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430891-401 (pdf) |
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430891-420 |
PDF Datasheet Preview |
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eTEC Series HV14,18,F0,0102,GG Thin Film Thermoelectric Module Americas +1 Europe Asia: The eTEC Series is a thin film thermoelectric module TEM with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. The eTEC HV14 can produce Watts of cooling capacity at 25°C ambient in a 4 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies. • Micro Footprint • High Heat Pumping Density • Precise Temperature Control • Reliable Solid State Operation • <2 ms Response Time • RoHS Compliant • Laser Diodes • Photodiodes • Infrared IR Sensors • Pump Lasers • Crystal Oscillators • Optical Transceivers PERFORMANCE SPECIFICATIONS Hot Side Temperature °C 25°C 50°C Qmax Watts Delta Tmax °C Imax Amps Vmax Volts Qmax / area W/cm2 Electrical Resistance Ohms Thermal Resistance K/W PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C Peak Assembly Temperature 60 sec 325°C TEMPERATURE CONDITIONS Max Operating Temperature OPERATING CONDITIONS Max rate of change of current 150°C Amps/sec eTEC Series HV14,18,F0,0102,GG Thin Film Thermoelectric Module PERFORMANCE CURVES COEFFICIENT OF PERFORMANCE Tolerance for all dimensions +/- mm ISOMETRIC DRAWING Standard UNLESS OTHERWISE SPECIFIED: NAME Au metallization on exterior ceramic substrate surfaces DIMENSIONS ARE IN MM TOLERANCES TWO PLACE DECIMAL DRAWN Paul Crocco 10/3/2013 CHECKED TITLE: THREE PLACE DECIMAL ENG APPR. Paul Crocco 10/3/2013 A601 wire bondable pads |
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