BUP 213
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BUP213 (pdf) |
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Infineon BUP 213 IGBT Preliminary data • Low forward voltage drop • High switching speed • Low tail current • Latch-up free • Avalanche rated Type BUP 213 VCE IC 1200V 32A Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage RGE = 20 Gate-emitter voltage DC collector current TC = 25 °C TC = 90 °C Pulsed collector current, tp = 1 ms TC = 25 °C TC = 90 °C Avalanche energy, single pulse IC = 15 A, VCC = 50 V, RGE = 25 L = 200 µH, Tj = 25 °C Power dissipation TC = 25 °C Chip or operating temperature Storage temperature Package TO-220 AB Symbol VCE VCGR VGE IC ICpuls Ptot Tj Tstg Pin 1 G Pin 2 C Pin 3 E Ordering Code Q67040-A4407 Values Unit 1200 1200 ± 20 A 32 20 64 40 200 -55 + 150 °C -55 + 150 Semiconductor Group Nov-30-1995 Infineon BUP 213 Maximum Ratings Parameter DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Thermal Resistance IGBT thermal resistance, chip case Symbol - RthJC Values Unit 55 / 150 / 56 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Values min. typ. max. Static Characteristics Gate threshold voltage VGE = VCE, IC = mA Collector-emitter saturation voltage VGE = 15 V, IC = 15 A, Tj = 25 °C VGE = 15 V, IC = 15 A, Tj = 125 °C VGE = 15 V, IC = 30 A, Tj = 25 °C VGE = 15 V, IC = 30 A, Tj = 125 °C Zero gate voltage collector current VCE = 1200 V, VGE = 0 V, Tj = 25 °C Gate-emitter leakage current VGE = 25 V, VCE = 0 V VGE th VCE sat - ICES - IGES - gfs - Ciss - Coss - Crss - 1000 1350 Unit V mA nA S pF Semiconductor Group Nov-30-1995 Infineon BUP 213 |
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