MT16VDDT6464AG-335GB

MT16VDDT6464AG-335GB Datasheet

MT16VDDT3264A 256MB

Part	Datasheet
MT16VDDT6464AG-335GB	MT16VDDT6464AG-335GB (pdf)

Related Parts	Information
MT16VDDT6464AY-335K1	MT16VDDT6464AY-335K1
MT16VDDT6464AG-335G6	MT16VDDT6464AG-335G6
MT16VDDT6464AY-335G6	MT16VDDT6464AY-335G6
MT16VDDT12864AY-335F3	MT16VDDT12864AY-335F3
MT16VDDT12864AG-335F3	MT16VDDT12864AG-335F3
MT16VDDT12864AY-335DB	MT16VDDT12864AY-335DB
MT16VDDT6464AG-262G4	MT16VDDT6464AG-262G4
MT16VDDT6464AG-265GB	MT16VDDT6464AG-265GB
MT16VDDT6464AG-26AG4	MT16VDDT6464AG-26AG4
MT16VDDT12864AG-335D3	MT16VDDT12864AG-335D3
MT16VDDT12864AY-335F2	MT16VDDT12864AY-335F2
MT16VDDT12864AG-335F2	MT16VDDT12864AG-335F2

PDF Datasheet Preview
256MB, 512MB, 1GB, 2GB x64, DR 184-PIN DDR SDRAM UDIMM DDR SDRAM UNBUFFERED DIMM MT16VDDT3264A 256MB MT16VDDT6464A 512MB MT16VDDT12864A MT16VDDT25664A 1GB 2GB For the latest data sheet, please refer to the Web site: • 184-pin, dual in-line memory module DIMM • Fast data transfer rates PC2100 or PC2700 • Utilizes 266 MT/s and 333 MT/s DDR SDRAM components • 256MB 32 Meg x 64 , 512MB 64 Meg x 64 , 1GB 128 Meg x 64 , and 2GB 256 Meg x 64 • VDD = VDDQ = +2.5V • VDDSPD = +2.3V to +3.6V • 2.5V I/O SSTL_2 compatible • Commands entered on each positive CK edge • DQS edge-aligned with data for READs center- aligned with data for WRITEs • Internal, pipelined double data rate DDR architecture two data accesses per clock cycle • Bidirectional data strobe DQS transmitted/ received with source-synchronous data capture • Differential clock inputs CK and CK# • Four internal device banks for concurrent operation • Programmable burst lengths 2, 4, or 8 • Auto precharge option • Auto Refresh and Self Refresh Modes • 15.6µs 256MB , 7.8125µs 512MB, 1GB, and 2GB maximum average periodic refresh interval • Serial Presence Detect SPD with EEPROM • Programmable READ CAS latency • Gold edge contacts Figure 1 184-Pin DIMM MO-206 Standard 1.25in. 31.75mm Low-Profile 1.15in. 29.21mm OPTIONS MARKING • Package 184-pin DIMM standard 184-pin DIMM lead-free 1 • Memory Clock, Speed, CAS Latency2 6ns/166MHz 333 MT/s CL = 7.5ns/133 MHz 266 MT/s CL = 2 7.5ns/133 MHz 266 MT/s CL = 2 -335 -2621 -26A1 7.5ns/133 MHz 266 MT/s CL = -265 • PCB Standard 1.25in. 31.75mm See page 2 note Low-Profile 1.20in. 30.48mm See page 2 note NOTE Consult Micron for product availability. CL = CAS READ Latency. Table 1 Address Table Refresh Count Row Addressing Device Bank Addressing Device Configuration Column Addressing Module Rank Addressing 256MB 4K 4 BA0, BA1 128Mb 16 Meg x 8 1K 2 S0#, S1# 512MB 8K 4 BA0, BA1 256Mb 32 Meg x 8 1K 2 S0#, S1# 8K 4 BA0, BA1 512Mb 64 Meg x 8 2K A11 2 S0#, S1# The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Table 6, Burst Definition Table, on page Burst Length Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable, as shown in Figure 5, Mode Register Definition Diagram. The burst length determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 2, 4, or 8 locations are available for both the sequential and the interleaved burst types. Reserved states should not be used, as unknown operation or incompatibility with future versions may result. When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by when the burst length is set to two, by A2-Ai when the burst length is set to four and by A3Ai when the burst length is set to eight where Ai is the most significant column address bit for a given configuration see Note 5, of Table 6, Burst Definition Table, on page The remaining least significant address bit s is are used to select the starting location within the block. The programmed burst length applies to both READ and WRITE bursts. Read Latency The READ latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first bit of output data. The latency can be set to 2 or clocks, as shown in Figure 6, CAS Latency Diagram. 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Mode Register Mx 0* 0* Operating Mode CAS Latency BT Burst Length * M13 and M12 BA0 and BA1 must be “0, 0” to select the base mode register vs. the extended mode register . 512MB and 1GB Modules BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Mode Register Mx 0* 0* Operating Mode CAS Latency BT Burst Length * M14 and M13 BA0 and BA1 must be “0, 0” to select the base mode register vs. the extended mode register . 2GB Module BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Mode Register Mx 0* 0* Operating Mode CAS Latency BT Burst Length * M15 and M14 BA1 and BA0 must be “0, 0” to select the base mode register vs. the extended mode register . Burst Length M2 M1 M0 0 00 0 01 0 10 0 11 1 00 1 01 1 10 1 11 M3 = 0 Reserved 2 4 8 Reserved Burst Type Sequential Interleaved M6 M5 M4 000 001 010 011 100 101 110 111 CAS Latency Reserved 2 Reserved M13 M12 M11 M10 M9 M8 M7 0 00 0 10 - - - - - -- M6-M0 Valid Operating Mode Normal Operation Normal Operation/Reset DLL All other states reserved Micron Technology, Inc., reserves the right to change products or specifications without notice. 2004 Micron Technology, Inc. 256MB, 512MB, 1GB, 2GB x64, DR 184-PIN DDR SDRAM UDIMM Table 6 Burst Definition Table STARTING BURST COLUMN LENGTH ADDRESS ORDER OF ACCESSES WITHIN A BURST TYPE = TYPE = SEQUENTIAL INTERLEAVED A1 A0

PDF Datasheet Preview

256MB, 512MB, 1GB, 2GB x64, DR 184-PIN DDR SDRAM UDIMM

DDR SDRAM UNBUFFERED DIMM

MT16VDDT3264A 256MB

MT16VDDT6464A 512MB

MT16VDDT12864A MT16VDDT25664A
1GB 2GB

For the latest data sheet, please refer to the Web
site:
• 184-pin, dual in-line memory module DIMM
• Fast data transfer rates PC2100 or PC2700
• Utilizes 266 MT/s and 333 MT/s DDR SDRAM
components
• 256MB 32 Meg x 64 , 512MB 64 Meg x 64 , 1GB
128 Meg x 64 , and 2GB 256 Meg x 64
• VDD = VDDQ = +2.5V
• VDDSPD = +2.3V to +3.6V
• 2.5V I/O SSTL_2 compatible
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs center-
aligned with data for WRITEs
• Internal, pipelined double data rate DDR
architecture two data accesses per clock cycle
• Bidirectional data strobe DQS transmitted/
received with source-synchronous data capture
• Differential clock inputs CK and CK#
• Four internal device banks for concurrent operation
• Programmable burst lengths 2, 4, or 8
• Auto precharge option
• Auto Refresh and Self Refresh Modes
• 15.6µs 256MB , 7.8125µs 512MB, 1GB, and 2GB maximum average periodic refresh interval
• Serial Presence Detect SPD with EEPROM
• Programmable READ CAS latency
• Gold edge contacts

Figure 1 184-Pin DIMM MO-206

Standard 1.25in. 31.75mm

Low-Profile 1.15in. 29.21mm

OPTIONS

MARKING
• Package
184-pin DIMM standard
184-pin DIMM lead-free 1
• Memory Clock, Speed, CAS Latency2
6ns/166MHz 333 MT/s CL = 7.5ns/133 MHz 266 MT/s CL = 2 7.5ns/133 MHz 266 MT/s CL = 2
-335 -2621 -26A1
7.5ns/133 MHz 266 MT/s CL =
-265
• PCB

Standard 1.25in. 31.75mm

See page 2 note

Low-Profile 1.20in. 30.48mm

See page 2 note

NOTE Consult Micron for product availability.

CL = CAS READ Latency.

Table 1 Address Table

Refresh Count Row Addressing Device Bank Addressing Device Configuration Column Addressing Module Rank Addressing
256MB
4K 4 BA0, BA1 128Mb 16 Meg x 8 1K 2 S0#, S1#
512MB
8K 4 BA0, BA1 256Mb 32 Meg x 8 1K 2 S0#, S1#
8K 4 BA0, BA1 512Mb 64 Meg x 8 2K A11 2 S0#, S1#
The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Table 6, Burst Definition Table, on page

Burst Length

Read and write accesses to the DDR SDRAM are burst oriented, with the burst length being programmable, as shown in Figure 5, Mode Register Definition Diagram. The burst length determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 2, 4, or 8 locations are available for both the sequential and the interleaved burst types.

Reserved states should not be used, as unknown operation or incompatibility with future versions may result.

When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by when the burst length is set to two, by A2-Ai when the burst length is set to four and by A3Ai when the burst length is set to eight where Ai is the most significant column address bit for a given configuration see Note 5, of Table 6, Burst Definition Table, on page The remaining least significant address bit s is are used to select the starting location within the block. The programmed burst length applies to both READ and WRITE bursts.

Read Latency

The READ latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first bit of output data. The latency can be set to 2 or clocks, as shown in Figure 6, CAS Latency Diagram.
13 12 11 10 9 8 7 6 5 4 3 2 1 0 Mode Register Mx 0* 0* Operating Mode CAS Latency BT Burst Length
* M13 and M12 BA0 and BA1 must be “0, 0” to select the base mode register vs. the extended mode register .
512MB and 1GB Modules

BA1 BA0 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus
14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Mode Register Mx 0* 0* Operating Mode CAS Latency BT Burst Length
* M14 and M13 BA0 and BA1 must be “0, 0” to select the base mode register vs. the extended mode register .
2GB Module

BA1 BA0 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Mode Register Mx
0* 0*

Operating Mode

CAS Latency BT Burst Length
* M15 and M14 BA1 and BA0 must be “0, 0” to select the base mode register vs. the extended mode register .

Burst Length

M2 M1 M0 0 00 0 01 0 10 0 11 1 00 1 01 1 10 1 11

M3 = 0 Reserved
2 4 8 Reserved

Burst Type

Sequential

Interleaved

M6 M5 M4 000 001 010 011 100 101 110 111

CAS Latency Reserved 2 Reserved

M13 M12 M11 M10 M9 M8 M7 0 00 0 10 - - - - - --

M6-M0 Valid

Operating Mode Normal Operation Normal Operation/Reset DLL All other states reserved

Micron Technology, Inc., reserves the right to change products or specifications without notice. 2004 Micron Technology, Inc.
256MB, 512MB, 1GB, 2GB x64, DR 184-PIN DDR SDRAM UDIMM

Table 6 Burst Definition Table

STARTING BURST COLUMN LENGTH ADDRESS

ORDER OF ACCESSES WITHIN A BURST

TYPE =

TYPE =

SEQUENTIAL INTERLEAVED

A1 A0

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MT16VDDT6464AG-335GB Datasheet file may be downloaded here without warranties.

Datasheet ID: MT16VDDT6464AG-335GB 648319