ATA557001C-DDB

ATA557001C-DDB Datasheet

• Contactless Read/Write Data Transmission • Sensor Input RS > 100kΩ Typical => Data Stream Inverted • Radio Frequency fRF from 100kHz to 150kHz • e5550 Binary Compatible or ATA5570C Extended Mode • Small Size, Configurable for ISO/IEC 11784/785 Compatibility • 7 x 32-bit EEPROM Data Memory Including 32-bit Password • Separate 64-bit Memory for Traceability Data • 32-bit Configuration Register in EEPROM to Setup

Part	Datasheet
ATA557001C-DDB	ATA557001C-DDB (pdf)

Related Parts	Information
ATA557001C-TAQY	ATA557001C-TAQY
ATA557001C-DDT	ATA557001C-DDT

PDF Datasheet Preview
• Contactless Read/Write Data Transmission • Sensor Input RS > 100kΩ Typical => Data Stream Inverted • Radio Frequency fRF from 100kHz to 150kHz • e5550 Binary Compatible or ATA5570C Extended Mode • Small Size, Configurable for ISO/IEC 11784/785 Compatibility • 7 x 32-bit EEPROM Data Memory Including 32-bit Password • Separate 64-bit Memory for Traceability Data • 32-bit Configuration Register in EEPROM to Setup Data Rate • RF/2 to RF/128, Binary Selectable or • Fixed Atmel e5550 Data Rates Modulation/Coding • FSK, PSK, Manchester, Bi-phase, NRZ Other Options • Password Mode • Maximum Block Feature • Answer-On-Request AOR Mode • Inverse Data Output • Direct Access Mode • Sequence Terminator s • Write Protection Through Lock-bit per Block • Fast Write Method 5Kbps versus 2Kbps • OTP Functionality • POR Delay up to 67ms Multifunctional 330-bit Read/Write RF Sensor Identification IC Atmel ATA5570C The ATA5570C is a contactless R/W IDentification IC for applications in the 125kHz frequency range. A single coil, connected to the chip, serves as the IC’s power supply and bi-directional communication interface. The antenna and chip together form a transponder or tag. The on-chip 330-bit EEPROM 10 blocks, 33 bits each can be read and written block-wise from a reader. Block 0 is reserved for setting the operation modes of the ATA5570C tag. Block 7 may contain a password to prevent unauthorized writing. Data is transmitted from the IDIC using load modulation. This is achieved by damping the RF field with a resistive load between the two terminals COIL1 and COIL2. The IC receives and decodes 100% amplitude-modulated OOK pulse-interval-encoded bit streams from the base station or reader. System Block Diagram Figure RFID System Using ATA5570C Tag Reader Baseosrtation Base station Power Data Coil Interface Controller Transponder Memory Atmel ATA5570C ATA5570C Building Blocks Figure Block Diagram COIL1 LR COIL2 Analog front end RS SENS Modulator Mode register Write decoder Controller Bit-rate generator Test logic Memory 264 bit EEPROM Input register HV generator Analog Front End AFE The AFE includes all circuits which are directly connected to the coil. It generates the IC’s power supply and handles the bi-directional data communication with the reader. It consists of the following blocks: • Rectifier to generate a DC supply voltage from the AC coil voltage • Clock extractor • Switchable load between COIL1 and COIL2 for data transmission from tag to the reader • Field gap detector for data transmission from the base station to the tag • ESD protection circuitry 2 Atmel ATA5570C Atmel ATA5570C Data-rate Generator The data rate is binary programmable to operate at any data rate between RF/2 and RF/128 or equal to any of the fixed e5550/e5551 and Atmel T5554 bit rates RF/8, RF/16, RF/32, RF/40, RF/50, RF/64, RF/100 and RF/128 . Write Decoder This function decodes the write gaps and verifies the validity of the data stream according to the Atmel e555x write method pulse interval encoding . HV Generator This on-chip charge-pump circuit generates the high voltage required for programming of the EEPROM. DC Supply Ordering Information Extended Type Number ATA557001C-DDB ATA557001C-DDT ATA557001C-TAQY Package 6” sawn wafer on foil with ring, thickness 150µm approx. 6mil Die in waffle pack, thickness 150µm approx. 6mil SO8 package with additional resonance capacitor of 340pF Drawing Figure 11-2 on page 28 Figure 11-3 on page 29 Figure 11-4 on page 30 26 Atmel ATA5570C Package Information Figure Pad Layout Dimensions in µm Atmel ATA5570C 100 C2 1020 135 C1 130 1030 SENS ATA5570 Figure Sawn Wafer on Foil with Ring Die Dimensions 20:1 technical drawings according to DIN specifications Dimensions in mm Orientation on frame Polyimide Label: Prod ATA5570xxC-DDB Lot no Wafer no: Qty: Option xx Ø Ø3 A Ø150 Package Drawing Contact Dimensions ATA5570xxC-DDB 28 Atmel ATA5570C Wafer ATA5570xxC-DDB Adwill D176 6" Wafer frame, plastic thickness 2.5mm Figure Die in Waffle Pack 20:1 Atmel ATA5570C technical drawings according to DIN specifications Dimensions in mm Chip Dimensions ATA5570xxC-DDT Polyimide

PDF Datasheet Preview

• Contactless Read/Write Data Transmission
• Sensor Input RS > 100kΩ Typical => Data Stream Inverted
• Radio Frequency fRF from 100kHz to 150kHz
• e5550 Binary Compatible or ATA5570C Extended Mode
• Small Size, Configurable for ISO/IEC 11784/785 Compatibility
• 7 x 32-bit EEPROM Data Memory Including 32-bit Password
• Separate 64-bit Memory for Traceability Data
• 32-bit Configuration Register in EEPROM to Setup

Data Rate
• RF/2 to RF/128, Binary Selectable or
• Fixed Atmel e5550 Data Rates

Modulation/Coding
• FSK, PSK, Manchester, Bi-phase, NRZ

Other Options
• Password Mode
• Maximum Block Feature
• Answer-On-Request AOR Mode
• Inverse Data Output
• Direct Access Mode
• Sequence Terminator s
• Write Protection Through Lock-bit per Block
• Fast Write Method 5Kbps versus 2Kbps
• OTP Functionality
• POR Delay up to 67ms

Multifunctional 330-bit Read/Write RF Sensor Identification IC

Atmel ATA5570C

The ATA5570C is a contactless R/W IDentification IC for applications in the 125kHz frequency range. A single coil, connected to the chip, serves as the IC’s power supply and bi-directional communication interface. The antenna and chip together form a transponder or tag.

The on-chip 330-bit EEPROM 10 blocks, 33 bits each can be read and written block-wise from a reader. Block 0 is reserved for setting the operation modes of the ATA5570C tag. Block 7 may contain a password to prevent unauthorized writing.

Data is transmitted from the IDIC using load modulation. This is achieved by damping the RF field with a resistive load between the two terminals COIL1 and COIL2. The IC receives and decodes 100% amplitude-modulated OOK pulse-interval-encoded bit streams from the base station or reader.

System Block Diagram

Figure RFID System Using ATA5570C Tag

Reader Baseosrtation Base station

Power Data

Coil Interface Controller

Transponder Memory

Atmel ATA5570C

ATA5570C Building Blocks

Figure Block Diagram

COIL1 LR

COIL2

Analog front end

RS SENS

Modulator

Mode register

Write decoder

Controller

Bit-rate generator

Test logic

Memory 264 bit EEPROM Input register HV generator

Analog Front End AFE

The AFE includes all circuits which are directly connected to the coil. It generates the IC’s power supply and handles the bi-directional data communication with the reader. It consists of the following blocks:
• Rectifier to generate a DC supply voltage from the AC coil voltage
• Clock extractor
• Switchable load between COIL1 and COIL2 for data transmission from tag to the reader
• Field gap detector for data transmission from the base station to the tag
• ESD protection circuitry
2 Atmel ATA5570C

Atmel ATA5570C

Data-rate Generator

The data rate is binary programmable to operate at any data rate between RF/2 and RF/128 or equal to any of the fixed e5550/e5551 and Atmel T5554 bit rates RF/8, RF/16, RF/32, RF/40, RF/50, RF/64, RF/100 and RF/128 .

Write Decoder

This function decodes the write gaps and verifies the validity of the data stream according to the Atmel e555x write method pulse interval encoding .

HV Generator

This on-chip charge-pump circuit generates the high voltage required for programming of the EEPROM.

DC Supply
Ordering Information

Extended Type Number ATA557001C-DDB

ATA557001C-DDT

ATA557001C-TAQY

Package
6” sawn wafer on foil with ring, thickness 150µm approx. 6mil

Die in waffle pack, thickness 150µm approx. 6mil

SO8 package with additional resonance capacitor of 340pF

Drawing Figure 11-2 on page 28 Figure 11-3 on page 29 Figure 11-4 on page 30
26 Atmel ATA5570C

Package Information

Figure Pad Layout

Dimensions in µm

Atmel ATA5570C
100 C2
1020
135 C1 130
1030

SENS

ATA5570

Figure Sawn Wafer on Foil with Ring

Die Dimensions 20:1
technical drawings according to DIN specifications

Dimensions in mm Orientation on frame

Polyimide

Label:

Prod ATA5570xxC-DDB Lot no Wafer no:

Qty:

Option xx
Ø Ø3 A
Ø150

Package Drawing Contact Dimensions ATA5570xxC-DDB
28 Atmel ATA5570C

Wafer ATA5570xxC-DDB Adwill D176 6" Wafer frame, plastic thickness 2.5mm

Figure Die in Waffle Pack
20:1

Atmel ATA5570C
technical drawings according to DIN specifications

Dimensions in mm

Chip Dimensions ATA5570xxC-DDT

Polyimide

More datasheets: FDU6296 | MS-42N20S000 | 3267 | MV5075C | MV5474C | MV5774C | MV5074C | MV5374C | ATA557001C-TAQY | ATA557001C-DDT

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Datasheet ID: ATA557001C-DDB 519177