KC80524KX366128SL3C7

KC80524KX366128SL3C7 Datasheet

Part	Datasheet
KC80524KX366128SL3C7	KC80524KX366128SL3C7 (pdf)

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Celeron Processor Mobile Module Mobile Module Connector 1 MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz Datasheet Product Features n Mobile Celeron Processor with core frequency running at 400 MHz, 366 MHz, 333 MHz, 300 MHz, 266 MHz n 128K of on-die 2nd level cache n 66-MHz processor system bus speed n Processor core voltage regulation supports input voltages from 5V to 21V Above 80 percent peak efficiency n Thermal transfer plate on the CPU and the 82433DX for heat dissipation n Intel 82443DX Host Bridge system controller DRAM controller supports EDO and SDRAM at 3.3V Supports PCI CLKRUN# protocol SDRAM clock support and self refresh of EDO Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any patent or copyright, for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products. Information contained herein supersedes previously published specifications on these devices from Intel INTEL CORPORATION 1999,2000 February 2000 Order Number 2455426-001 Celeron Processor Mobile Module MMC-1 At 400 MHz, 366 MHz, 333 MHz, and 300 MHz Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Celeron processor mobile modules may contain design defects or errors known as errata. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800548-4725 or by visiting Intel’s web site at Copyright Intel Corporation1999. *Third-party brands and names are the property of their respective owners. Celeron Processor Mobile Module MMC-1 At 400 MHz, 366 MHz, 333 MHz, and 300 MHz CONTENTS ARCHITECTURE OVERVIEW MODULE CONNECTOR INTERFACE..................7 Signal Definition Signal Memory 108 Signals ...............................9 PCI 56 Processor and PIIX4E/M Sideband 9 Signals Power Management 8 Signals ..............12 Clock 8 Voltages 39 Signals ..............................14 JTAG 7 Signals Miscellaneous 45 Signals .....................15 Connector Pin and Pad Assignments FUNCTIONAL Celeron Processor Mobile Module MMC-1.....19 L2 Cache The 82443DX Host Bridge System Controller.19 Memory Organization Reset Strap Options AGP Feature Power Clock Control Architecture......................20 Normal State Auto Halt Stop Grant Quick Start HALT/Grant Snoop State........................22 Sleep State Deep Sleep Typical POS/STR Power.................................23 Electrical Requirements DC Requirements AC BCLK Signal Quality Specifications and Measurement Guidelines The Voltage Regulator Voltage Regulator Efficiency...................26 Control of the Voltage Regulator.............27 Voltage Signal Definition and Power Planes Bulk Capacitance Surge Current Guidelines Slew-rate Control Circuit Description Undervoltage Lockout Circuit Description V_uv_lockout .................33 Overvoltage Lockout Circuit Description Overcurrent Protection Circuit Active Thermal Sensor Configuration Register..........35 MECHANICAL SPECIFICATION........................35 Module Dimensions MMC-1 Connector Pin 1 Location...........36 Printed Circuit Board Thickness..............36 Height Restrictions Thermal Transfer Physical Mounting Requirements Module Weight THERMAL Thermal Design Thermal Sensor Setpoint LABELING ENVIRONMENTAL STANDARDS

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Celeron Processor Mobile Module Mobile Module Connector 1 MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz

Datasheet

Product Features
n Mobile Celeron Processor with core frequency running at 400 MHz, 366 MHz, 333 MHz, 300 MHz, 266 MHz
n 128K of on-die 2nd level cache
n 66-MHz processor system bus speed
n Processor core voltage regulation supports input voltages from 5V to 21V Above 80 percent peak efficiency
n Thermal transfer plate on the CPU and the 82433DX for heat dissipation
n Intel 82443DX Host Bridge system controller

DRAM controller supports EDO and SDRAM at 3.3V

Supports PCI CLKRUN# protocol SDRAM clock support and self refresh of EDO

Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any patent or
copyright, for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products. Information contained herein supersedes
previously published specifications on these devices from Intel

INTEL CORPORATION 1999,2000

February 2000

Order Number 2455426-001

Celeron Processor Mobile Module MMC-1 At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Celeron processor mobile modules may contain design defects or errors known as errata. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800548-4725 or by visiting Intel’s web site at Copyright Intel Corporation1999. *Third-party brands and names are the property of their respective owners.

Celeron Processor Mobile Module MMC-1 At 400 MHz, 366 MHz, 333 MHz, and 300 MHz

CONTENTS

ARCHITECTURE OVERVIEW MODULE CONNECTOR INTERFACE..................7

Signal Definition

Signal

Memory 108 Signals ...............................9

PCI 56

Processor and PIIX4E/M Sideband
9 Signals

Power Management 8 Signals ..............12

Clock 8

Voltages 39 Signals ..............................14

JTAG 7 Signals

Miscellaneous 45 Signals .....................15 Connector Pin and Pad Assignments FUNCTIONAL Celeron Processor Mobile Module MMC-1.....19 L2 Cache The 82443DX Host Bridge System Controller.19

Memory Organization

Reset Strap Options

AGP Feature Power

Clock Control Architecture......................20

Normal State

Auto Halt

Stop Grant

Quick Start

HALT/Grant Snoop State........................22

Sleep State

Deep Sleep

Typical POS/STR Power.................................23 Electrical Requirements

DC Requirements

AC BCLK Signal Quality Specifications and Measurement Guidelines

The Voltage Regulator

Voltage Regulator Efficiency...................26

Control of the Voltage Regulator.............27 Voltage Signal Definition and

Power Planes Bulk Capacitance

Surge Current Guidelines Slew-rate Control Circuit Description Undervoltage Lockout Circuit Description V_uv_lockout .................33 Overvoltage Lockout Circuit Description Overcurrent Protection Circuit

Active Thermal Sensor Configuration Register..........35 MECHANICAL SPECIFICATION........................35 Module Dimensions

MMC-1 Connector Pin 1 Location...........36

Printed Circuit Board Thickness..............36

Height Restrictions Thermal Transfer Physical

Mounting Requirements

Module Weight THERMAL

Thermal Design Thermal Sensor Setpoint LABELING ENVIRONMENTAL STANDARDS

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived KC80524KX366128SL3C7 Datasheet file may be downloaded here without warranties.

Datasheet ID: KC80524KX366128SL3C7 638942