MX25L8035E
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MX25L8035EM2I-10G (pdf) |
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MX25L8035E MX25L8035E DATASHEET P/N PM1551 MX25L8035E Contents 5 SOFTWARE 5 HARDWARE 6 GENERAL 7 Table Additional Feature 7 PIN CONFIGURATIONS 8 PIN 8 BLOCK 9 DATA 10 Table Protected Area 11 Table 4K-bit Secured OTP 11 Memory 12 Table Memory Organization 12 DEVICE 13 Figure Serial Modes 13 COMMAND 14 Table Command 14 1 Write Enable 15 2 Write Disable 15 3 Read Identification 15 4 Read Status Register 16 5 Write Status Register 17 Table Protection 17 6 Read Data Bytes 18 7 Read Data Bytes at Higher Speed 18 8 2 x I/O Read Mode 18 9 4 x I/O Read Mode 19 10 Sector Erase 19 11 Block Erase 20 12 Chip Erase 20 13 Page Program 20 14 4 x I/O Page Program 21 15 Deep Power-down 21 16 Release from Deep Power-down RDP , Read Electronic Signature 21 17 Read Electronic Manufacturer ID & Device ID REMS , REMS2 , 22 Table ID Definitions 22 18 Enter Secured OTP 22 19 Exit Secured OTP 22 P/N PM1551 MX25L8035E 20 Read Security Register 23 Table Security Register 23 21 Write Security Register 23 POWER-ON 24 ELECTRICAL 25 ABSOLUTE MAXIMUM 25 Figure 2.Maximum Negative Overshoot 25 CAPACITANCE TA = 25°C, f = 25 Figure Maximum Positive Overshoot 25 Figure INPUT TEST WAVEFORMS AND MEASUREMENT 26 Figure OUTPUT 26 Table DC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 27 Table AC CHARACTERISTICS Temperature = -40°C to 85°C for Industrial grade, VCC = 2.7V ~ 3.6V 28 Timing 29 Figure Serial Input 29 Figure Output 29 Figure WP# Setup Timing and Hold Timing during WRSR when 30 Figure Write Enable WREN Sequence Command 30 Figure Write Disable WRDI Sequence Command 30 Figure Read Identification RDID Sequence Command 31 Figure Read Status Register RDSR Sequence Command 31 Figure Write Status Register WRSR Sequence Command 31 Figure Read Data Bytes READ Sequence Command 32 Figure Read at Higher Speed FAST_READ Sequence Command 32 Figure 2 x I/O Read Mode Sequence Command 33 Figure 4 x I/O Read Mode Sequence Command 33 Figure 4 x I/O Read Enhance Performance Mode Sequence Command 34 Figure Sector Erase SE Sequence Command 35 Figure Block Erase BE Sequence Command 35 Figure Chip Erase CE Sequence Command 60 or 35 Figure Page Program PP Sequence Command 36 Figure 4 x I/O Page Program 4PP Sequence Command 36 Figure Deep Power-down DP Sequence Command 37 Figure Release from Deep Power-down and Read Electronic Signature RES Sequence Command AB . 37 Figure Release from Deep Power-down RDP Sequence Command 38 Figure Read Electronic Manufacturer & Device ID REMS Sequence Command 90 or EF or DF ........ 38 Figure Power-up 39 Table Power-Up 39 INITIAL DELIVERY 39 RECOMMENDED OPERATING 40 ERASE AND PROGRAMMING 41 P/N PM1551 MX25L8035E DATA 41 LATCH-UP 41 ORDERING 42 PART NAME 43 PACKAGE 44 P/N PM1551 MX25L8035E 8M-BIT [x 1/x 2/x 4] CMOS SERIAL FLASH GENERAL • Serial Peripheral Interface compatible -- Mode 0 and Mode 3 • 8M:8,388,608 x 1 bit structure or 4,194,304 x 2 bits two I/O read mode structure or 2,097,152 x 4 bits four I/O read mode structure • 256 Equal Sectors with 4K byte each - Any Sector can be erased individually • 16 Equal Blocks with 64K byte each - Any Block can be erased individually • Single Power Supply Operation - to volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V PERFORMANCE • High Performance - Fast read - 1 I/O 108MHz with 8 dummy cycles - 2 I/O 80MHz 2.7V~3.6V 104MHz 3.0V~3.6V with 4 dummy cycles - 4 I/O 108MHz with 6 dummy cycles - Fast access time 108MHz serial clock - Serial clock of two I/O read mode 80MHz 2.7V~3.6V 104MHz 3.0V~3.6V - Serial clock of four I/O read mode 108MHz, which is equivalent to 432MHz - Fast program time 0.7ms typ. and 3ms max. /page 256-byte per page - Byte program time 9us typical - Fast erase time 60ms typ. /sector 4K-byte per sector 0.4s typ. /block 64K-byte per block 3s typ. /chip • Low Power Consumption - Low active read current 25mA max. at 108MHz, and 10mA max. at 50MHz - Low active programming current 20mA max. - Low active erase current 20mA max. - Low standby current 20uA typ. 50uA max. - Deep power-down current 3uA typ. 20uA max. • Minimum 100,000 erase/program cycles • 20 years data retention SOFTWARE FEATURES • Input Data Format - 1-byte Command code • Advanced Security Features - Block lock protection The BP0-BP3 status bit defines the size of the area to be software protection against program and erase instructions - Additional 4K-bit secured OTP for unique identifier • Auto Erase and Auto Program Algorithm - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the program pulse widths Any page to be programed should have page in the erased state first • Status Register Feature • Electronic Identification - JEDEC 1-byte manufacturer ID and 2-byte device ID - RES command for 1-byte Device ID - All REMS,REMS2 and REMS4 commands for 1-byte manufacturer ID and 1-byte device ID P/N PM1551 MX25L8035E HARDWARE FEATURES • SCLK Input - Serial clock input • SI/SIO0 - Serial Data Input or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode • SO/SIO1 - Serial Data Output or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode • WP#/SIO2 - Hardware write protection or serial data Input/Output for 4 x I/O read mode • NC/SIO3 - NC pin or serial data Input/Output for 4 x I/O read mode • PACKAGE - 8-pin SOP 200mil - All Pb-free devices are RoHS Compliant P/N PM1551 MX25L8035E The MX25L8035E are 8,388,608 bit serial Flash memory, which is configured as 1,048,576 x 8 internally. When it is in two or four I/O read mode, the structure becomes 4,194,304 bits x 2 or 2,097,152 bits x The MX25L8035E feature a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input. When it is in two I/O read mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in four I/O read mode, the SI pin, SO pin, WP# pin and NC pin become SIO0 pin, SIO1 pin, SIO2 pin, and SIO3 pin for address/dummy bits input and data output. The MX25L8035E provides sequential read operation on whole chip. After program/erase command is issued, auto program/ erase algorithms which program/ erase and verify the specified page or sector/block locations will be executed. Program command is executed on byte basis, or page 256 bytes basis, and erase command is executes on sector 4K-byte , or block 64K-byte , or whole chip basis. To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit. Secured OTP and Block Protection, please see security feature and write status register section for more details. When the device is not in operation and CS# is high, it is put in standby mode and draws less than 100uA DC current. The MX25L8035E utilizes MXIC's proprietary memory cell, which reliably stores memory contents even after 100,000 program and erase cycles. Table Additional Feature Comparison Additional Features Protection and Security Part Name Flexible Block Protection BP0-BP3 ORDERING INFORMATION CLOCK MHz OPERATING CURRENT MAX. mA MX25L8035EM2I-10G STANDBY CURRENT MAX. uA TEMPERATURE PACKAGE -40°C~85°C 8-SOP 200mil Remark Pb-free P/N PM1551 MX25L8035E PART NAME DESCRIPTION MX 25 L 8035E M2 I OPTION G Pb-free SPEED 10 1 I/O 108MHz, 2 I/O 80MHz, 4 I/O 108MHz TEMPERATURE RANGE I Industrial -40°C to 85°C PACKAGE M2 200mil 8-SOP DENSITY & MODE 8035E 8Mb TYPE L 3V DEVICE 25 Serial Flash P/N PM1551 PACKAGE INFORMATION MX25L8035E P/N PM1551 MX25L8035E Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications. Copyright Macronix International Co., Ltd. All Rights Reserved. Macronix, MXIC, MXIC Logo, MX Logo, are trademarks or registered trademarks of Macronix International Co., Ltd.. The names and brands of other companies are for identification purposes only and may be claimed as the property of the respective companies. MACRONIX INTERNATIONAL CO., LTD. Macronix Offices Taiwan Headquarters, FAB2 Macronix, International Co., Ltd. 16, Li-Hsin Road, Science Park, Hsinchu, Taiwan, R.O.C. Tel +886-3-5786688 Fax +886-3-5632888 Taipei Office Macronix, International Co., Ltd. 19F, 4, Min-Chuan E. Road, Sec. 3, Taipei, Taiwan, R.O.C. Tel +886-2-2509-3300 Fax +886-2-2509-2200 Macronix Offices China Macronix Hong Kong Co., Limited. 702-703, 7/F, Building 9, Hong Kong Science Park, 5 Science Park West Avenue, Sha Tin, N.T. Tel +86-852-2607-4289 Fax +86-852-2607-4229 Macronix Hong Kong Co., Limited, SuZhou Office No.5, XingHai Rd, SuZhou Industrial Park, SuZhou China 215021 Tel +86-512-62580888 Ext 3300 Fax +86-512-62586799 Macronix Hong Kong Co., Limited, Shenzhen Office Room 1401 & 1404, Block A, TianAN Hi-Tech PLAZA Tower, Che Gong Miao, FutianDistrict, Shenzhen PRC 518040 Tel +86-755-83433579 Fax +86-755-83438078 Macronix Offices Japan Macronix Asia Limited. NKF Bldg. 5F, 1-2 Higashida-cho, Kawasaki-ku Kawasaki-shi, Kanagawa Pref. 210-0005, Japan Tel +81-44-246-9100 Fax +81-44-246-9105 Macronix Offices Korea Macronix Asia Limited. #906, 9F, Kangnam Bldg., 1321-4, Seocho-Dong, Seocho-Ku, 135-070, Seoul, Korea Tel +82-02-588-6887 Fax +82-02-588-6828 Macronix Offices Singapore Macronix Pte. 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