Part No. LTL1CHCBK4
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LTL1CHCBK4 (pdf) |
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LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only * Low power consumption. * High efficiency. * Versatile mounting on p.c. board or panel. * I.C. compatible/low current requirement. * mm diameter package. Package Dimensions Part No. LTL1CHCBK4 Lens Water Clear Source Color Blue Notes All dimensions are in millimeters inches . Tolerance is ±0.25mm .010" unless otherwise noted. Protruded resin under flange is 1.0mm .04" max. Lead spacing is measured where the leads emerge from the package. Specifications are subject to change without notice. Part No. LTL1CHCBK4 BNS-OD-C131/A4 Page 1 of 10 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Absolute Maximum Ratings at TA=25℃ Parameter Power Dissipation Peak Forward Current 1/10 Duty Cycle, 0.1ms Pulse Width DC Forward Current Derating Linear From 30℃ Maximum Rating 130 100 30 5 1000 -20℃ to + 80℃ -30℃ to + 100℃ 260℃ for 5 Seconds Unit mW mA/℃ V Note A : HBM Human Body Model. Seller gives no other assurances regarding the ability of Products to withstand ESD. Part No. LTL1CHCBK4 BNS-OD-C131/A4 Page 2 of 10 LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Electrical / Optical Characteristics at TA=25℃ Parameter Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Symbol Min. Typ. Max. Unit Test Condition IF = 20mA mcd Note 1,5 deg Note 2 Fig.6 Measurement nm Fig.1 nm Note 3 Forward Voltage V IF = 20mA uA VR = 5V NOTE Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. is the off-axis angle at which the luminous intensity is half the axial luminous intensity. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Iv classification code is marked on each packing bag. The Iv guarantee should be added Precautions in handling ‧ When soldering, leave 2mm of minimum clearance from the resin to the soldering point. ‧ Dipping the resin to solder must be avoided. ‧ Correcting the soldered position after soldering must be avoided. ‧ In soldering, do not apply any stress to the lead frame particularly when heated. ‧ When forming a lead, make sure not to apply any stress inside the resin. ‧ Lead forming must be done before soldering. ‧ It is necessary to cut the lead frame at normal temperature. Caution in ESD Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. Part No. LTL1CHCBK4 BNS-OD-C131/A4 Page 3 of 10 |
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