-Pin DDR3 LRDIMM Features DDR3 SDRAM LRDIMM MT72JSZS4G72LZ 32GB • 240-pin, load-reduced dual in-line memory module LRDIMM • Memory buffer MB isolates DRAM interface from card edge • Single-load for all data, command, control, address, and clock signals • Rank multiplication providing access to 4 physical ranks • Fast data transfer rates PC3-14900 • 32GB 4 Gig x 72 • VDD = 1.5V ±0.075V • VDDSPD = • Supports ECC error detection and correction • Nominal and dynamic on-die termination ODT for data and strobe signals • Quad-rank, using 8Gb TwinDie devices • 8 internal device banks • Fixed burst chop BC of 4 and burst length BL of 8 via the mode register set MRS • Two on-board temperature sensors • Gold edge contacts • Full module heat spreader • Halogen-free • Terminated control, command, and address bus Figure 1 240-Pin LRDIMM MO-269 RC/C Module Height 30.35mm in. Options • Operating temperature Commercial 0°C TC +95°C • Package 240-pin DIMM halogen-free • Frequency/CAS latency 1.07ns CL = 13 DDR3-1866 Marking None Z -1G9 Table 1 Key Timing Parameters Speed Industry Grade Nomenclature -1G9 PC3-14900 -1G6 PC3-12800 -1G4 PC3-10600 -1G1 PC3-8500 -1G0 PC3-8500 -80B PC3-6400 CL = 13 1866 CL = 11 1600 Data Rate MT/s CL = 10 CL = 9 CL = 8 CL = 7 1333 1066 1333 1066 1333 1066 1066

PDF Datasheet Preview

32GB x72, ECC, QR 240-Pin DDR3 LRDIMM Features

DDR3 SDRAM LRDIMM

MT72JSZS4G72LZ 32GB
• 240-pin, load-reduced dual in-line memory module LRDIMM
• Memory buffer MB isolates DRAM interface from card edge
• Single-load for all data, command, control, address, and clock signals
• Rank multiplication providing access to 4 physical ranks
• Fast data transfer rates PC3-14900
• 32GB 4 Gig x 72
• VDD = 1.5V ±0.075V
• VDDSPD =
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination ODT for
data and strobe signals
• Quad-rank, using 8Gb TwinDie devices
• 8 internal device banks
• Fixed burst chop BC of 4 and burst length BL of 8
via the mode register set MRS
• Two on-board temperature sensors
• Gold edge contacts
• Full module heat spreader
• Halogen-free
• Terminated control, command, and address bus

Figure 1 240-Pin LRDIMM MO-269 RC/C

Module Height 30.35mm in.

Options
• Operating temperature Commercial 0°C TC +95°C
• Package 240-pin DIMM halogen-free
• Frequency/CAS latency 1.07ns CL = 13 DDR3-1866

Marking

None Z
-1G9

Table 1 Key Timing Parameters

Speed Industry Grade Nomenclature
-1G9

PC3-14900
-1G6

PC3-12800
-1G4

PC3-10600
-1G1

PC3-8500
-1G0

PC3-8500
-80B

PC3-6400

CL = 13 1866

CL = 11 1600

Data Rate MT/s

CL = 10 CL = 9 CL = 8 CL = 7
1333 1066
1333 1066
1333 1066
1066

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Datasheet ID: MT72JSZS4G72LZ-1G9E2C3 648478