AT93C46Y6-10YH-1.8

AT93C46Y6-10YH-1.8 Datasheet


The AT93C46 provides 1024 bits of serial electrically erasable programmable readonly memory EEPROM , organized as 64 words of 16 bits each when the ORG pin is connected to VCC , and 128 words of 8 bits each when the ORG pin is tied to ground . The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. The AT93C46 is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead Ultra Thin mini-MAP MLP 2x3 , 8-lead TSSOP, and 8-lead dBGA2 packages.

Part Datasheet
AT93C46Y6-10YH-1.8 AT93C46Y6-10YH-1.8 AT93C46Y6-10YH-1.8 (pdf)
PDF Datasheet Preview
• Low-voltage and Standard-voltage Operation

VCC = 2.7V to 5.5V VCC = 1.8V to 5.5V
• User-selectable Internal Organization
1K 128 x 8 or 64 x 16
• Three-wire Serial Interface
• 2 MHz Clock Rate 5V
• Self-timed Write Cycle 10 ms max
• High Reliability

Endurance 1 Million Write Cycles

Data Retention 100 Years
• Automotive Grade Devices Available
• 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead Ultra Thin mini-MAP

MLP 2x3 , 8-lead TSSOP and 8-ball dBGA2 Packages

The AT93C46 provides 1024 bits of serial electrically erasable programmable readonly memory EEPROM , organized as 64 words of 16 bits each when the ORG pin is connected to VCC , and 128 words of 8 bits each when the ORG pin is tied to ground . The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operations are essential. The AT93C46 is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead Ultra Thin mini-MAP MLP 2x3 , 8-lead TSSOP, and 8-lead dBGA2 packages.

The AT93C46 is enabled through the Chip Select pin CS and accessed via a three-wire serial interface consisting of Data Input DI , Data Output DO , and Shift Clock SK . Upon receiving a Read instruction at DI, the address is decoded and the data is clocked out serially on the DO pin. The Write cycle is completely self-timed, and no separate Erase cycle is required before Write. The Write cycle is only enabled when the part is in the Erase/Write Enable state. When CS is brought high following the initiation of a Write cycle, the DO pin outputs the Ready/Busy status of the part.

The AT93C46 is available in 2.7V to 5.5V and 1.8V to 5.5V versions.

Table Pin Configurations

Pin Name

Function

Chip Select

Serial Data Clock

Serial Data Input
8-lead SOIC

VCC DC ORG GND
8-lead dBGA2

VCC 8 1 CS DC 7 2 SK

ORG 6 3 D1 GND 5 4 D0

Bottom View

DO GND VCC ORG DC

Serial Data Output Ground Power Supply Internal Organization Don’t Connect
8-lead PDIP
8 VCC
8-lead SOIC Rotated R 1K JEDEC Only
6 ORG

DC 1 VCC 2

CS 3 SK 4
8 ORG 7 GND 6 DO 5 DI
8-lead Ultra Thin mini-MAP MLP 2x3

VCC 8

ORG 6

GND 5
8-lead TSSOP

VCC DC ORG GND

Bottom View

Three-wire Serial EEPROM
AT93C46 Ordering Information 1
Ordering Code

AT93C46-10PU-2.7 2 AT93C46-10PU-1.8 2 AT93C46-10SU-2.7 2 AT93C46-10SU-1.8 2 AT93C46W-10SU-2.7 2 AT93C46W-10SU-1.8 2 AT93C46-10TU-2.7 2 AT93C46-10TU-1.8 2 AT93C46Y1-10YU-1.8 2 Not recommended for new designs AT93C46Y6-10YH-1.8 3 AT93C46U3-10UU-1.8 2

Package
8P3 8S1 8S2 8A2 8Y1 8Y6 8U3-1

Operation Range

Lead-free/Halogen-free/ Industrial Temperature
-40qC to 85qC

AT93C46-W1.8-11 4

Die Sale

Industrial -40qC to 85qC

For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the Table 3 on page 3 and Table 4 on page Not recommended for new design. Please refer to AT93C46D datasheet.
“U” designates Green Package and RoHS compliant. “H” designates Green Package and RoHS compliant, with NiPdAu Lead finish Available in waffle pack and wafer form, order as SL788 for inkless wafer form. Bumped die available upon request.
8P3 8S1 8S2 8A2 8U3-1 8Y1

Package Type 8-lead, Wide, Plastic Dual Inline Package PDIP 8-lead, Wide, Plastic Gull Wing Small Outline JEDEC SOIC 8-lead, Wide, Plastic Gull Wing Small Outline EIAJ SOIC 8-lead, Wide, Thin Shrink Small Outline Package TSSOP 8-ball, Die Ball Grid Array Package dBGA2 8-lead, mm x mm Body, Dual Footprint, Non-leaded, Miniature Array Package MAP 8-lead, mm x mm Body, 0.50mm Pitch, Ultra-Thin Mini-MAO, Dual No Lead Package. DFN , MLP 2x3mm

Options Low Voltage 2.7V to 5.5V Low Voltage 1.8V to 5.5V Rotated Pinout
1 AT93C46

Packaging Information
8P3 PDIP

AT93C46

Top View

End View
4 PLCS

Side View

COMMON DIMENSIONS Unit of Measure = inches

SYMBOL A A2 b b2 b3 c D D1 E E1 e eA L

MIN NOM MAX

NOTE 2

This drawing is for general information only refer to JEDEC Drawing MS-001, Variation BA for additional information. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed inch. E and eA measured with the leads constrained to be perpendicular to datum. Pointed or rounded lead tips are preferred to ease insertion. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed mm .
01/09/02
2325 Orchard Parkway R San Jose, CA 95131

TITLE 8P3, 8-lead, Wide Body, Plastic Dual In-line Package PDIP
8S1 JEDEC SOIC

Top View

Side View

End View

COMMON DIMENSIONS Unit of Measure = mm

SYMBOL A A1 b C D E1 E L

NOTE

Note These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
1150 E. Cheyenne Mtn. Blvd. R Colorado Springs, CO 80906

TITLE 8S1, 8-lead Wide Body , Plastic Gull Wing
Atmel Corporation
2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 487-2600

Regional Headquarters

Europe

Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel 41 26-426-5555 Fax 41 26-426-5500

Asia

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Japan
9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel 81 3-3523-3551 Fax 81 3-3523-7581

Atmel Operations

Memory
2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314

Microcontrollers
2325 Orchard Parkway San Jose, CA 95131, USA Tel 1 408 441-0311 Fax 1 408 436-4314

La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel 33 2-40-18-18-18 Fax 33 2-40-18-19-60

ASIC/ASSP/Smart Cards

Zone Industrielle 13106 Rousset Cedex, France Tel 33 4-42-53-60-00 Fax 33 4-42-53-60-01
1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel 1 719 576-3300 Fax 1 719 540-1759

Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel 44 1355-803-000 Fax 44 1355-242-743

RF/Automotive

Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel 49 71-31-67-0 Fax 49 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel 1 719 576-3300 Fax 1 719 540-1759

Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom

Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel 33 4-76-58-30-00 Fax 33 4-76-58-34-80

Literature Requests

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AT93C46
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Datasheet ID: AT93C46Y6-10YH-1.8 519141