DS8007
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DS8007-KIT (pdf) |
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Multiprotocol Dual Smart Card Interface DS8007 The DS8007 multiprotocol dual smart card interface is a low-cost, dual smart card reader interface supporting all ISO 7816, and GSM11-11 requirements. Through its 8-bit parallel bus and dedicated address selects the DS8007 can easily and directly connect to the nonmultiplexed byte-wide bus of a Maxim secure microcontroller. Optionally, the parallel bus can be multiplexed to allow direct access to the multiplexed bus of an 80C51-compatible microcontroller through MOVX memory addressing. One integrated ISO 7816 UART is multiplexed among the interfaces to allow high-speed automatic smart card processing with each card-possessing, independent, variable, baud-rate capability. The card interface is controlled by internal sequencers that support automatic activation and deactivation sequencing, handling all actions required for T = 0, T = 1, and synchronous protocols. Emergency deactivation is also supported in case of supply dropout. A third card is supported through the auxiliary I/O. The same set of I/O can optionally be used as additional serial interface for the UART. The DS8007 provides all electrical signals necessary to interface with two smart cards. The integrated voltage converter ensures full cross-compatibility between 1.8V/ 3V/5V cards and a 1.8V/3V/5V environment, and allows operation within a 2.7V to 6V supply voltage range. Banking Applications Point-of-Sale Terminals, Debit/Credit Payment Terminals, PIN Pads, Automated Teller Machines Telecommunications Pay Television Access Control Ordering Information PART TEMP RANGE SMART CARDS SUPPORTED PINPACKAGE DS8007-ENG -40°C to +85°C 2 + auxiliary 48 LQFP DS8007-ENG+ -40°C to +85°C 2 + auxiliary 48 LQFP +Denotes a lead Pb -free/RoHS-compliant package. EMV is a registered trademark of EMVCo LLC. MAXQ is a registered trademark of Maxim Integrated Products, Inc. Integrated ISO 7816 UART Provides Complete Interface/Control for Two Separate Smart Card Devices 8kV min ESD Protection on Card Interfaces Internal IC Card Supply Voltage Generation 5.0V ±5%, 65mA max 3.0V ±8%, 50mA max 1.8V ±10%, 30mA max Automatic Card Activation, Deactivation, and Data Communication Controlled by Dedicated Internal Sequencer Host Interface Through an 8-Bit Parallel Bus UserSelectable Multiplexed or Nonmultiplexed Modes Chip Select and Three-State Bus Allow Multiple Devices Card Readers and Memories on Bus 8-Character Receive FIFO with Optional Programmable Depth/Threshold I/O Interface Pin to External ISO 7816 UART for Auxiliary Interface Separate Card Clock Generation Up to 10MHz with 2x Frequency Doubling Selectable Card Clock Stop High, Stop Low, or Internally Generated 1.25MHz for Card PowerDown EMV-Certified Reference Design and Evaluation Kit Available DS8007-KIT Pin Configuration 48 DELAY 47 XTAL1 46 XTAL2 45 AD0 44 AD1 43 AD2 42 AD3 41 INTAUX 40 INT 39 ALE 38 CS 37 WR RSTOUT 1 I/OAUX 2 I/OA 3 C8A 4 PRESA 5 C4A 6 GNDA 7 CLKA 8 VCCA 9 RSTA 10 I/OB 11 C8B 12 DS8007 36 RD 35 D7 34 D6 33 D5 32 D4 31 D3 30 D2 29 D1 28 D0 27 VDD 26 CPA2 25 AGND PRESB 13 C4B 14 GNDB 15 CLKB 16 VCCB 17 RSTB 18 GND 19 VUP 20 CPA1 21 CPB1 22 VDDA 23 CPB2 24 LQFP Typical Operating Circuit appears at end of data sheet. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at DS8007 Multiprotocol Dual Smart Card Interface ABSOLUTE MAXIMUM RATINGS Voltage Range on VDD Relative to Ground ...........-0.5V to +6.5V Voltage Range on VDDA Relative to Ground .........-0.5V to +6.5V Voltage Range on Any Pin Relative to Ground Pins CPA1, CPA2, CPB1, CPB2, and VUP .........-0.5V to +7.5V All Other to VDD + 0.5V Maximum Junction Temperature Continuous Power Dissipation TA = +70°C LQFP Multilayer Board derate 22mW/°C above +70°C .................................1782mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature soldering, 10s .................................+300°C Soldering Temperature reflow Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS VDD = +3.3V, VDDA = +3.3V, TA = +25°C, unless otherwise noted. Note 1 PARAMETER Digital Supply Voltage Step-Up Converter Supply Voltage SYMBOL VDD VDDA CONDITIONS Power-Down VDD Current Cards Inactive Cards Active Sleep Mode VDD Current Cards Active IPD ISTOP fXTAL = 0MHz fXTAL = 0MHz, fCLK = 0MHz, VCCx = 5V fCLK = 0MHz, VCCx = 5V Active VDD Current 5V Cards Active VDD Current 3V Cards Power-Fail Reset Voltage Reset Threshold VRST VHYS VDRST 3x VDD step-up ICCA + ICCB = 80mA, VDD = 2.7V, fXTAL = 20MHz, fCLK = 10MHz 2x VDD step-up ICCA + ICCB = 80mA, fXTAL = 20MHz, fCLK = 10MHz, VDD = 2.7V No step-up ICCA + ICCB = 80mA, fXTAL = 20MHz, fCLK = 10MHz, VDD = 5V Threshold voltage falling Hysteresis Delay Pin RSTOUT PIN Output Voltage Output Current Output Capacitance VDO IDO CDO VDELAY = 0V VDELAY = VDD Output High Voltage Output Low Voltage Leakage Current VOHRSTO IOH = -1mA VOLRSTO IOL = 2mA VOL = 0V, VOH = 5V |
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