MX25L3255EXDI-10G

MX25L3255EXDI-10G Datasheet

MX25L3255E

Part	Datasheet
MX25L3255EXDI-10G	MX25L3255EXDI-10G (pdf)

Related Parts	Information
MX25L3255EM2I-10G	MX25L3255EM2I-10G
MX25L3255EXCI-10G	MX25L3255EXCI-10G

PDF Datasheet Preview
MX25L3255E MX25L3255E HIGH PERFORMANCE SERIAL FLASH SPECIFICATION P/N PM1870 MX25L3255E Contents 4 GENERAL 6 Table Read Performance PIN 7 PIN 7 BLOCK 8 DATA 9 Table Protected Area Table 4K-bit Secured OTP 11 MEMORY 12 Table Memory DEVICE 13 HOLD 14 COMMAND 15 Table Command Write Enable Write Disable Read Identification Read Status Register Write Status Register Table Protection Read Data Bytes Read Data Bytes at Higher Speed Dual Read Mode 2 x I/O Read Mode Quad Read Mode 4 x I/O Read Mode Performance Enhance Performance Enhance Mode Reset Sector Erase Block Erase Block Erase Chip Erase Page Program 4 x I/O Page Program Continuous Program mode CP Deep Power-down Release from Deep Power-down RDP , Read Electronic Signature Read Electronic Manufacturer ID & Device ID REMS , REMS2 , ID Table ID Definitions Enter Secured OTP Exit Secured OTP Read Security Register Table Security Register P/N PM1870 MX25L3255E Write Security Register Write Protection Selection Single Block Lock/Unlock Protection Read Block Lock Status Gang Block Lock/Unlock Enable SO to Output RY/BY# Disable SO to Output RY/BY# No Operation Software Reset-Enable RSTEN and Reset Read SFDP Mode P/N PM1870 MX25L3255E 32M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM SERIAL MULTI I/O FLASH MEMORY GENERAL • Serial Peripheral Interface compatible -- Mode 0 and Mode 3 • 33,554,432 x 1 bit structure or 16,777,216 x 2 bits two I/O mode structure or 8,388,608 x 4 bits four I/O mode structure • 1024 Equal Sectors with 4K bytes each - Any Sector can be erased individually • 128 Equal Blocks with 32K bytes each - Any Block can be erased individually • 64 Equal Blocks with 64K bytes each - Any Block can be erased individually • Power Supply Operation - to volt for read, erase, and program operations • Latch-up protected to 100mA from -1V to Vcc +1V PERFORMANCE • High Performance VCC = 2.7~3.6V - Normal read - 50MHz - Fast read - 1 I/O 104MHz with 8 dummy cycles - 2 I/O 86MHz with 4 dummy cycles for 2READ instruction - 4 I/O Up to 104MHz for 4READ instruction - Configurable dummy cycle number for 4READ operation - Fast program time 1.4ms typ. and 5ms max. /page 256-byte per page - Byte program time 12us typical - Continuous Program mode automatically increase address under word program mode - Fast erase time 60ms typ. /sector 4K-byte per sector 0.7s typ. /block 64K-byte per block 25s typ. / chip • Low Power Consumption - Low active read current 19mA max. at 104MHz, 10mA max. at 33MHz - Low active programming current 25mA max. - Low active erase current 25mA max. - Low standby current 80uA max. - Deep power down current 40uA max. • Typical 100,000 erase/program cycles • 20 years data retention P/N PM1870 MX25L3255E SOFTWARE FEATURES • Input Data Format - 1-byte Command code • Advanced Security Features - BP0-BP3 block group protect - Flexible individual block protect when OTP WPSEL=1 - Additional 4K bits secured OTP for unique identifier - Permanent Lock - Read Protection function • Auto Erase and Auto Program Algorithms - Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times the program pulse width Any page to be programmed should have page in the erased state first. • Status Register Feature • Electronic Identification - JEDEC 1-byte Manufacturer ID and 2-byte Device ID - RES command for 1-byte Device ID - The REMS,REMS2, REMS4 commands for 1-byte Manufacturer ID and 1-byte Device ID • Support Serial Flash Discoverable Parameters SFDP mode HARDWARE FEATURES • SCLK Input - Serial clock input • SI/SIO0 - Serial Data Input or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode • SO/SIO1 - Serial Data Output or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode • WP#/SIO2 - Hardware write protection or serial data Input/Output for 4 x I/O mode • HOLD#/SIO3 - To pause the device without deselecting the device or serial data Input/Output for 4 x I/O mode • PACKAGE - 8-pin SOP 200mil - 24-ball TFBGA 6x8mm - All devices are RoHS Compliant P/N PM1870 MX25L3255E MX25L3255E is 32Mb bits serial Flash memory, which is configured as 4,194,304 x 8 internally. When it is in two or four I/O mode, the structure becomes 16,777,216 bits x 2 or 8,388,608 bits x MX25L3255E feature a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus while it is in single I/O mode. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input. MX25L3255E, MXSMIOTM Serial Multi I/O flash memory, provides sequential read operation on whole chip and multi-I/O features. When it is in dual I/O mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in quad I/O mode, the SI pin, SO pin, WP# pin and HOLD# pin become SIO0 pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data Input/Output. After program/erase command is issued, auto program/erase algorithms which program/erase and verify the specified page or sector/block locations will be executed. Program command is executed on byte basis, or page 256 bytes basis, or word basis for Continuous Program mode, and erase command is executed on sector 4K-byte , block 32K-byte/64K-byte , or whole chip basis. To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit. ORDERING INFORMATION PART NO. MX25L3255EM2I-10G MX25L3255EXCI-10G CLOCK MHz MX25L3255EXDI-10G TEMPERATURE -40°C~85°C -40°C~85°C -40°C~85°C PACKAGE 8-SOP 200mil 24-TFBGA 6X8mm 24-TFBGA 6X8mm Remark 4x6 Ball Array 5x5 Ball Array P/N PM1870 MX25L3255E PART NAME DESCRIPTION MX 25 L 3255E M2 I OPTION G RoHS Compliant SPEED 10 104MHz TEMPERATURE RANGE I Industrial -40° C to 85° C PACKAGE M2 200mil 8-SOP XC 24-TFBGA 6x8mm, 4x6 Ball Array XD 24-TFBGA 6x8mm, 5x5 Ball Array DENSITY & MODE 3255E 32Mb Secured type TYPE L 3V DEVICE 25 Serial Flash P/N PM1870 PACKAGE INFORMATION MX25L3255E P/N PM1870 MX25L3255E P/N PM1870 MX25L3255E P/N PM1870 MX25L3255E Modified Low standby current to 80uA max . Modified Deep power-down current to 40uA max . Page P4/72 P4/72 Date JUL/23/2012 P/N PM1870 MX25L3255E Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright Macronix International Co., Ltd. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich io, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto if any are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 87

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MX25L3255E

MX25L3255E

HIGH PERFORMANCE SERIAL FLASH SPECIFICATION

P/N PM1870

MX25L3255E

Contents
4 GENERAL 6

Table Read Performance PIN 7 PIN 7 BLOCK 8 DATA 9

Table Protected Area Table 4K-bit Secured OTP 11 MEMORY 12 Table Memory DEVICE 13 HOLD 14 COMMAND 15 Table Command Write Enable Write Disable Read Identification Read Status Register Write Status Register Table Protection Read Data Bytes Read Data Bytes at Higher Speed Dual Read Mode 2 x I/O Read Mode Quad Read Mode 4 x I/O Read Mode Performance Enhance Performance Enhance Mode Reset Sector Erase Block Erase Block Erase Chip Erase Page Program 4 x I/O Page Program Continuous Program mode CP Deep Power-down Release from Deep Power-down RDP , Read Electronic Signature Read Electronic Manufacturer ID & Device ID REMS , REMS2 , ID Table ID Definitions Enter Secured OTP Exit Secured OTP Read Security Register Table Security Register

P/N PM1870

MX25L3255E

Write Security Register Write Protection Selection Single Block Lock/Unlock Protection Read Block Lock Status Gang Block Lock/Unlock Enable SO to Output RY/BY# Disable SO to Output RY/BY# No Operation Software Reset-Enable RSTEN and Reset Read SFDP Mode
P/N PM1870

MX25L3255E
32M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM SERIAL MULTI I/O FLASH MEMORY

GENERAL
• Serial Peripheral Interface compatible -- Mode 0 and Mode 3
• 33,554,432 x 1 bit structure or 16,777,216 x 2 bits two I/O mode structure or 8,388,608 x 4 bits four I/O
mode structure
• 1024 Equal Sectors with 4K bytes each
- Any Sector can be erased individually
• 128 Equal Blocks with 32K bytes each
- Any Block can be erased individually
• 64 Equal Blocks with 64K bytes each
- Any Block can be erased individually
• Power Supply Operation
- to volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to Vcc +1V

PERFORMANCE
• High Performance

VCC = 2.7~3.6V - Normal read - 50MHz - Fast read - 1 I/O 104MHz with 8 dummy cycles - 2 I/O 86MHz with 4 dummy cycles for 2READ instruction - 4 I/O Up to 104MHz for 4READ instruction - Configurable dummy cycle number for 4READ operation - Fast program time 1.4ms typ. and 5ms max. /page 256-byte per page - Byte program time 12us typical - Continuous Program mode automatically increase address under word program mode - Fast erase time 60ms typ. /sector 4K-byte per sector 0.7s typ. /block 64K-byte per block 25s typ. /
chip
• Low Power Consumption
- Low active read current 19mA max. at 104MHz, 10mA max. at 33MHz - Low active programming current 25mA max. - Low active erase current 25mA max. - Low standby current 80uA max. - Deep power down current 40uA max.
• Typical 100,000 erase/program cycles
• 20 years data retention

P/N PM1870

MX25L3255E

SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- BP0-BP3 block group protect - Flexible individual block protect when OTP WPSEL=1 - Additional 4K bits secured OTP for unique identifier - Permanent Lock - Read Protection function
• Auto Erase and Auto Program Algorithms
- Automatically erases and verifies data at selected sector - Automatically programs and verifies data at selected page by an internal algorithm that automatically times
the program pulse width Any page to be programmed should have page in the erased state first.
• Status Register Feature
• Electronic Identification
- JEDEC 1-byte Manufacturer ID and 2-byte Device ID
- RES command for 1-byte Device ID - The REMS,REMS2, REMS4 commands for 1-byte Manufacturer ID and 1-byte Device ID
• Support Serial Flash Discoverable Parameters SFDP mode

HARDWARE FEATURES
• SCLK Input
- Serial clock input
• SI/SIO0
- Serial Data Input or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode
• SO/SIO1
- Serial Data Output or Serial Data Input/Output for 2 x I/O mode and 4 x I/O mode
• WP#/SIO2
- Hardware write protection or serial data Input/Output for 4 x I/O mode
• HOLD#/SIO3
- To pause the device without deselecting the device or serial data Input/Output for 4 x I/O mode
• PACKAGE
- 8-pin SOP 200mil - 24-ball TFBGA 6x8mm - All devices are RoHS Compliant

P/N PM1870

MX25L3255E

MX25L3255E is 32Mb bits serial Flash memory, which is configured as 4,194,304 x 8 internally. When it is in two or four I/O mode, the structure becomes 16,777,216 bits x 2 or 8,388,608 bits x MX25L3255E feature a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus while it is in single I/O mode. The three bus signals are a clock input SCLK , a serial data input SI , and a serial data output SO . Serial access to the device is enabled by CS# input.

MX25L3255E, MXSMIOTM Serial Multi I/O flash memory, provides sequential read operation on whole chip and multi-I/O features.

When it is in dual I/O mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits input and data output. When it is in quad I/O mode, the SI pin, SO pin, WP# pin and HOLD# pin become SIO0 pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data Input/Output.

After program/erase command is issued, auto program/erase algorithms which program/erase and verify the specified page or sector/block locations will be executed. Program command is executed on byte basis, or page 256 bytes basis, or word basis for Continuous Program mode, and erase command is executed on sector 4K-byte , block 32K-byte/64K-byte , or whole chip basis.

To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit.
ORDERING INFORMATION

PART NO. MX25L3255EM2I-10G MX25L3255EXCI-10G

CLOCK MHz

MX25L3255EXDI-10G

TEMPERATURE -40°C~85°C -40°C~85°C -40°C~85°C

PACKAGE 8-SOP 200mil 24-TFBGA 6X8mm 24-TFBGA 6X8mm

Remark
4x6 Ball Array 5x5 Ball Array

P/N PM1870

MX25L3255E

PART NAME DESCRIPTION

MX 25 L 3255E M2 I

OPTION G RoHS Compliant

SPEED 10 104MHz

TEMPERATURE RANGE I Industrial -40° C to 85° C

PACKAGE M2 200mil 8-SOP XC 24-TFBGA 6x8mm, 4x6 Ball Array XD 24-TFBGA 6x8mm, 5x5 Ball Array

DENSITY & MODE 3255E 32Mb Secured type

TYPE L 3V

DEVICE 25 Serial Flash

P/N PM1870

PACKAGE INFORMATION

MX25L3255E

P/N PM1870

MX25L3255E

P/N PM1870

MX25L3255E

P/N PM1870

MX25L3255E

Modified Low standby current to 80uA max .

Modified Deep power-down current to 40uA max .

Page P4/72 P4/72

Date JUL/23/2012

P/N PM1870

MX25L3255E

Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright Macronix International Co., Ltd. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich io, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto if any are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at:

MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 87

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MX25L3255EXDI-10G Datasheet file may be downloaded here without warranties.

Datasheet ID: MX25L3255EXDI-10G 646933