SIDC06D60AC6X1SA1

SIDC06D60AC6X1SA1 Datasheet

SIDC06D60AC6

Part	Datasheet
SIDC06D60AC6X1SA1	SIDC06D60AC6X1SA1 (pdf)

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SIDC06D60AC6 Fast switching diode chip in EMCON 3 -Technology FEATURES: This chip is used for • power module • discrete components • small temperature coefficient Applications: • drives • white goods • resonant applications Chip Type SIDC06D60AC6 600V 20A Die Size x 2 mm2 Package sawn on foil MECHANICAL PARAMETER Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization Cathode metallization Die bond Wire bond Reject ink dot size Recommended storage environment 2574 pcs Photoimide 3200 nm AlSiCu Ni Ag suitable for epoxy and soft solder die bonding electrically conductive glue or solder 0.65mm max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C Edited by INFINEON Technologies, AIM PMD D CID CLS, L4981M, Edition SIDC06D60AC6 Maximum Ratings Parameter VRRM Continuous forward current limited by IF Tjmax Maximum repetitive forward current limited by Tjmax IFRM Operating junction and storage temperature Tj , Tstg 1 depending on thermal properties of assembly Condition Value 600 Unit V Static Electrical Characteristics tested on chip , Tj=25 °C, unless otherwise specified Parameter

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SIDC06D60AC6

Fast switching diode chip in EMCON 3 -Technology

FEATURES:

This chip is used for
• power module
• discrete components
• small temperature coefficient

Applications:
• drives
• white goods
• resonant applications

Chip Type SIDC06D60AC6
600V 20A

Die Size x 2 mm2

Package sawn on foil

MECHANICAL PARAMETER Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization

Cathode metallization

Die bond Wire bond Reject ink dot size

Recommended storage environment
2574 pcs

Photoimide
3200 nm AlSiCu

Ni Ag suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
0.65mm max 1.2mm
store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C

Edited by INFINEON Technologies, AIM PMD D CID CLS, L4981M, Edition

SIDC06D60AC6

Maximum Ratings

Parameter

VRRM

Continuous forward current limited by IF

Tjmax

Maximum repetitive forward current limited by Tjmax

IFRM

Operating junction and storage temperature

Tj , Tstg
1 depending on thermal properties of assembly

Condition

Value 600

Unit V

Static Electrical Characteristics tested on chip , Tj=25 °C, unless otherwise specified

Parameter

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Datasheet ID: SIDC06D60AC6X1SA1 638563