MX29LV160DBXBI-70G

MX29LV160DBXBI-70G Datasheet

MX29LV160D T/B

Part	Datasheet
MX29LV160DBXBI-70G	MX29LV160DBXBI-70G (pdf)

Related Parts	Information
MX29LV160DBXHI-90G	MX29LV160DBXHI-90G
MX29LV160DTXHI-90G	MX29LV160DTXHI-90G
MX29LV160DTTI-70G	MX29LV160DTTI-70G
MX29LV160DBTI-70G	MX29LV160DBTI-70G
MX29LV160DTXEI-70G	MX29LV160DTXEI-70G
MX29LV160DBXHI-70G	MX29LV160DBXHI-70G
MX29LV160DTXBI-70G	MX29LV160DTXBI-70G
MX29LV160DBXEI-70G	MX29LV160DBXEI-70G
MX29LV160DTXHI-70G	MX29LV160DTXHI-70G

PDF Datasheet Preview
MX29LV160D T/B MX29LV160D T/B DATASHEET P/N:PM1315 MX29LV160D T/B Contents 5 GENERAL 6 PIN 7 PIN 9 BLOCK 10 BLOCK DIAGRAM 11 BLOCK 12 Table MX29LV160DT SECTOR 12 Table MX29LV160DB SECTOR ARCHITECTURE 13 BUS 14 Table BUS 14 Table BUS 15 FUNCTIONAL OPERATION 16 WRITE COMMANDS/COMMAND 16 REQUIREMENTS FOR READING ARRAY 16 RESET# 17 SECTOR PROTECT 17 CHIP UNPROTECT 17 HARDWARE WRITE 17 ACCELERATED PROGRAMMING OPERATION 17 TEMPORARY SECTOR UNPROTECT 18 AUTOMATIC SELECT 18 VERIFY SECTOR PROTECT STATUS 18 DATA 18 LOW VCC WRITE 18 WRITE PULSE "GLITCH" 18 LOGICAL 19 POWER-UP 19 POWER-UP WRITE 19 POWER SUPPLY 19 COMMAND 20 TABLE MX29LV160D T/B COMMAND 20 AUTOMATIC PROGRAMMING OF THE MEMORY 21 ERASING THE MEMORY 21 SECTOR 22 CHIP 23 SECTOR ERASE 23 SECTOR ERASE 24 AUTOMATIC SELECT 24 AUTOMATIC SELECT COMMAND 24 P/N:PM1315 MX29LV160D T/B READ MANUFACTURER ID OR DEVICE 25 VERIFY SECTOR GROUP 25 RESET 25 COMMON FLASH MEMORY INTERFACE CFI 26 QUERY COMMAND AND COMMON FLASH INTERFACE CFI 26 Table CFI mode Identification Data 26 Table CFI Mode System Interface Data 26 Table CFI Mode Device Geometry Data 27 Table CFI Mode Primary Vendor-Specific Extended Query Data 28 ELECTRICAL 29 ABSOLUTE MAXIMUM STRESS 29 OPERATING TEMPERATURE AND 29 DC 30 SWITCHING TEST 31 SWITCHING TEST 31 AC 32 WRITE COMMAND 33 Figure COMMAND WRITE 33 READ/RESET 34 Figure READ TIMING 34 Figure RESET# TIMING 35 ERASE/PROGRAM 36 Figure AUTOMATIC CHIP ERASE TIMING 36 Figure AUTOMATIC CHIP ERASE ALGORITHM 37 Figure AUTOMATIC SECTOR ERASE TIMING 38 Figure AUTOMATIC SECTOR ERASE ALGORITHM 39 Figure ERASE SUSPEND/RESUME 40 Figure AUTOMATIC PROGRAM TIMING 41 Figure ACCELERATED PROGRAM TIMING 41 Figure CE# CONTROLLED WRITE TIMING 42 Figure AUTOMATIC PROGRAMMING ALGORITHM 43 SECTOR PROTECT/CHIP 44 Figure SECTOR PROTECT/CHIP UNPROTECT WAVEFORM RESET# Control .............................. 44 Figure IN-SYSTEM SECTOR PROTECT WITH 45 Figure CHIP UNPROTECT ALGORITHMS WITH 46 Table TEMPORARY SECTOR 47 Figure TEMPORARY SECTOR UNPROTECT 47 Figure TEMPORARY SECTOR UNPROTECT 48 Figure SILICON ID READ TIMING 49 WRITE OPERATION 50 Figure DATA# POLLING TIMING WAVEFORM DURING AUTOMATIC ALGORITHM ....................... 50 Figure DATA# POLLING 51 P/N:PM1315 MX29LV160D T/B P/N:PM1315 MX29LV160D T/B 16M-BIT [2M x 8 / 1M x 16] 3V SUPPLY FLASH MEMORY GENERAL FEATURES • Byte/Word mode switchable - 2,097,152 x8 / 1,048,576 x16 • Sector Structure - 16K-Byte x 1, 8K-Byte x 2, 32K-Byte x 1, 64K-Byte x 31 - Provides sector protect function to prevent program or erase operation in the protected sector - Provides chip unprotect function to allow code changing - Provides temporary sector unprotect function for code changing in previously protected sector • Power Supply Operation - Vcc to volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to x Vcc • Low Vcc write inhibit Vcc Vlko • Compatible with JEDEC standard - Pinout and software compatible to single power supply Flash • Functional compatible with MX29LV160C device PERFORMANCE • High Performance - Fast access time 70ns - Word program time 11us/word typical - Fast erase time 0.7s/sector, 15s/chip typical • Low Power Consumption - Low active read current 5mA typical at 5MHz - Low standby current 5uA typical • Typical 100,000 erase/program cycle • 20 years data retention SOFTWARE FEATURES • Erase Suspend/ Erase Resume - Suspends sector erase operation to read data from or program data to another sector which is not being erased • Status Reply - Data# Polling & Toggle bits provide detection of program and erase operation completion • Support Common Flash Interface CFI HARDWARE FEATURES • Ready/Busy# RY/BY# Output - Provides a hardware method of detecting program and erase operation completion • Hardware Reset# Input - Provides a hardware method to reset the internal state machine to read mode • WP#/ACC - Provide accelerated program capability PACKAGE • 48-Pin TSOP • 48-Ball CSP TFBGA • 48-Ball WFBGA/XFLGA • All devices are RoHS Compliant P/N:PM1315 MX29LV160D T/B MX29LV160DT/B is a 16Mbit flash memory that can be organized as 2Mbytes of 8 bits each or as 1Mwords of 16 bits each. These devices operate over a voltage range of 2.7V to 3.6V typically using a 3V power supply input. The memory array is divided into 32 equal 64 Kilo byte blocks. However, depending on the device being used as a Top-Boot or Bottom-Boot device. The outermost one sector at the top or at the bottom are respectively the boot blocks for this device. The MX29LV160DT/B is offered in a 48-pin TSOP, 48-ball XFLGA/WFBGA and a 48-ball CSP TFBGA JEDEC standard package. These packages are offered in leaded, as well as lead-free versions that are compliant to the RoHS specifications. The software algorithm used for this device also adheres to the JEDEC standard for single power supply devices. These flash parts can be programmed in system or on commercially available EPROM/ Flash programmers. Separate OE# and CE# Output Enable and Chip Enable signals are provided to simplify system design. When used with high speed processors, the 70ns read access time of this flash memory permits operation with minimal time lost due to system timing delays. The automatic write algorithm provided on Macronix flash memories perform an automatic erase prior to write. The user only needs to provide a write command to the command register. The on-chip state machine automatically controls the program and erase functions including all necessary internal timings. Since erase and write operations take much longer time than read operations, erase/write can be interrupted to perform read operations in other sectors of the device. For this, Erase Suspend operation along with Erase Resume operation are provided. Data# polling or Toggle bits are used to indicate the end of the erase/write operation. These devices are manufactured at the Macronix fabrication facility using the time tested and proven Macronix's advance technology. This proprietary non-epi process provides a very high degree of latch-up protection for stresses up to 100 milliamperes on address and data pins from -1V to 1.5xVCC. With low power consumption and enhanced hardware and software features, this flash memory retains data reliably for at least twenty years. Erase and programming functions have been tested to meet a typical specification of 100,000 cycles of operation. P/N:PM1315 PIN CONFIGURATIONS 48 TSOP Standard Type 12mm x 20mm RESET# WP#/ACC RY/BY# MX29LV160D T/B BYTE# Q15/A-1 48-Ball CSP TFBGA/LFBGA Ball Pitch = mm, Top View, Balls Facing Down, 6 x 8 mm A16 BYTE# Q15/ A-1 RESET# WP#/ P/N:PM1315 MX29LV160D T/B 48-Ball WFBGA Balls Facing Down, 4 x 6 x mm RESET# ORDERING INFORMATION MX29LV160DTTI-70G MX29LV160DBTI-70G MX29LV160DBXBI-70G MX29LV160DTGBI-70G MX29LV160DBGBI-70G MX29LV160DTXHI-70G MX29LV160DBXHI-70G MX29LV160DTXEI-70G MX29LV160DBXEI-70G ACCESS Ball Pitch/ TIME ns Ball Size 70 0.8mm/0.3mm 70 0.8mm/0.3mm 70 0.8mm/0.4mm 70 0.8mm/0.4mm MX29LV160DTXGI-70G* 70 0.8mm/0.4mm MX29LV160DBXGI-70G* 70 0.8mm/0.4mm PACKAGE 48 Pin TSOP Normal Type 48 Pin TSOP Normal Type 48 Ball CSP TFBGA ball size:0.3mm 48 Ball CSP TFBGA ball size:0.3mm 48 Ball XFLGA 4 x 6 x 0.5mm 48 Ball XFLGA 4 x 6 x 0.5mm 48 Ball WFBGA 4 x 6 x 0.75mm 48 Ball WFBGA 4 x 6 x 0.75mm 48 Ball LFBGA ball size:0.4mm 48 Ball LFBGA ball size:0.4mm 48 Ball TFBGA ball size 0.4mm, height 1.2mm 48 Ball TFBGA ball size 0.4mm, height 1.2mm * Advanced Information Remark P/N:PM1315 MX29LV160D T/B PART NAME DESCRIPTION MX 29 LV 160 D T I 70 G OPTION G RoHS Compliant package SPEED 70 70ns TEMPERATURE RANGE C Commercial to I Industrial to PACKAGE T TSOP X BGA XB TFBGA - 6 x 8 x 1.2mm, Pitch 0.8mm, 0.3mm Ball XE LFBGA - 6 x 8 x 1.3mm, Pitch 0.8mm, 0.4mm Ball XH WFBGA - 4 x 6 x 0.75mm, Pitch 0.5mm, 0.3mm Ball XG TFBGA - 6 x 8 x 1.2mm, Pitch 0.8mm, 0.4mm Ball GB XFLGA - 4 x 6 x 0.5mm, Pitch 0.8mm, 0.4mm Ball BOOT BLOCK TYPE T Top Boot B Bottom Boot DENSITY & MODE 160 16Mb, x8/x16 Boot Block TYPE LV 3V DEVICE 29:Flash P/N:PM1315 PACKAGE INFORMATION MX29LV160D T/B P/N:PM1315 48-Ball TFBGA for MX29LV160D TXBI/BXBI MX29LV160D T/B P/N:PM1315 48-Ball WFBGA for MX29LV160D TXHI/BXHI MX29LV160D T/B P/N:PM1315 48-Ball XFLGA for MX29LV160D TGBI/BGBI MX29LV160D T/B P/N:PM1315 48-Ball LFBGA for MX29LV160D TXEI/BXEI Added TXGI/BXGI ordering information and part name information TFBGA PACKAGE Added Tsrw AC/WAVEFORM, Min. 45ns Added WP#ACC PIN note Modified description for RoHS compliance Modified Figure CE# Controlled Write Timing Waveform Page P5,30 P5-6,56 P57-58,64 Date AUG/11/2008 MAY/18/2009 P32,34 P9 P5,58 P42 DEC/22/2011 P/N:PM1315 MX29LV160D T/B Except for customized products which has been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright Macronix International Co., Ltd. All rights reserved. Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, NBiit, Macronix NBit, eLiteFlash, XtraROM, Phines, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE are trademarks or registered trademarks of Macronix International Co., Ltd. The names and brands of other companies are for identification purposes only and may be claimed as the property of the respective companies. For the contact and order information, please visit Macronix’s Web site at: MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 66

PDF Datasheet Preview

MX29LV160D T/B

MX29LV160D T/B DATASHEET

P/N:PM1315

MX29LV160D T/B

Contents
5 GENERAL 6 PIN 7 PIN 9 BLOCK 10 BLOCK DIAGRAM 11 BLOCK 12

Table MX29LV160DT SECTOR 12 Table MX29LV160DB SECTOR ARCHITECTURE 13 BUS 14 Table BUS 14 Table BUS 15 FUNCTIONAL OPERATION 16 WRITE COMMANDS/COMMAND 16 REQUIREMENTS FOR READING ARRAY 16 RESET# 17 SECTOR PROTECT 17 CHIP UNPROTECT 17 HARDWARE WRITE 17 ACCELERATED PROGRAMMING OPERATION 17 TEMPORARY SECTOR UNPROTECT 18 AUTOMATIC SELECT 18 VERIFY SECTOR PROTECT STATUS 18 DATA 18 LOW VCC WRITE 18 WRITE PULSE "GLITCH" 18 LOGICAL 19 POWER-UP 19 POWER-UP WRITE 19 POWER SUPPLY 19 COMMAND 20 TABLE MX29LV160D T/B COMMAND 20 AUTOMATIC PROGRAMMING OF THE MEMORY 21 ERASING THE MEMORY 21 SECTOR 22 CHIP 23 SECTOR ERASE 23 SECTOR ERASE 24 AUTOMATIC SELECT 24 AUTOMATIC SELECT COMMAND 24

P/N:PM1315

MX29LV160D T/B

READ MANUFACTURER ID OR DEVICE 25 VERIFY SECTOR GROUP 25 RESET 25 COMMON FLASH MEMORY INTERFACE CFI 26 QUERY COMMAND AND COMMON FLASH INTERFACE CFI 26 Table CFI mode Identification Data 26 Table CFI Mode System Interface Data 26 Table CFI Mode Device Geometry Data 27 Table CFI Mode Primary Vendor-Specific Extended Query Data 28 ELECTRICAL 29 ABSOLUTE MAXIMUM STRESS 29 OPERATING TEMPERATURE AND 29 DC 30 SWITCHING TEST 31 SWITCHING TEST 31 AC 32 WRITE COMMAND 33 Figure COMMAND WRITE 33 READ/RESET 34 Figure READ TIMING 34 Figure RESET# TIMING 35 ERASE/PROGRAM 36 Figure AUTOMATIC CHIP ERASE TIMING 36 Figure AUTOMATIC CHIP ERASE ALGORITHM 37 Figure AUTOMATIC SECTOR ERASE TIMING 38 Figure AUTOMATIC SECTOR ERASE ALGORITHM 39 Figure ERASE SUSPEND/RESUME 40 Figure AUTOMATIC PROGRAM TIMING 41 Figure ACCELERATED PROGRAM TIMING 41 Figure CE# CONTROLLED WRITE TIMING 42 Figure AUTOMATIC PROGRAMMING ALGORITHM 43 SECTOR PROTECT/CHIP 44 Figure SECTOR PROTECT/CHIP UNPROTECT WAVEFORM RESET# Control .............................. 44 Figure IN-SYSTEM SECTOR PROTECT WITH 45 Figure CHIP UNPROTECT ALGORITHMS WITH 46 Table TEMPORARY SECTOR 47 Figure TEMPORARY SECTOR UNPROTECT 47 Figure TEMPORARY SECTOR UNPROTECT 48 Figure SILICON ID READ TIMING 49 WRITE OPERATION 50 Figure DATA# POLLING TIMING WAVEFORM DURING AUTOMATIC ALGORITHM ....................... 50 Figure DATA# POLLING 51

P/N:PM1315

MX29LV160D T/B
P/N:PM1315

MX29LV160D T/B
16M-BIT [2M x 8 / 1M x 16] 3V SUPPLY FLASH MEMORY

GENERAL FEATURES
• Byte/Word mode switchable
- 2,097,152 x8 / 1,048,576 x16
• Sector Structure
- 16K-Byte x 1, 8K-Byte x 2, 32K-Byte x 1, 64K-Byte x 31 - Provides sector protect function to prevent program or erase operation in the protected sector - Provides chip unprotect function to allow code changing - Provides temporary sector unprotect function for code changing in previously protected sector
• Power Supply Operation - Vcc to volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to x Vcc
• Low Vcc write inhibit Vcc Vlko
• Compatible with JEDEC standard - Pinout and software compatible to single power supply Flash
• Functional compatible with MX29LV160C device

PERFORMANCE
• High Performance
- Fast access time 70ns - Word program time 11us/word typical - Fast erase time 0.7s/sector, 15s/chip typical
• Low Power Consumption - Low active read current 5mA typical at 5MHz - Low standby current 5uA typical
• Typical 100,000 erase/program cycle
• 20 years data retention

SOFTWARE FEATURES
• Erase Suspend/ Erase Resume
- Suspends sector erase operation to read data from or program data to another sector which is not being erased
• Status Reply - Data# Polling & Toggle bits provide detection of program and erase operation completion
• Support Common Flash Interface CFI

HARDWARE FEATURES
• Ready/Busy# RY/BY# Output
- Provides a hardware method of detecting program and erase operation completion
• Hardware Reset# Input
- Provides a hardware method to reset the internal state machine to read mode
• WP#/ACC
- Provide accelerated program capability

PACKAGE
• 48-Pin TSOP
• 48-Ball CSP TFBGA
• 48-Ball WFBGA/XFLGA
• All devices are RoHS Compliant

P/N:PM1315

MX29LV160D T/B

MX29LV160DT/B is a 16Mbit flash memory that can be organized as 2Mbytes of 8 bits each or as 1Mwords of 16 bits each. These devices operate over a voltage range of 2.7V to 3.6V typically using a 3V power supply input. The memory array is divided into 32 equal 64 Kilo byte blocks. However, depending on the device being used as a Top-Boot or Bottom-Boot device. The outermost one sector at the top or at the bottom are respectively the boot blocks for this device.

The MX29LV160DT/B is offered in a 48-pin TSOP, 48-ball XFLGA/WFBGA and a 48-ball CSP TFBGA JEDEC standard package. These packages are offered in leaded, as well as lead-free versions that are compliant to the RoHS specifications. The software algorithm used for this device also adheres to the JEDEC standard for single power supply devices. These flash parts can be programmed in system or on commercially available EPROM/ Flash programmers.

Separate OE# and CE# Output Enable and Chip Enable signals are provided to simplify system design. When used with high speed processors, the 70ns read access time of this flash memory permits operation with minimal time lost due to system timing delays.

The automatic write algorithm provided on Macronix flash memories perform an automatic erase prior to write. The user only needs to provide a write command to the command register. The on-chip state machine automatically controls the program and erase functions including all necessary internal timings. Since erase and write operations take much longer time than read operations, erase/write can be interrupted to perform read operations in other sectors of the device. For this, Erase Suspend operation along with Erase Resume operation are provided. Data# polling or Toggle bits are used to indicate the end of the erase/write operation.

These devices are manufactured at the Macronix fabrication facility using the time tested and proven Macronix's advance technology. This proprietary non-epi process provides a very high degree of latch-up protection for stresses up to 100 milliamperes on address and data pins from -1V to 1.5xVCC.

With low power consumption and enhanced hardware and software features, this flash memory retains data reliably for at least twenty years. Erase and programming functions have been tested to meet a typical specification of 100,000 cycles of operation.

P/N:PM1315

PIN CONFIGURATIONS
48 TSOP Standard Type 12mm x 20mm

RESET#

WP#/ACC

RY/BY#

MX29LV160D T/B

BYTE#

Q15/A-1
48-Ball CSP TFBGA/LFBGA Ball Pitch = mm, Top View, Balls Facing Down, 6 x 8 mm

A16 BYTE#

Q15/ A-1

RESET#

WP#/

P/N:PM1315

MX29LV160D T/B
48-Ball WFBGA Balls Facing Down, 4 x 6 x mm

RESET#
ORDERING INFORMATION

MX29LV160DTTI-70G MX29LV160DBTI-70G MX29LV160DBXBI-70G MX29LV160DTGBI-70G MX29LV160DBGBI-70G MX29LV160DTXHI-70G MX29LV160DBXHI-70G MX29LV160DTXEI-70G MX29LV160DBXEI-70G

ACCESS Ball Pitch/ TIME ns Ball Size
70 0.8mm/0.3mm 70 0.8mm/0.3mm 70 0.8mm/0.4mm 70 0.8mm/0.4mm

MX29LV160DTXGI-70G*
70 0.8mm/0.4mm

MX29LV160DBXGI-70G*
70 0.8mm/0.4mm

PACKAGE
48 Pin TSOP Normal Type 48 Pin TSOP Normal Type 48 Ball CSP TFBGA ball size:0.3mm 48 Ball CSP TFBGA ball size:0.3mm 48 Ball XFLGA 4 x 6 x 0.5mm 48 Ball XFLGA 4 x 6 x 0.5mm 48 Ball WFBGA 4 x 6 x 0.75mm 48 Ball WFBGA 4 x 6 x 0.75mm 48 Ball LFBGA ball size:0.4mm 48 Ball LFBGA ball size:0.4mm
48 Ball TFBGA ball size 0.4mm, height 1.2mm
48 Ball TFBGA ball size 0.4mm, height 1.2mm
* Advanced Information

Remark

P/N:PM1315

MX29LV160D T/B

PART NAME DESCRIPTION

MX 29 LV 160 D T I 70 G

OPTION G RoHS Compliant package

SPEED 70 70ns

TEMPERATURE RANGE C Commercial to I Industrial to

PACKAGE T TSOP X BGA

XB TFBGA - 6 x 8 x 1.2mm, Pitch 0.8mm, 0.3mm Ball XE LFBGA - 6 x 8 x 1.3mm, Pitch 0.8mm, 0.4mm Ball XH WFBGA - 4 x 6 x 0.75mm, Pitch 0.5mm, 0.3mm Ball XG TFBGA - 6 x 8 x 1.2mm, Pitch 0.8mm, 0.4mm Ball GB XFLGA - 4 x 6 x 0.5mm, Pitch 0.8mm, 0.4mm Ball

BOOT BLOCK TYPE T Top Boot B Bottom Boot

DENSITY & MODE 160 16Mb, x8/x16 Boot Block

TYPE LV 3V

DEVICE 29:Flash

P/N:PM1315

PACKAGE INFORMATION

MX29LV160D T/B

P/N:PM1315
48-Ball TFBGA for MX29LV160D TXBI/BXBI

MX29LV160D T/B

P/N:PM1315
48-Ball WFBGA for MX29LV160D TXHI/BXHI

MX29LV160D T/B

P/N:PM1315
48-Ball XFLGA for MX29LV160D TGBI/BGBI

MX29LV160D T/B

P/N:PM1315
48-Ball LFBGA for MX29LV160D TXEI/BXEI
Added TXGI/BXGI ordering information
and part name information TFBGA PACKAGE

Added Tsrw AC/WAVEFORM, Min. 45ns

Added WP#ACC PIN note

Modified description for RoHS compliance

Modified Figure CE# Controlled Write Timing Waveform

Page P5,30 P5-6,56 P57-58,64

Date AUG/11/2008

MAY/18/2009

P32,34 P9 P5,58 P42

DEC/22/2011

P/N:PM1315

MX29LV160D T/B

Except for customized products which has been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright Macronix International Co., Ltd. All rights reserved. Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, NBiit, Macronix NBit, eLiteFlash, XtraROM, Phines, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE are trademarks or registered trademarks of Macronix International Co., Ltd. The names and brands of other companies are for identification purposes only and may be claimed as the property of the respective companies. For the contact and order information, please visit Macronix’s Web site at:

MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 66

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MX29LV160DBXBI-70G Datasheet file may be downloaded here without warranties.

Datasheet ID: MX29LV160DBXBI-70G 646964