IDT71V65602/Z IDT71V65802/Z
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IDT71V65802S150BGG8 (pdf) |
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PDF Datasheet Preview |
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256K x 36, 512K x 18 3.3V Synchronous ZBT SRAMs 2.5V I/O, Burst Counter Pipelined Outputs IDT71V65602/Z IDT71V65802/Z 256K x 36, 512K x 18 memory configurations Supports high performance system speed - 150MHz 3.8ns Clock-to-Data Access ZBTTM Feature - No dead cycles between write and read cycles Internally synchronized output buffer enable eliminates the need to control OE Single R/W READ/WRITE control pin Positive clock-edge triggered address, data, and control signal registers for fully pipelined applications 4-word burst capability interleaved or linear Individual byte write BW1 - BW4 control May tie active Three chip enables for simple depth expansion 3.3V power supply ±5% 2.5V I/O Supply VDDQ Power down controlled by ZZ input Packaged in a JEDEC standard 100-pin plastic thin quad and flatpack TQFP , 119 ball grid array BGA and 165 fine pitch ball grid array fBGA The IDT71V65602/5802 are 3.3V high-speed 9,437,184-bit 9 Megabit synchronous SRAMs. They are designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, they have been given the name ZBTTM, or Zero Bus Turnaround. Address and control signals are applied to the SRAM during one clock cycle, and two cycles later the associated data cycle occurs, be it read or write. The IDT71V65602/5802 contain data I/O, address and control signal registers. Output enable is the only asynchronous signal and can be used to disable the outputs at any given time. A Clock Enable CEN pin allows operation of the IDT71V65602/5802 to be suspended as long as necessary. All synchronous inputs are ignored when CEN is high and the internal device registers will hold their previous values. There are three chip enable pins CE1, CE2, CE2 that allow the user to deselect the device when desired. If any one of these three are not asserted when ADV/LD is low, no new memory operation can be initiated. However, any pending data transfers reads or writes will be completed. The data bus will tri-state two cycles after chip is deselected or a write is initiated. The IDT71V65602/5802 have an on-chip burst counter. In the burst mode, the IDT71V65602/5802 can provide four cycles of data for a single address presented to the SRAM. The order of the burst sequence is defined by the LBO input pin. The LBO pin selects between linear and interleaved burst sequence. The ADV/LD signal is used to load a new external address ADV/ LD = LOW or increment the internal burst counter ADV/LD = HIGH . The IDT71V65602/5802 SRAM utilize IDT's latest high-performance CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100pin thin plastic quad flatpack TQFP as well as a 119 ball grid array BGA and a 165 fine pitch ball grid array fBGA . Pin Description Summary A0-A18 Address Inputs CE1, CE2, CE2 Chip Enables Output Enable Read/Write Signal Clock Enable BW1, BW2, BW3, BW4 Individual Byte Write Selects Clock ADV/LD Advance burst address / Load new address Linear / Interleaved Burst Order Sleep Mode I/O0-I/O31, I/OP1-I/OP4 Data Input / Output VDD, VDDQ Core Power, I/O Power Ground Input I/O Supply Synchronous Asynchronous Synchronous N/A Synchronous Static Asynchronous Synchronous Static 5303 tbl 01 ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc. Ordering Information XXXX Z S Device Type Power XX Speed Package Process/ Temperature Range Blank I PF BG BQ Commercial 0° C to +70° C Industrial -40° C to +85° C 100 pin Plastic Thin Quad Flatpack, 100 pin 119 Ball Grid Array BGA 165 Fine Pitch Ball Grid Array fBGA Clock Frequency in Megahertz Blank First generation or current die step Current generation die step optional IDT71V65602 256Kx36 Pipelined ZBT SRAM IDT71V65802 512Kx18 Pipelined ZBT SRAM 5303 drw 12 IDT71V65602, IDT71V65802, 256K x 36, 512K x 18, 3.3V Synchronous SRAMs with ZBT Feature, 2.5V I/O, Burst Counter, and Pipelined Outputs Commercial and Industrial Temperature Ranges Datasheet Document History 12/31/99 03/04/00 04/20/00 05/16/00 07/28/00 11/04/00 12/04/02 12/19/02 10/15/04 02/21/07 02/20/09 Created new datasheet from obsolete devices IDT71V656 and IDT71V658 Pg.1,14,15 Removed 166MHz speed grade offering Added 150MHz speed grade offering Pg. 5,6 Add JTAG test pins to TQFP pin configuration removed footnote Add clarification note to Recommended Operating Temperature and Absolute Max Ratings tables Pg. 7 Add note to BGA Pin configuration corrected typo in pinout Pg. 21 Insert TQFP Package Diagram Outline Add new package offering, 13 x 15mm 165fBGA Pg. 23 Correct error in the 119 BGA Package Diagram Outline Pg. 5-8 Remove JTAG pins from TQFP, BG119 and BQ165 pinouts, refer to IDT71V656xx and IDT71V658xx device errata Pg. 7,8 Correct error in pinout, B2 on BG119 and B1 on BQ165 pinout Pg. 23 Update BG119 Package Diagram Dimensions Pg. 15 Add Izz parameter to DC Electrical Characteristics Added Z generation die step to data sheet ordering information. Pg.25 Removed "IDT" from orderable parts number. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Rd San Jose, CA 95138 for SALES 800-345-7015 or 408-284-8200 fax 408-284-2775 The IDT logo is a registered trademark of Integrated Device Technology, Inc. for Tech Support 800-345-7015 or 408/284-4555 |
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