DDB6U134N16RRB11BPSA1

DDB6U134N16RRB11BPSA1 Datasheet

DDB6U180N16RR_B11 DDB6U180N16RRP_B37 TDB6HK180N16RR_B11 DDB6U134N16RR_B11 DDB6U104N16RRP_B37 DDB6U75N16W1R_B11

Part	Datasheet
DDB6U134N16RRB11BPSA1	DDB6U134N16RRB11BPSA1 (pdf)

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PressFIT Our established, reliable mounting technology Infineon’s established PressFIT technology offers the possibility for reliable, solder-less mounting of power modules, meeting the nowadays demands of lead-free technology. According to the RoHS directive, since 2006 most lead-containing solder alloys have to be replaced by lead-free solders. This results in higher melting point solders and lead-free tin metallization of the PCB, which has significant effects on the mounting process. PressFIT technology is one time-saving possibility for lead-free solderless mounting of power modules. The low electrical and thermal contact resistance makes the contact suitable for a wide range of currents and applications. Environmental tests show that vibration loads and climate sequences have no negative influence on the contact resistance. This results from the gas-tight contact and high contact force. The high holding forces of the contact are independent of the PCB hole tolerances. This reduces the effort for mechanical fixing. The PressFIT process can be separated from soldering and allows module mounting on the soldering and the component side of the PCB. This increases the design flexibility. Additionally, the module mounting process can be separated from the soldering process of the PCB. The high reliability of PressFIT contacts in general promises increased system reliability. This is especially of interest if modules are operating in harsh environments. Key features saves process time eliable cold welding connection of module pins and PCB ohmic resistance mounting possible on soldering and component side of PCB technology in automotive, communication & industrial applications ecrease of FIT rate drives power supplies energy systems conditioning heating equipment and agricultural vehicles CAV PressFIT Background of PressFIT technology As mentioned above, the PressFIT technology enables lead-free solderless solder less mounting of power modules. In addition, it offers the possibility of quicker mounting of the assembly, thus saving process time and costs with the resulting potential of higher output capacity. The possibility of mounting the module on either the soldering or the component side of the PCB provides further flexibility to meet the requirements of modern assembly lines. Quality of PressFIT modules Several tests regarding the application of the PressFIT technology and its reliability in power modules have been performed according to the well-known IEC standards e.g. IEC 60352-5 , but with enhanced conditions. The result of the whole program can be concluded as follows Not one of the tests caused any measurable contact degradation. The resistance of the connection, which is the leading indicator for the quality of the connection, is very stable during and after several loadings. This means not only that high current can be handled safely over the lifetime, but also the advanced integrated functions with low voltage and current e.g. current sensing will be kept absolutely stable beyond the lifetime of the system. Due to this, the PressFIT technology is well suited to power semiconductor modules especially for future high-reliability requirements. Overview Econo press-in & press-out tools Modules Easy press-in & press-out tools PressFIT Background of PressFIT technology Type of connection Solder manual machine Wire bond for hybrid circuits Au Wire-warp Crimp manual, machine Conductor cross-section in mm 2 to 300 Failure rate λref in FIT 1 Termi-point Press in Insulation displacement to 2 to 1 Screw to 16 Clamp elastic force

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PressFIT

Our established, reliable mounting technology

Infineon’s established PressFIT technology offers the possibility for reliable, solder-less mounting of power modules, meeting the nowadays demands of lead-free technology. According to the RoHS directive, since 2006 most lead-containing solder alloys have to be replaced by lead-free solders. This results in higher melting point solders and lead-free tin metallization of the PCB, which has significant effects on the mounting process.

PressFIT technology is one time-saving possibility for lead-free solderless mounting of power modules. The low electrical and thermal contact resistance makes the contact suitable for a wide range of currents and applications.

Environmental tests show that vibration loads and climate sequences have no negative influence on the contact resistance. This results from the gas-tight contact and high contact force. The high holding forces of the contact are independent of the PCB hole tolerances. This reduces the effort for mechanical fixing.

The PressFIT process can be separated from soldering and allows module mounting on the soldering and the component side of the PCB. This increases the design flexibility. Additionally, the module mounting process can be separated from the soldering process of the PCB. The high reliability of PressFIT contacts in general promises increased system reliability. This is especially of interest if modules are operating in harsh environments.

Key features
saves process time eliable cold welding connection
of module pins and PCB
ohmic resistance mounting possible on
soldering and component side of PCB
technology in
automotive, communication & industrial applications
ecrease of FIT rate
drives power supplies energy systems conditioning heating equipment and agricultural
vehicles CAV

PressFIT

Background of PressFIT technology

As mentioned above, the PressFIT technology enables lead-free solderless solder less mounting of power modules. In addition, it offers the possibility of quicker mounting of the assembly, thus saving process time and costs with the resulting potential of higher output capacity. The possibility of mounting the module on either the soldering or the component side of the PCB provides further flexibility to meet the requirements of modern assembly lines.

Quality of PressFIT modules Several tests regarding the application of the PressFIT technology and its reliability in power modules have been performed according to the well-known IEC standards e.g. IEC 60352-5 , but with enhanced conditions. The result of the whole program can be concluded as follows Not one of the tests caused any measurable contact degradation. The resistance of the connection, which is the leading indicator for the quality of the connection, is very stable during and after several loadings. This means not only that high current can be handled safely over the lifetime, but also the advanced integrated functions with low voltage and current e.g. current sensing will be kept absolutely stable beyond the lifetime of the system. Due to this, the PressFIT technology is well suited to power semiconductor modules especially for future high-reliability requirements.

Overview

Econo press-in & press-out tools

Modules

Easy press-in & press-out tools

PressFIT

Background of PressFIT technology

Type of connection

Solder
manual machine

Wire bond for hybrid circuits Au

Wire-warp

Crimp
manual, machine

Conductor cross-section in mm 2
to 300

Failure rate λref in FIT 1

Termi-point Press in Insulation displacement
to 2 to 1

Screw
to 16

Clamp elastic force

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Datasheet ID: DDB6U134N16RRB11BPSA1 638473