852815

852815 Datasheet

Part	Datasheet
852815	852815 (pdf)

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Technical Data Sheet Thermstrate TC November 2002 PRODUCT DESCRIPTION TC is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a dry compound in bar form, packaged in a unique easy to use applicator, which flows in the installation at the phase change temperature and conforms to the surface features of the heat sink and component. Upon flow, air is expelled from the interface, reducing thermal impedance and the material performs as a highly efficient thermal transfer medium. Thermstrate TC is a convenient alternative to die cut preforms. Custom parts of the equivalent preformed material, Thermstrate 2000, are available upon request for a wide range of applications. TYPICAL APPLICATIONS Micro processors, hybrid power modules, solid state relays, power transistors, power modules, IGBT’s, RF components etc. Typically used between any heat dissipating electrically isolated component and a heat sink or thermal solution. MATERIAL PROPERTIES One application of Thermstrate TC results in a compound coating thickness of approximately mils 0.00635mm . Data for this coating thickness is provided below. Units Substrate Compound Thickness Nominal Thermal Impedance 20psi ASTM D5470 KPa, ASTM D5470 Thermal Impedance D5470 KPa, ASTM D5470 inches mm °C-in2/W °Ccm2/W °C-in2/W °Ccm2/W Thermstrate TC PHYSICAL PROPERTIES Part Number Standard Phase change temperature TC-175-125 60°C Volumetric expansion upon phase change Viscosity above phase change temperature Color 15% Thixotropic Opaque White No silicones in the compound formulation. PRODUCT PERFORMANCE Thermal Impedance vs Mounting Pressure The performance of any phase change thermal interface material will be improved by increasing the mounting pressure at the interface. The graph below shows the thermal impedance values generated on an ASTM D5470 platform. The test block dimensions are 2” x 2”, the finish is 64 microinches and the flatness is inches/inch. The power level is 80 watts. L PRODUCT CHARACTERISTICS The graph above shows the typical performance for Thermstrate TC when placed between a device and a heat sink, under a clamp load of 10psi. The temperature at the case of the device and the heat sink are recorded. During the first reflow cycle, i.e. prior to phase change, Thermstrate TC exhibits relatively high thermal impedance. Once the material has changed phase one time, all subsequent operations will see the thermal impedance values indicated on the curve traces which approximately parallel the horizontal axis. NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS PRODUCT. TDS Thermstrate TC November 2002 Operating Temperature Range Tests have confirmed that Thermstrate TC can be used reliably up to 150°C. Surface Conditions Typical interface surface conditions are quoted below: Surface finish Surface flatness 64 microinches or better microns or better inches/inch or better cm/cm or better

PDF Datasheet Preview

Technical Data Sheet

Thermstrate TC

November 2002

PRODUCT DESCRIPTION TC is a phase change thermal interface material suitable for use between a heat sink and a variety of heat dissipating components. This product is supplied as a dry compound in bar form, packaged in a unique easy to use applicator, which flows in the installation at the phase change temperature and conforms to the surface features of the heat sink and component. Upon flow, air is expelled from the interface, reducing thermal impedance and the material performs as a highly efficient thermal transfer medium.

Thermstrate TC is a convenient alternative to die cut preforms. Custom parts of the equivalent preformed material, Thermstrate 2000, are available upon request for a wide range of applications.

TYPICAL APPLICATIONS Micro processors, hybrid power modules, solid state relays, power transistors, power modules, IGBT’s, RF components etc. Typically used between any heat dissipating electrically isolated component and a heat sink or thermal solution.

MATERIAL PROPERTIES One application of Thermstrate TC results in a compound coating thickness of approximately mils 0.00635mm . Data for this coating thickness is provided below.

Units

Substrate

Compound

Thickness

Nominal

Thermal Impedance
20psi ASTM

D5470

KPa,

ASTM D5470

Thermal Impedance

D5470

KPa,

ASTM D5470
inches mm
°C-in2/W °Ccm2/W
°C-in2/W °Ccm2/W

Thermstrate TC

PHYSICAL PROPERTIES

Part Number Standard Phase change temperature

TC-175-125 60°C

Volumetric expansion upon phase change Viscosity above phase change temperature Color
15% Thixotropic Opaque White

No silicones in the compound formulation.

PRODUCT PERFORMANCE Thermal Impedance vs Mounting Pressure The performance of any phase change thermal interface material will be improved by increasing the mounting pressure at the interface. The graph below shows the thermal impedance values generated on an ASTM D5470 platform. The test block dimensions are 2” x 2”, the finish is 64 microinches and the flatness is inches/inch. The power level is 80 watts.

L PRODUCT CHARACTERISTICS

The graph above shows the typical performance for Thermstrate TC when placed between a device and a heat sink, under a clamp load of 10psi. The temperature at the case of the device and the heat sink are recorded. During the first reflow cycle, i.e. prior to phase change, Thermstrate TC exhibits relatively high thermal impedance. Once the material has changed phase one time, all subsequent operations will see the thermal impedance values indicated on the curve traces which approximately parallel the horizontal axis.

NOT FOR PRODUCT SPECIFICATIONS THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS

PRODUCT.

TDS Thermstrate TC November 2002

Operating Temperature Range Tests have confirmed that Thermstrate TC can be used reliably up to 150°C.

Surface Conditions Typical interface surface conditions are quoted below:

Surface finish Surface flatness
64 microinches or better microns or better inches/inch or better cm/cm or better

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Datasheet ID: 852815 646589