16-6040-0031

16-6040-0031 Datasheet

16-6337-0062

Part	Datasheet
16-6040-0031	16-6040-0031 (pdf)

Related Parts	Information
14-6040-0031	14-6040-0031
16-6040-0050	16-6040-0050

PDF Datasheet Preview
2009 RECOMMENDED Electronics Assembly Materials Kester Lead-Free Lead-Free Solder Pastes Formula Application Alloys EnviroMark 907 No-Clean Stencil Printing Sn96.5Ag3.0Cu0.5 EnviroMark 828 Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Product Characteristics Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu SAC . Joints are cosmetically bright as SnPb joints. Prints down to 0201 pad sites. Designed to be reflowable in air as well as nitrogen. Kester EM828 provides excellent printability, activity, cleanability and low-voiding behavior. EM828 is very robust and can tolerate a wide variety of printing and reflow conditions. EM828 is first to market with a water-soluable lead-free paste that combines superior activity, cleanability and low-voiding. Residue Characteristics Typical Metal Percentage Compliant Specifications Suggested Packaging Style Compatible Rework FLux Light colored -325/+500 Type 3 Telcordia Issue 1 GR-78-CORE IPC/J-STD-004 Flux Designator ROL0 500g jar, 600g, 1400g cartridges RF743 Cleanable in warm water 140°F - 160°F -325/+500 Type 3 IPC/J-STD-004 Flux Designator ORH1 500g jar, 600g, 1400g cartridges RF773 Liquid Soldering Fluxes for Kester Part # 7006050810 7006050811 7004030810 7004030811 EM907 No-Clean, Type 3, metal EM907 No-Clean, Type 3, metal EM828 Water-Soluble, Type 3, metal EM828 Water-Soluble, Type 3, metal Alloy Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Packaging 500g jar 600g cartridge 500g jar 600g cartridge Lead-free wave and selective soldering require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuring reliable product output. Kester Part # 63-0004-0985 64-0004-0985 65-0004-0985 63-0020-0959 64-0020-0959 65-0020-0959 63-0056-2220 64-0056-2220 65-0056-2220 63-0000-2235 64-0000-2235 65-0000-2235 Description 985M No-Clean 985M No-Clean 985M No-Clean 959T No-Clean 959T No-Clean 959T No-Clean 2220-VF VOC-Free Water-Soluble 2220-VF VOC-Free Water-Soluble 2220-VF VOC-Free Water-Soluble 2235 Water-Soluble 2235 Water-Soluble 2235 Water-Soluble Packaging 1 gallon 5 gallon 53 gallon drum

PDF Datasheet Preview

2009 RECOMMENDED

Electronics Assembly Materials

Kester Lead-Free

Lead-Free Solder Pastes

Formula Application

Alloys

EnviroMark 907 No-Clean Stencil Printing

Sn96.5Ag3.0Cu0.5

EnviroMark 828 Water-Soluble Stencil Printing

Sn96.5Ag3.0Cu0.5

Product Characteristics

Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with lead-free alloys such as the family of SnAgCu SAC . Joints are cosmetically bright as SnPb joints. Prints
down to 0201 pad sites. Designed to be reflowable in air as well as nitrogen.

Kester EM828 provides excellent printability, activity, cleanability and low-voiding behavior. EM828 is very robust and can tolerate a wide variety of printing and reflow conditions. EM828 is first to market with a water-soluable lead-free paste that
combines superior activity, cleanability and low-voiding.

Residue Characteristics Typical Metal Percentage Compliant Specifications Suggested Packaging Style Compatible Rework FLux

Light colored
-325/+500 Type 3 Telcordia Issue 1 GR-78-CORE IPC/J-STD-004 Flux Designator ROL0 500g jar, 600g, 1400g cartridges

RF743

Cleanable in warm water 140°F - 160°F -325/+500 Type 3

IPC/J-STD-004 Flux Designator ORH1 500g jar, 600g, 1400g cartridges RF773

Liquid Soldering Fluxes for

Kester Part #
7006050810 7006050811 7004030810 7004030811

EM907 No-Clean, Type 3, metal EM907 No-Clean, Type 3, metal EM828 Water-Soluble, Type 3, metal EM828 Water-Soluble, Type 3, metal

Alloy

Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5

Packaging
500g jar 600g cartridge
500g jar 600g cartridge

Lead-free wave and selective soldering require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuring reliable product output.

Kester Part # 63-0004-0985 64-0004-0985 65-0004-0985
63-0020-0959 64-0020-0959 65-0020-0959
63-0056-2220 64-0056-2220 65-0056-2220
63-0000-2235 64-0000-2235 65-0000-2235

Description 985M No-Clean 985M No-Clean 985M No-Clean
959T No-Clean 959T No-Clean 959T No-Clean
2220-VF VOC-Free Water-Soluble 2220-VF VOC-Free Water-Soluble 2220-VF VOC-Free Water-Soluble
2235 Water-Soluble 2235 Water-Soluble 2235 Water-Soluble

Packaging 1 gallon 5 gallon
53 gallon drum

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Datasheet ID: 16-6040-0031 644832