PCX755CVZFU400LE

PCX755CVZFU400LE Datasheet


PCX745

Part Datasheet
PCX755CVZFU400LE PCX755CVZFU400LE PCX755CVZFU400LE (pdf)
Related Parts Information
PCX755BVZFU300LE PCX755BVZFU300LE PCX755BVZFU300LE
PCX755BVZFU350LE PCX755BVZFU350LE PCX755BVZFU350LE
PCX745BVZFU300LE PCX745BVZFU300LE PCX745BVZFU300LE
PCX745BVZFU350LE PCX745BVZFU350LE PCX745BVZFU350LE
PDF Datasheet Preview
• 18.1SPECint95, Estimates SPECfp95 at 400 MHz PC755
• 15.7SPECint95, 9SPECfp95 at 350 MHz PC745
• 733 MIPS at 400 MHz PC755 at 641 MIPS at 350 MHz PC745
• Selectable Bus Clock 12 CPU Bus Dividers up to 10x
• PD Typical 6.4W at 400 MHz, Full Operating Conditions
• Nap, Doze and Sleep Modes for Power Savings
• Superscalar 3 Instructions per Clock Cycle Two Instruction + Branch
• 4 Beta Byte Virtual Memory, 4-GByte of Physical Memory
• 64-bit Data and 32-bit Address Bus Interface
• 32-KB Instruction and Data Cache
• Six Independent Execution Units
• Write-back and Write-through Operations
• fINT max = 400 MHz TBC
• fBUS max = 100 MHz
• Voltage I/O 2.5V/3.3V Voltage Int 2.0V

PowerPC 755/745 32-bit RISC Microprocessor

The PC755 and PC745 microprocessors are high-performance, lowpower, 32-bit implementations of the PowerPC Reduced Instruction Set Computer RISC architecture, especially enhanced for embedded applications.

The PC755 and PC745 microprocessors differ only in that the PC755 features an enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in replacement for the award winning PowerPC 750 microprocessor and is footprint and user software code compatible with the MPC7400 microprocessor with AltiVec technology. The PC745 is a drop-in replacement for the PowerPC 740 microprocessor and is also footprint and user software code compatible with the PowerPC 603e microprocessor. PC755/745 microprocessors provide on-chip debug support and are fully JTAG-compliant.

The PC745 microprocessor is pin compatible with the TSPC603e family.

PC755/745

GH suffix HITCE 255 Ceramic Ball Grid Array

GH suffix HITCE 360 Ceramic Ball Grid Array

G suffix CBGA360 Ceramic Ball Grid Array

GS suffix CI-CGA360 Ceramic Ball Grid Array with Solder Column Interposer SCI

ZF suffix PBGA255 Flip-Chip Plastic Ball Grid Array

ZF suffix PBGA360 Flip-Chip Plastic Ball Grid Array

Screening

This product is manufactured in full compliance with:
• HiTCE CBGA according to Atmel standards
• CBGA + CI-CGA + FC-PBGA up screenings based upon Atmel standards
• Full military temperature ranges TJ = -55°C, +125°C
• Industrial temperature ranges TJ = -40°C, +110°C

Simplified Block Diagram

The PC755 is targeted for low power systems and supports power management features such as doze, nap, sleep, and dynamic power management. The PC755 consists of a processor core and an internal L2 Tag combined with a dedicated L2 cache interface and a 60x bus.

Figure PC755 Block Diagram

Additional Features * Time Base Counter/Decrementer * Clock Multiplier * JTAG/COP Interface * Thermal/Power Management * Performance Monitor
2 Instructions

Instruction Unit

Fetcher

Branch Processing Unit

Instruction Queue 6-Word

BTIC 64-Entry

CTR LR

Dispatch Unit
64-Bit 2 Instructions

Instruction MMU

SRs Shadow

ITLB

IBAT Array
128-Bit 4 Instructions

Tags
32-Kbyte I Cache

Reservation Station Reservation Station Reservation Station

GPR File

Reservation Station 2-Entry

FPR File

Reservation Station

Integer Unit 1 +x:
Ordering Information
Figure Ordering Information

PCX745
xx PCX755

Product

Part

Code 1 Identifier

Temperature Range TJ 1

Package 1

Screening Level

Max internal processor speed 1
2 PC X
745/755

M -55 C, +125 C V -40 C, +110 C

ZF FC-PBGA G CBGA GS Ci-CGA GH HiTCE

U Upscreening Test B for 300, 350, 366 MHz

Blank Standard

C for 400 MHz

Bus divider
to be confirmed

Level 1

L Any valid

PLL configuration

For availability of the different versions, contact your local Atmel sales office.

The letter X in the part number designates a "Prototype" product that has not been qualified by Atmel. Reliability of a PCX part-number is not guaranteed and such part-number shall not be used in Flight Hardware. Product changes may still occur while shipping prototypes.
52 PC755/745

PC755/745

Definitions

Life Support Applications

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Atmel customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnity Atmel for any damages resulting from such improper use or sale.

Differences with Commercial Part

Temperature range

Commercial part TJ = 0 to 105° C

Military part TJ = -55°C to 125°C
2138F
2138E 2138D

Date 04/2006
05/2005
10/2004 06/2003

Substantive Change s
Increased power specification for 350 MHz full-power mode in Table 7-1 on page Updated ordering information to new Template.

Added HiTCE package for PowerPC 745 Removed phrase "for the ceramic ball grid array CBGA package" from Section on page 19 this information applies to devices in all packages Figure 8-14 on page 36 updated COP Connector Diagram to recommend a weak pull-up resistor on TCK

Product specification release subsequent to product qualification Motorola changed to Freescale

PC755/745

Table of Contents

Features 1 Description 1 Screening 2 1 General Description 2

Simplified Block Diagram General Parameters Features
2 Pin Assignments 6

Pinout Listings
3 Signal Description 13 4 Detailed Specifications 14 5 Applicable Documents 14

Design and Construction
6 Thermal Characteristics 17

Package Characteristics
7 Power consideration 22

Power management Power Dissipation
8 Electrical Characteristics 24

Static Characteristics Dynamic Characteristics
9 Preparation for Delivery 38

Packaging Certificate of Compliance Handling Clock Relationship Choices
10 System Design Information 41

PLL Power Supply Filtering Power Supply Voltage Sequencing Decoupling Recommendations

Connection Recommendations Output Buffer DC Impedance Pull-up Resistor Requirements
11 Package Mechanical Data 45

Package Parameters for the PC745 Package Parameter for the PC755
12 Ordering Information 52 13 Definitions 53

Life Support Applications Differences with Commercial Part
ii PC8280 [Preliminary]

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Datasheet ID: PCX755CVZFU400LE 519350