ATA555812-DBB

ATA555812-DBB Datasheet


• Contactless Read/Write Data Transmission

Part Datasheet
ATA555812-DBB ATA555812-DBB ATA555812-DBB (pdf)
Related Parts Information
ATA555815-PP ATA555815-PP ATA555815-PP
ATA555811-DDB ATA555811-DDB ATA555811-DDB
ATA555812-DDB ATA555812-DDB ATA555812-DDB
ATA555814-DBB ATA555814-DBB ATA555814-DBB
ATA555814-DDB ATA555814-DDB ATA555814-DDB
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• Contactless Read/Write Data Transmission
• Radio Frequency fRF:
100 kHz to 200 kHz
• User Memory 1024 Bits 32 Write Protectable 32-bit Blocks of Data
• Deterministic Anticollision Detection Rate ~ 20 Tags/s with 40-bit Tag ID, RF/32
• On-chip CRC Generator 16-bit CRC-CCITT Compliant to ISO/IEC 11785
• Downlink Transmission Enhanced 1 out of 4 Pulse Interval Encoding ~ 5 kbps
• Uplink Transmission:

ASK Modulated, NRZ, Manchester or Bi-phase Encoding
• Integrated Tuning Capacitor 80 pF ±12%, 210 pF ±12% as Mask Option
• System Memory 320 bits :
10 Write and Password Protectable 32 Bit Blocks of Data

Tag ID 96 Bits Maximum

Traceability Data with Inherent Manufacturer Serial Number

Write Password 32 Bits and Read Password 32 Bits ,
with Page Orientated Memory Protection Areas

Configuration Register for Setup of:
• Selectable Data Bit Rate RF/2 RF/64
• Selectable Tag ID Length to Optimize Anticollision Detection Rate
• Start of Frame with Variable Preamble Length to Simplify Interrogator Design
• Public Mode PM for Read Only Tag Emulation
• Electrical Article Surveillance EAS Mode
• Direct Data NRZ , Bi-phase FDX-B or Manchester Data Encoding
1 kbit R/W IDIC with Deterministic Anticollision

ATA5558

The ATA5558 is a contactless, two-terminal R/W-Identification IC for multi- or single tag applications in the low frequency 125 kHz range. The passive tag uses the external RF signal to generate it’s own power supply and internal clock reference.

Figure RFID System Using an ATA5558 Tag

Transponder

Reader or Interrogator

Power Data

Coil interface Controller

Memory *

ATA5558
* Mask option

It contains an EEPROM which is subdivided into 1024 bits of user memory and 320 bits of system memory. Both memory sections are organized in data blocks of 32 bits, each equipped with an associated lock bit for block write protection. The user memory, which is intended for storage of recallable user data, is made of 32 such blocks. The 10 block system memory section is reserved for system parameter and configuration settings. Two of these blocks include a 32 bit read and a 32 bit write password to prevent unauthorized read and/or write access to protected user definable memory pages.

The ATA5558 receives commands from the interrogator downlink as a 1 out of 4 pulse interval encoded, amplitude modulated signal. Return data transmission from the tag to the interrogator uplink utilizes either Manchester, Bi-phase or NRZ encoded amplitude modulation. This is achieved by controlled damping of the interrogator’s RF field with an on-chip resistive load between the two tag terminals, Coil 1 and Coil Multi-Tag identification is implemented using a deterministic anticollision algorithm which requires unique tag identification information Tag ID’s . Three blocks within the system memory are reserved for storage of the Tag ID, the length of which is user configurable up to a maximum of 96 bits.

Figure System Block Diagram

Coil 1 Coil 2
* Analog front-end PPM signal Binary bitrate decoder generator

Modulator Mode register Controller Anticollision logic

System memory
Ordering Information

ATA5558 a b - x Package - DDB
- DDT Type
6” sawn wafer on foil with ring, thickness 150 µm approx. 6 mil Die in waffle pack, 150 µm approx. 6 mil , planned

Standard pads without on-chip C

Drawing See Figure 10-1 on page 42

See Figure 10-2 on page 43

ATA5558
ab - xxx

Package - DDB
- DBB
-DDT
6” sawn wafer on foil with ring, thickness 150 µm approx. 6 mil 6” sawn wafer on foil with ring and Goldbumps 25 µm, thickness 150 µm approx. 6 mil Die in waffle pack, 150 µm approx. 6 mil , planned

Drawing See Figure 10-9 on page 50

See Figure 10-9 on page 50

See Figure 10-2 on page 43

Type 12 14

Mega Pads with on-chip 80 pF Mega Pads with on-chip 210 pF

ATA5558
ab - xxx

Package

Plastic transponder

Drawing See Figure 10-8 on page 49
- PAE

Type 15

NOA3 micromodule with 330 pF lead-free, planned See Figure 10-9 on page 50

Available Order Codes

ATA555811-DDB ATA555812-DDB ATA555812-DBB ATA555814-DDB ATA555814-DBB ATA555815-PP

Engineering Samples

Die-samples are supplied 50 pcs. Each in waffle pack, with standard part number applied.
40 ATA5558

ATA5558

Delivery Pre-configuration

The ATA5558 is delivered in a pre-programmed state. The traceability blocks 59-61 contain unique non erasable traceability data as described in section “Traceability Data” on page The remaining memory contains erasable demonstration data which can be replaced by customer data after having been cleared using a sequence of Select, ArmClear and ClearAll commands. the demonstration data represents the following device configuration:

Block 63 contains configuration data representing Public Mode, FDX-B Modulation, a data rate of RF/32, a Tag ID length of 64 bits, preamble value of 7 and a maximum public mode block value Maxblock of

Blocks 0-3 contain an FDX-B encoded animal ID code in accordance with ISO 11784 representing a National ID code 000123456789 and country code

The Tag ID blocks 56-57 contain a direct copy of the unique traceability data held in blocks 59-60 thus each delivered device will have it’s own 64 bit unique Tag ID code with which anticollision arbitration can be demonstrated.

All other blocks are erased.
Ordering Examples Recommended

ATA555811 - Tested dice on unsawn 6” wafer, thickness 300 µm, no on-chip capacitor, no damping during POR initialization.

Package Information

Figure 6” Sawn Wafer on Foil with Ring Type 11, Standard Pads

Die Dimensions 20:1
technical drawings according to DIN specifications

Dimensions in mm

Orientation on frame

Polyimide

Label:

Prod ATA555811

PLot no:

Wafer no:

Qty:
Ø Ø3 A
Ø150

Package Drawing Contact Dimensions ATA555811
42 ATA5558

Wafer ATA555811 UV Tape Adwill D176 6" Wafer frame, plastic thickness 2.5mm

Figure 6” Sawn Wafer on Foil with Ring Type 12/14, Mega Pads

Die Dimensions 20:1

ATA5558
technical drawings according to DIN specifications

Dimensions in mm

Orientation on frame

Polyimide

Label:

Prod ATA555812, ATA555814

PLot no:

Wafer no:

Qty:
Ø Ø3 A
Ø150

Package Drawing Contact Dimensions ATA555812, ATA555814

Wafer ATA555812, ATA555814 UV Tape Adwill D176 6" Wafer frame, plastic thickness 2.5mm

Figure 6” Sawn Wafer on Foil with Ring and Goldbumps 25 µm Type 12/14, Mega Pads

Die Dimensions 20:1

Au bump
technical drawings according to DIN specifications

Dimensions in mm

Orientation on frame
Headquarters

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International

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Datasheet ID: ATA555812-DBB 519174