AT91 based Microcontrollers AT91SAM7A2
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AT91SAM7A2-AU (pdf) |
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• Processor Core High Performance 32-bit RISC High-density 16-bit Instruction set Thumb Leader in MIPS/Watt Embedded ICE In Circuit Emulation • 16 Kbytes Internal SRAM • Fully Programmable External Bus Interface EBI Maximum External Address Space of 6 Mbytes, Up to Four Chip Select Lines • 8-level Priority, Vectored Interrupt Controller Three External Interrupts Including One Fast Interrupt Line • Ten Channel Peripheral Data Controller PDC • 57 Programmable I/O Lines • Four 16-bit General Purpose Timers GPT Three Configurable Modes Counter, PWM, Capture Four External Clock Inputs, Three Multi-purpose I/O Pins per Timer • Four 16-bit Simple Timers ST • Four Channel 16-bit Pulse Width Modulation PWM • Four CAN Controllers 2.0A and 2.0B Full CAN One with 32 Buffers, Three with 16 Buffers • Two USARTs Support for J1587 and LIN Protocols • One Master/Slave SPI Interface 8 to 16-bit Programmable Data Length Four External Serial Peripheral Chip Selects • Two 8-channel 10-bit Analog to Digital Converters ADC • Two 16-bit Capture Modules CAPT • Programmable Watch Timer WT • Programmable Watchdog WD • Power Management Controller PMC 32 kHz Oscillator, Main Oscillator and PLL • IEEE JTAG Boundary-scan on all Digital Pins • Fully Static Operation 0 Hz to 30 MHz at VDDCORE=3.3V, 85°C • 3.0V to 5.5V Operating Voltage Range • 3.0V to 3.6V Core, Memory and Analog Voltage Range • -40° to +85°C Operating Temperature Range • Available in a 176-lead LQFP Package AT91 based Microcontrollers AT91SAM7A2 The AT91SAM7A2 is based on the ARM7TDMI embedded processor. This processor has a high-performance 32-bit RISC architecture with a high-density 16-bit instruction set and very low power consumption. In addition, a large number of internally banked registers result in very fast exception handling, making the device ideal for real-time control applications. The AT91SAM7A2 has a direct connection to off-chip memory, including Flash, through the fully programmable External Bus Interface. An 8-level priority vectored Interrupt Controller in conjunction with the Peripheral Data Controller significantly improves the real time performance of the device. The device is manufactured using high-density CMOS technology. By combining the ARM7TDMI processor with an on-chip SRAM, and a wide range of peripheral functions, including USART, SPI, CAN Controllers, Timer Counter and Analog-to-Digital Converters, on a monolithic chip, the AT91SAM7A2 is a powerful device that provides a flexible, cost-effective solution to many compute-intensive embedded control applications in the automotive and industrial world. Block Diagram Figure Block Diagram VDDCORE GND IRQ[1:0] FIQ SCANEN TDI TDO TCK TMS TEST VDDIO GND SPCK/MPIO MISO/MPIO MOSI/MPIO NPCS0/MPIO NPCS1/MPIO NPCS2/MPIO NPCS3/MPIO RXD0/MPIO TXD0/MPIO SCK0/MPIO RXD1/MPIO TXD1/MPIO SCK1/MPIO 5V T0TIOA0/MPIO T0TIOB0/MPIO T0TCLK0/MPIO T0TIOA1/MPIO T0TIOB1/MPIO T0TCLK1/MPIO T0TIOA2/MPIO T0TIOB2/MPIO T0TCLK2/MPIO T1TIOA0/MPIO T1TIOB0/MPIO T1TCLK0/MPIO PIO[31:0] I/O Power Core Power Supply Supply SPI PIO 2 PDC Channels Generic Interrupt Controller 10 Channel PDC Controller USART0 2 PDC Channels Select Arbiter ASB Controller JTAG Advanced Memory Controller Embedded Ordering Information Table Ordering Information Ordering Code AT91SAM7A2-AI AT91SAM7A2 - Summary Package TQFP 176 Temperature Operating Range Industrial -40°C to +85°C Packaging Information Package Drawing Figure 176-lead LQFP Package Drawing PIN 1 12 AT91SAM7A2 - Summary AT91SAM7A2 - Summary Table Package Dimensions mm 11° 12° 13° 11° 12° 13° Tolerances of Form and Position Table Lead Count Dimensions mm D1/E1 Count BSC Table Device and 176-lead LQFP Package Maximum Weight 1900 Soldering Profile Table 7 gives the recommended soldering profile from J-STD-20. Table Soldering Profile Average Ramp-up Rate 183°C to Peak Preheat Temperature 125°C ±25°C Temperature Maintained Above 183°C Time within 5°C of Actual Peak Temperature Peak Temperature Range Ramp-down Rate Time 25°C to Peak Temperature Convection or IR/Convection 3°C/sec. max. 120 sec. max 60 sec. to 150 sec. 10 sec. to 20 sec. 220 +5/-0°C or 235 +5/-0°C 6°C/sec. 6 min. max VPR 10°C/sec. 60 sec. 215 to 219°C or 235 +5/-0°C 10°C/sec. Small packages may be subject to higher temperatures if they are reflowed in boards with larger components. In this case, small packages may have to withstand temperatures of up to 235xC, not 220xC IR reflow . Recommended package reflow conditions depend on package thickness and volume. See Table 8 below. Table Recommended Package Reflow Conditions 1, 2, 3 Parameter Temperature Convection |
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