MAX5703/MAX5704/MAX5705
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MAX5704ATB+ (pdf) |
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MAX5703/MAX5704/MAX5705 Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output Voltage DACs with Internal Reference and SPI Interface The MAX5703/MAX5704/MAX5705 single-channel, lowpower, 8-/10-/12-bit, voltage-output digital-to-analog converters DACs include output buffers and an internal reference that is selectable to be 2.048V, 2.500V, or 4.096V. The MAX5703/MAX5704/MAX5705 accept a wide supply voltage range of 2.7V to 5.5V with extremely low power < 1mW consumption to accommodate most low-voltage applications. A precision external reference input allows rail-to-rail operation and presents a 100kI typ load to an external reference. The MAX5703/MAX5704/MAX5705 have a 50MHz, 3-wire serial interface. The DAC output is buffered and has a low supply current of 155FA typical at 3V and a low offset error of Q0.5mV typical . On power-up, the MAX5703/ MAX5704/MAX5705 reset the DAC outputs to zero, providing additional safety for applications that drive valves or other transducers which need to be off on power-up. The internal reference is initially powered down to allow use of an external reference. The MAX5703/MAX5704/MAX5705 include a userconfigurable active-low asynchronous input, AUX for additional flexibility. This input can be programmed to asynchronously clear CLR or temporarily gate the DAC output to a user-programmable value. A dedicated active-low asynchronous LDAC input is also included. This allows simultaneous output updates of multiple devices. The MAX5703/MAX5704/MAX5705 are available in 10-pin TDFN/µMAXM packages and are specified over the -40NC to +125NC temperature range. Programmable Voltage and Current Sources Gain and Offset Adjustment Automatic Tuning and Optical Control Power Amplifier Control and Biasing Process Control and Servo Loops Portable Instrumentation Data Acquisition Benefits and Features S Single High-Accuracy DAC Channel 12-Bit Accuracy Without Adjustments ±1 LSB INL Buffered Voltage Output Monotonic Over All Operating Conditions S Three Precision Selectable Internal References 2.048V, 2.500V, or 4.096V S Internal Output Buffer Rail-to-Rail Operation with External Reference 6.3µs Settling Time Output Directly Drives 2kI Loads S Small, 10-Pin, 2mm x 3mm TDFN and 3mm x 5mm µMAX Packages S Wide 2.7V to 5.5V Supply Range S Flexible 1.8V to 5.5V VDDIO S 50MHz, 3-Wire, SPI/QSPI/MICROWIRE/DSP- Compatible Serial Interface S Power-On-Reset to Zero-Scale DAC Output S User-Configurable Asynchronous I/O Functions CLR, LDAC, GATE S Three Software-Selectable Power-Down Output Impedances 1kI, 100kI, or High Impedance S Low 155µA DAC Supply Current at 3V Functional Diagram VDDIO INTERNAL REFERENCE / EXTERNAL BUFFER MAX5703 MAX5704 MAX5705 CODE 8 -/ 10 -/ SCLK REGISTER LATCH 12-BIT DAC BUFFER SERIAL INTERFACE AUX LDAC CODE CLEAR / RESET Ordering Information appears at end of data sheet. For related parts and recommended products to use with this part, refer to: For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at MAX5703/MAX5704/MAX5705 Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output Voltage DACs with Internal Reference and SPI Interface ABSOLUTE MAXIMUM RATINGS VDD to +6V VDDIO to +6V OUT, REF to GND.........-0.3V to lower of VDD + 0.3V and +6V CS, SCLK, DIN, AUX, LDAC to GND.......................-0.3V to +6V Continuous Power Dissipation TA = +70NC TDFN derate 14.9mW/NC above +70NC ................1188.7mW µMAX derate 8.8mW/NC above +70NC ...................707.3mW Maximum Continuous Current into Any Pin..................... ±50mA Operating Temperature Range......................... -40NC to +125NC Storage Temperature Range............................. -65NC to +150NC Lead Temperature soldering, Soldering Temperature Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS Note 1 TDFN Junction-to-Ambient Thermal Resistance µMAX Junction-to-Ambient Thermal Resistance Junction-to-Ambient Thermal Resistance Note 1 Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to ELECTRICAL CHARACTERISTICS VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI , TA = -40NC to +125NC, unless otherwise noted. Note 2 PARAMETER DC PERFORMANCE Note 3 Resolution and Monotonicity Integral Nonlinearity Note 4 Differential Nonlinearity Note 4 Offset Error Note 5 Offset Error Drift Gain Error Note 5 Gain Temperature Coefficient Zero-Scale Error Full-Scale Error CONDITIONS N INL DNL OE MAX5703 MAX5704 MAX5705 MAX5703, 8 bits MAX5704, 10 bits MAX5705, 12 bits MAX5703, 8 bits MAX5704, 10 bits MAX5705, 12 bits GE With respect to VREF With respect to VREF MIN TYP MAX UNITS 8 10 12 -1 -1 -5 5 ±10 Bits +1 +1 +5 mV FV/NC %FS ppm of FS/NC mV %FS Maxim Integrated 2 MAX5703/MAX5704/MAX5705 Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output Voltage DACs with Internal Reference and SPI Interface ELECTRICAL CHARACTERISTICS continued VDD = 2.7V to 5.5V, VDDIO = 1.8V to 5.5V, VGND = 0V, CL = 200pF, RL = 2kI , TA = -40NC to +125NC, unless otherwise noted. Note 2 PARAMETER DAC OUTPUT CHARACTERISTICS No load Ordering Information PART PIN-PACKAGE RESOLUTION BIT MAX5703ATB+T 10 TDFN-EP* MAX5703AUB+ 10 FMAX MAX5704ATB+T 10 TDFN-EP* MAX5704AUB+ 10 FMAX MAX5705AAUB+ 10 FMAX MAX5705BATB+T 10 TDFN-EP* MAX5705BAUB+ 10 FMAX Note All devices are specified over the -40°C to +125°C temperature range. +Denotes a lead Pb -free/RoHS-compliant package. T = Tape and reel. *EP = Exposed pad. INTERNAL REFERENCE TEMPCO ppm/NC 10 typ , 25 max 10 typ , 25 max 10 typ , 25 max 10 typ , 25 max 4 typ , 12 max 10 typ , 25 max 10 typ , 25 max PROCESS BiCMOS Chip Information Package Information For the latest package outline information and land patterns footprints , go to Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 10 TDFN-EP 10 FMAX PACKAGE CODE T1032N+1 U10+2 OUTLINE NO. 21-0429 21-0061 LAND PATTERN NO. 90-0082 90-0330 Maxim Integrated 25 MAX5703/MAX5704/MAX5705 Ultra-Small, Single-Channel, 8-/10-/12-Bit Buffered Output Voltage DACs with Internal Reference and SPI Interface 0 1 2 3 Initial release Released MAX5703/MAX5704. Updated the Electrical Characteristics. Released the MAX5703/MAX5704/MAX5705 TDFN packages. Added details to AUX input description PAGES CHANGED 25 14, 15, 22 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values min and max limits shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA |
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