BSP300L6327HUSA1

BSP300L6327HUSA1 Datasheet

BSP300

Part	Datasheet
BSP300L6327HUSA1	BSP300L6327HUSA1 (pdf)

Related Parts	Information
BSP300 E6327	BSP300 E6327

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BSP300 SIPMOS Small-Signal Transistor • N channel • Enhancement mode • Avalanche rated • VGS th = V • Pb-free lead plating RoHS compliant • Qualified according to AEC Q101 Pin 1 G Pin 2 D Pin 3 S Pin 4 D Type BSP300 Type BSP300 VDS 800 V RoHS compliant Yes RDS on Package PG-SOT223 Marking BSP300 Tape and Reel Information Packaging L6327 Maximum Ratings Parameter Continuous drain current TA = 25 °C DC drain current, pulsed TA = 25 °C Avalanche energy, single pulse ID = A, VDD = 50 V, RGS = 25 L = 105 mH, Tj = 25 °C Gate source voltage Power dissipation TA = 25 °C ESD Class JESD22-A114-HBM Symbol ID IDpuls EAS VGS Ptot Values Unit ± 20 Class 1a 2008-03-26 BSP300 Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1 Thermal resistance, junction-soldering point 1 DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Tj Tstg RthJA RthJS 1 Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection Values Unit -55 + 150 °C -55 + 150 55 / 150 / 56 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Values Unit min.

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BSP300

SIPMOS Small-Signal Transistor
• N channel
• Enhancement mode
• Avalanche rated
• VGS th = V
• Pb-free lead plating RoHS compliant
• Qualified according to AEC Q101

Pin 1 G

Pin 2 D

Pin 3 S

Pin 4 D

Type BSP300

Type BSP300

VDS 800 V

RoHS compliant Yes

RDS on

Package PG-SOT223

Marking BSP300

Tape and Reel Information Packaging

L6327

Maximum Ratings Parameter Continuous drain current TA = 25 °C DC drain current, pulsed TA = 25 °C Avalanche energy, single pulse

ID = A, VDD = 50 V, RGS = 25

L = 105 mH, Tj = 25 °C Gate source voltage Power dissipation TA = 25 °C

ESD Class JESD22-A114-HBM

Symbol ID IDpuls EAS

VGS Ptot

Values

Unit
± 20

Class 1a
2008-03-26

BSP300

Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1 Thermal resistance, junction-soldering point 1 DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1

Tj Tstg RthJA RthJS
1 Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection

Values

Unit
-55 + 150 °C
-55 + 150
55 / 150 / 56

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Values

Unit
min.

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Datasheet ID: BSP300L6327HUSA1 637832