430891-401

430891-401 Datasheet


Part Datasheet
430891-401 430891-401 430891-401 (pdf)
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430891-420 430891-420 430891-420
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eTEC Series HV14,18,F0,0102,GG

Thin Film Thermoelectric Module

Americas +1 Europe Asia:

The eTEC Series is a thin film thermoelectric module TEM with high heat flux density. Due to its size, input power requirements and heat pumping capacity this device is suited for use in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries.

The eTEC HV14 can produce Watts of cooling capacity at 25°C ambient in a 4 mm2 footprint. Assembled with thin film semiconductor material and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for lower current applications with tight geometric space constraints. Custom designs are available to accommodate metallization, pretin solder and ceramic patterns, however MOQ applies.
• Micro Footprint
• High Heat Pumping Density
• Precise Temperature Control
• Reliable Solid State Operation
• <2 ms Response Time
• RoHS Compliant
• Laser Diodes
• Photodiodes
• Infrared IR Sensors
• Pump Lasers
• Crystal Oscillators
• Optical Transceivers

PERFORMANCE SPECIFICATIONS

Hot Side Temperature °C
25°C
50°C

Qmax Watts

Delta Tmax °C

Imax Amps

Vmax Volts

Qmax / area W/cm2

Electrical Resistance Ohms

Thermal Resistance K/W

PACKAGE ASSEMBLY CONDITIONS Max Time Exposure > 290°C Peak Assembly Temperature
60 sec 325°C

TEMPERATURE CONDITIONS Max Operating Temperature

OPERATING CONDITIONS Max rate of change of current
150°C Amps/sec
eTEC Series HV14,18,F0,0102,GG

Thin Film Thermoelectric Module

PERFORMANCE CURVES

COEFFICIENT OF PERFORMANCE

Tolerance for all dimensions +/- mm

ISOMETRIC DRAWING

Standard

UNLESS OTHERWISE SPECIFIED:

NAME

Au metallization on exterior ceramic substrate surfaces DIMENSIONS ARE IN MM TOLERANCES TWO PLACE DECIMAL

DRAWN Paul Crocco 10/3/2013

CHECKED

TITLE:

THREE PLACE DECIMAL ENG APPR. Paul Crocco 10/3/2013

A601
wire
bondable
pads
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Datasheet ID: 430891-401 645187