Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non-infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A16744-00 Rev A
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A16037-00 (pdf) |
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A15405-05 |
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A15974-00 |
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Innovative Technology for a Connected World TpcmTM 580S global solutions local support TM Americas Europe Asia: HIGH PERFORMANCE PHASE CHANGE MATERIAL TpcmTM 580S are high performance thermal phase change materials designed to meet the thermal, reliability, and price requirements of high end thermal applications. TpcmTM 580S is inherently tacky, flexible and exceptionally easy to use. At temperatures above its transition temperature of 50°C 122°F , TpcmTM 580S begins to soften and flow, filling the microscopic irregularities of the components it contacts. The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity softening , TpcmTM 580S minimizes migration pump out . TpcmTM 580S can be supplied as cut parts in strips and rolls with top tabbed liners for easy application. The top tabbed liner can be removed immediately or provide a protective cover during shipping and removed at assembly. TpcmTM 580S can also be supplied in sheets and custom die cut configurations. TpcmTM 580S meets all environmental requirements including RoHS. total thermal resistance 0.013°C-in2/W at 50 psi • Inherently tacky and easy to use - No adhesive required • High reliability • Meets all environmental requirements including RoHS • Provides high value price / performance point • Microprocessors • Memory chipsets • Graphic processing chips • Custom ASICS TpcmTM 588S Construction and Composition Color Thickness Density Operating Temperature Range Transition Temperature Thermal Resistance Modified ASTM D5470 10 psi 20 psi 50 psi Thermal Conductivity Volume Resistivity Hardness Non-reinforced film Gray mm g/cc -40 to 125°C -40 to 257°F 50°C 122°F 0.015°C-in2/W 0.097°C-cm2/W 0.011°C-in2/W 0.071°C-cm2/W 0.010°C-in2/W 0.064°C-cm2/W W/mK x 1012ohm-cm 50 Shore 00 Approximate Bondline Thickness 10 psi = in 50 psi = in STANDARD PACKAGING Sheets: 9” x 9” mm x mm 18” x 18” mm x mm Cut Parts On strip with top tabbed liner Individual cut through TpcmTM 5810S Non-reinforced film Gray mm g/cc -40 to 125°C -40 to 257°F 50°C 122°F 0.015°C-in2/W 0.13°C-cm2/W 0.011°C-in2/W 0.10°C-cm2/W 0.010°C-in2/W 0.08°C-cm2/W W/mK x 1012ohm-cm 50 Shore 00 10 psi = in 50 psi = in THR-DS-Tpcm-580S 0512 |
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