PCX745BVZFU300LE

PCX745BVZFU300LE Datasheet

PCX745

Part	Datasheet
PCX745BVZFU300LE	PCX745BVZFU300LE (pdf)

Related Parts	Information
PCX755BVZFU300LE	PCX755BVZFU300LE
PCX755CVZFU400LE	PCX755CVZFU400LE
PCX755BVZFU350LE	PCX755BVZFU350LE
PCX745BVZFU350LE	PCX745BVZFU350LE

PDF Datasheet Preview
• 18.1SPECint95, Estimates SPECfp95 at 400 MHz PC755 • 15.7SPECint95, 9SPECfp95 at 350 MHz PC745 • 733 MIPS at 400 MHz PC755 at 641 MIPS at 350 MHz PC745 • Selectable Bus Clock 12 CPU Bus Dividers up to 10x • PD Typical 6.4W at 400 MHz, Full Operating Conditions • Nap, Doze and Sleep Modes for Power Savings • Superscalar 3 Instructions per Clock Cycle Two Instruction + Branch • 4 Beta Byte Virtual Memory, 4-GByte of Physical Memory • 64-bit Data and 32-bit Address Bus Interface • 32-KB Instruction and Data Cache • Six Independent Execution Units • Write-back and Write-through Operations • fINT max = 400 MHz TBC • fBUS max = 100 MHz • Voltage I/O 2.5V/3.3V Voltage Int 2.0V PowerPC 755/745 32-bit RISC Microprocessor The PC755 and PC745 microprocessors are high-performance, lowpower, 32-bit implementations of the PowerPC Reduced Instruction Set Computer RISC architecture, especially enhanced for embedded applications. The PC755 and PC745 microprocessors differ only in that the PC755 features an enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in replacement for the award winning PowerPC 750 microprocessor and is footprint and user software code compatible with the MPC7400 microprocessor with AltiVec technology. The PC745 is a drop-in replacement for the PowerPC 740 microprocessor and is also footprint and user software code compatible with the PowerPC 603e microprocessor. PC755/745 microprocessors provide on-chip debug support and are fully JTAG-compliant. The PC745 microprocessor is pin compatible with the TSPC603e family. PC755/745 GH suffix HITCE 255 Ceramic Ball Grid Array GH suffix HITCE 360 Ceramic Ball Grid Array G suffix CBGA360 Ceramic Ball Grid Array GS suffix CI-CGA360 Ceramic Ball Grid Array with Solder Column Interposer SCI ZF suffix PBGA255 Flip-Chip Plastic Ball Grid Array ZF suffix PBGA360 Flip-Chip Plastic Ball Grid Array Screening This product is manufactured in full compliance with: • HiTCE CBGA according to Atmel standards • CBGA + CI-CGA + FC-PBGA up screenings based upon Atmel standards • Full military temperature ranges TJ = -55°C, +125°C • Industrial temperature ranges TJ = -40°C, +110°C Simplified Block Diagram The PC755 is targeted for low power systems and supports power management features such as doze, nap, sleep, and dynamic power management. The PC755 consists of a processor core and an internal L2 Tag combined with a dedicated L2 cache interface and a 60x bus. Figure PC755 Block Diagram Additional Features * Time Base Counter/Decrementer * Clock Multiplier * JTAG/COP Interface * Thermal/Power Management * Performance Monitor 2 Instructions Instruction Unit Fetcher Branch Processing Unit Instruction Queue 6-Word BTIC 64-Entry CTR LR Dispatch Unit 64-Bit 2 Instructions Instruction MMU SRs Shadow ITLB IBAT Array 128-Bit 4 Instructions Tags 32-Kbyte I Cache Reservation Station Reservation Station Reservation Station GPR File Reservation Station 2-Entry FPR File Reservation Station Integer Unit 1 +x: Ordering Information Figure Ordering Information PCX745 xx PCX755 Product Part Code 1 Identifier Temperature Range TJ 1 Package 1 Screening Level Max internal processor speed 1 2 PC X 745/755 M -55 C, +125 C V -40 C, +110 C ZF FC-PBGA G CBGA GS Ci-CGA GH HiTCE U Upscreening Test B for 300, 350, 366 MHz Blank Standard C for 400 MHz Bus divider to be confirmed Level 1 L Any valid PLL configuration For availability of the different versions, contact your local Atmel sales office. The letter X in the part number designates a "Prototype" product that has not been qualified by Atmel. Reliability of a PCX part-number is not guaranteed and such part-number shall not be used in Flight Hardware. Product changes may still occur while shipping prototypes. 52 PC755/745 PC755/745 Definitions Life Support Applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Atmel customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnity Atmel for any damages resulting from such improper use or sale. Differences with Commercial Part Temperature range Commercial part TJ = 0 to 105° C Military part TJ = -55°C to 125°C 2138F 2138E 2138D Date 04/2006 05/2005 10/2004 06/2003 Substantive Change s Increased power specification for 350 MHz full-power mode in Table 7-1 on page Updated ordering information to new Template. Added HiTCE package for PowerPC 745 Removed phrase "for the ceramic ball grid array CBGA package" from Section on page 19 this information applies to devices in all packages Figure 8-14 on page 36 updated COP Connector Diagram to recommend a weak pull-up resistor on TCK Product specification release subsequent to product qualification Motorola changed to Freescale PC755/745 Table of Contents Features 1 Description 1 Screening 2 1 General Description 2 Simplified Block Diagram General Parameters Features 2 Pin Assignments 6 Pinout Listings 3 Signal Description 13 4 Detailed Specifications 14 5 Applicable Documents 14 Design and Construction 6 Thermal Characteristics 17 Package Characteristics 7 Power consideration 22 Power management Power Dissipation 8 Electrical Characteristics 24 Static Characteristics Dynamic Characteristics 9 Preparation for Delivery 38 Packaging Certificate of Compliance Handling Clock Relationship Choices 10 System Design Information 41 PLL Power Supply Filtering Power Supply Voltage Sequencing Decoupling Recommendations Connection Recommendations Output Buffer DC Impedance Pull-up Resistor Requirements 11 Package Mechanical Data 45 Package Parameters for the PC745 Package Parameter for the PC755 12 Ordering Information 52 13 Definitions 53 Life Support Applications Differences with Commercial Part ii PC8280 [Preliminary] Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel 41 26-426-5555 Fax 41 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel 852 2721-9778 Fax 852 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel 81 3-3523-3551 Fax 81 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel 33 2-40-18-18-18 Fax 33 2-40-18-19-60 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel 33 4-42-53-60-00 Fax 33 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel 1 719 576-3300 Fax 1 719 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel 44 1355-803-000 Fax 44 1355-242-743 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel 49 71-31-67-0 Fax 49 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel 1 719 576-3300 Fax 1 719 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel 33 4-76-58-30-00 Fax 33 4-76-58-34-80 Literature Requests Disclaimer The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. 2006 Atmel Corporation. All rights reserved. logo and combinations thereof, Everywhere You and others, are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. is a registered trademarks of IBM Company. Other terms and product names may be trademarks of others.

PDF Datasheet Preview

• 18.1SPECint95, Estimates SPECfp95 at 400 MHz PC755
• 15.7SPECint95, 9SPECfp95 at 350 MHz PC745
• 733 MIPS at 400 MHz PC755 at 641 MIPS at 350 MHz PC745
• Selectable Bus Clock 12 CPU Bus Dividers up to 10x
• PD Typical 6.4W at 400 MHz, Full Operating Conditions
• Nap, Doze and Sleep Modes for Power Savings
• Superscalar 3 Instructions per Clock Cycle Two Instruction + Branch
• 4 Beta Byte Virtual Memory, 4-GByte of Physical Memory
• 64-bit Data and 32-bit Address Bus Interface
• 32-KB Instruction and Data Cache
• Six Independent Execution Units
• Write-back and Write-through Operations
• fINT max = 400 MHz TBC
• fBUS max = 100 MHz
• Voltage I/O 2.5V/3.3V Voltage Int 2.0V

PowerPC 755/745 32-bit RISC Microprocessor

The PC755 and PC745 microprocessors are high-performance, lowpower, 32-bit implementations of the PowerPC Reduced Instruction Set Computer RISC architecture, especially enhanced for embedded applications.

The PC755 and PC745 microprocessors differ only in that the PC755 features an enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in replacement for the award winning PowerPC 750 microprocessor and is footprint and user software code compatible with the MPC7400 microprocessor with AltiVec technology. The PC745 is a drop-in replacement for the PowerPC 740 microprocessor and is also footprint and user software code compatible with the PowerPC 603e microprocessor. PC755/745 microprocessors provide on-chip debug support and are fully JTAG-compliant.

The PC745 microprocessor is pin compatible with the TSPC603e family.

PC755/745

GH suffix HITCE 255 Ceramic Ball Grid Array

GH suffix HITCE 360 Ceramic Ball Grid Array

G suffix CBGA360 Ceramic Ball Grid Array

GS suffix CI-CGA360 Ceramic Ball Grid Array with Solder Column Interposer SCI

ZF suffix PBGA255 Flip-Chip Plastic Ball Grid Array

ZF suffix PBGA360 Flip-Chip Plastic Ball Grid Array

Screening

This product is manufactured in full compliance with:
• HiTCE CBGA according to Atmel standards
• CBGA + CI-CGA + FC-PBGA up screenings based upon Atmel standards
• Full military temperature ranges TJ = -55°C, +125°C
• Industrial temperature ranges TJ = -40°C, +110°C

Simplified Block Diagram

The PC755 is targeted for low power systems and supports power management features such as doze, nap, sleep, and dynamic power management. The PC755 consists of a processor core and an internal L2 Tag combined with a dedicated L2 cache interface and a 60x bus.

Figure PC755 Block Diagram

Additional Features * Time Base Counter/Decrementer * Clock Multiplier * JTAG/COP Interface * Thermal/Power Management * Performance Monitor
2 Instructions

Instruction Unit

Fetcher

Branch Processing Unit

Instruction Queue 6-Word

BTIC 64-Entry

CTR LR

Dispatch Unit
64-Bit 2 Instructions

Instruction MMU

SRs Shadow

ITLB

IBAT Array
128-Bit 4 Instructions

Tags
32-Kbyte I Cache

Reservation Station Reservation Station Reservation Station

GPR File

Reservation Station 2-Entry

FPR File

Reservation Station

Integer Unit 1 +x:
Ordering Information
Figure Ordering Information

PCX745
xx PCX755

Product

Part

Code 1 Identifier

Temperature Range TJ 1

Package 1

Screening Level

Max internal processor speed 1
2 PC X
745/755

M -55 C, +125 C V -40 C, +110 C

ZF FC-PBGA G CBGA GS Ci-CGA GH HiTCE

U Upscreening Test B for 300, 350, 366 MHz

Blank Standard

C for 400 MHz

Bus divider
to be confirmed

Level 1

L Any valid

PLL configuration

For availability of the different versions, contact your local Atmel sales office.

The letter X in the part number designates a "Prototype" product that has not been qualified by Atmel. Reliability of a PCX part-number is not guaranteed and such part-number shall not be used in Flight Hardware. Product changes may still occur while shipping prototypes.
52 PC755/745

PC755/745

Definitions

Life Support Applications

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Atmel customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnity Atmel for any damages resulting from such improper use or sale.

Differences with Commercial Part

Temperature range

Commercial part TJ = 0 to 105° C

Military part TJ = -55°C to 125°C
2138F
2138E 2138D

Date 04/2006
05/2005
10/2004 06/2003

Substantive Change s
Increased power specification for 350 MHz full-power mode in Table 7-1 on page Updated ordering information to new Template.

Added HiTCE package for PowerPC 745 Removed phrase "for the ceramic ball grid array CBGA package" from Section on page 19 this information applies to devices in all packages Figure 8-14 on page 36 updated COP Connector Diagram to recommend a weak pull-up resistor on TCK

Product specification release subsequent to product qualification Motorola changed to Freescale

PC755/745

Table of Contents

Features 1 Description 1 Screening 2 1 General Description 2

Simplified Block Diagram General Parameters Features
2 Pin Assignments 6

Pinout Listings
3 Signal Description 13 4 Detailed Specifications 14 5 Applicable Documents 14

Design and Construction
6 Thermal Characteristics 17

Package Characteristics
7 Power consideration 22

Power management Power Dissipation
8 Electrical Characteristics 24

Static Characteristics Dynamic Characteristics
9 Preparation for Delivery 38

Packaging Certificate of Compliance Handling Clock Relationship Choices
10 System Design Information 41

PLL Power Supply Filtering Power Supply Voltage Sequencing Decoupling Recommendations

Connection Recommendations Output Buffer DC Impedance Pull-up Resistor Requirements
11 Package Mechanical Data 45

Package Parameters for the PC745 Package Parameter for the PC755
12 Ordering Information 52 13 Definitions 53

Life Support Applications Differences with Commercial Part
ii PC8280 [Preliminary]

Atmel Corporation
2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 487-2600

Regional Headquarters

Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel 41 26-426-5555 Fax 41 26-426-5500

Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel 852 2721-9778 Fax 852 2722-1369

Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel 81 3-3523-3551 Fax 81 3-3523-7581

Atmel Operations

Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314

Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314

La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel 33 2-40-18-18-18 Fax 33 2-40-18-19-60

ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France Tel 33 4-42-53-60-00 Fax 33 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel 1 719 576-3300 Fax 1 719 540-1759

Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel 44 1355-803-000 Fax 44 1355-242-743

RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel 49 71-31-67-0 Fax 49 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel 1 719 576-3300 Fax 1 719 540-1759

Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom

Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel 33 4-76-58-30-00 Fax 33 4-76-58-34-80

Literature Requests

Disclaimer The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.
2006 Atmel Corporation. All rights reserved. logo and combinations thereof, Everywhere You and others, are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. is a registered trademarks of IBM Company. Other terms and product names may be trademarks of others.

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived PCX745BVZFU300LE Datasheet file may be downloaded here without warranties.

Datasheet ID: PCX745BVZFU300LE 519350