MT16JSF25664HY-1G4D1

MT16JSF25664HY-1G4D1 Datasheet

MT16JSF25664H 2GB

Part	Datasheet
MT16JSF25664HY-1G4D1	MT16JSF25664HY-1G4D1 (pdf)

PDF Datasheet Preview
2GB x64, DR 204-Pin DDR3 SDRAM SODIMM Features DDR3 SDRAM SODIMM MT16JSF25664H 2GB For component data sheets, refer to Micron’s Web site: • DDR3 functionality and operations supported as defined in the component data sheet • 204-pin, small-outline dual in-line memory module SODIMM • Fast data transfer rates PC3-10600, PC3-8500, or PC3-6400 • 2GB 256 Meg x 64 • VDD = 1.5V ±0.075V • VDDSPD = +3.0V to +3.6V • Nominal and dynamic on-die termination ODT for data, strobe, and mask signals • Dual rank • On-board I2C temperature sensor with integrated serial presence-detect SPD EEPROM • 8 internal device banks • Fixed burst chop BC of 4 and burst length BL of 8 via the mode register set MRS • Selectable BC4 or BL8 on-the-fly OTF • Gold edge contacts • Pb-free • Fly-by topology • Terminated control, command, and address bus Figure 1 204-Pin SODIMM MO-268 R/C F PCB height 30.0mm 1.181in Options Marking • Operating temperature1 Commercial 0°C TA +70°C Industrial TA +85°C • Package None I 204-pin DIMM • Frequency/CAS latency 1.5ns CL = 8 DDR3-1333 -1G5 1.5ns CL = 9 DDR3-1333 1.5ns CL = 10 DDR3-1333 2 -1G4 -1G3 1.87ns CL = 7 DDR3-1066 -1G1 1.87ns CL = 8 DDR3-1066 2.5ns CL = 5 DDR3-800 2.5ns CL = 6 DDR3-800 2 -1G0 -80C -80B Notes Contact Micron for industrial temperature module offerings. Not recommended for new designs. Table 1 Key Timing Parameters Speed Grade -1G5 -1G4 -1G3 -1G1 -1G0 -80C -80B Industry Nomenclature PC3-10600 PC3-10600 PC3-10600 PC3-8500 PC3-8500 PC3-6400 PC3-6400 CL = 10 1333 CL = 9 1333

PDF Datasheet Preview

2GB x64, DR 204-Pin DDR3 SDRAM SODIMM Features

DDR3 SDRAM SODIMM

MT16JSF25664H 2GB

For component data sheets, refer to Micron’s Web site:
• DDR3 functionality and operations supported as defined in the component data sheet
• 204-pin, small-outline dual in-line memory module SODIMM
• Fast data transfer rates PC3-10600, PC3-8500, or PC3-6400
• 2GB 256 Meg x 64
• VDD = 1.5V ±0.075V
• VDDSPD = +3.0V to +3.6V
• Nominal and dynamic on-die termination ODT for
data, strobe, and mask signals
• Dual rank
• On-board I2C temperature sensor with integrated
serial presence-detect SPD EEPROM
• 8 internal device banks
• Fixed burst chop BC of 4 and burst length BL of 8
via the mode register set MRS
• Selectable BC4 or BL8 on-the-fly OTF
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus

Figure 1 204-Pin SODIMM MO-268 R/C F

PCB height 30.0mm 1.181in

Options

Marking
• Operating temperature1

Commercial 0°C TA +70°C Industrial TA +85°C
• Package

None I
204-pin DIMM
• Frequency/CAS latency
1.5ns CL = 8 DDR3-1333
-1G5
1.5ns CL = 9 DDR3-1333 1.5ns CL = 10 DDR3-1333 2
-1G4 -1G3
1.87ns CL = 7 DDR3-1066
-1G1
1.87ns CL = 8 DDR3-1066 2.5ns CL = 5 DDR3-800 2.5ns CL = 6 DDR3-800 2
-1G0 -80C -80B

Notes Contact Micron for industrial temperature
module offerings.

Not recommended for new designs.

Table 1 Key Timing Parameters

Speed Grade
-1G5 -1G4 -1G3 -1G1 -1G0 -80C -80B

Industry Nomenclature

PC3-10600 PC3-10600 PC3-10600 PC3-8500 PC3-8500 PC3-6400 PC3-6400

CL = 10
1333

CL = 9
1333

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MT16JSF25664HY-1G4D1 Datasheet file may be downloaded here without warranties.

Datasheet ID: MT16JSF25664HY-1G4D1 648310