BSP299 E6327

BSP299 E6327 Datasheet

BSP299

Part	Datasheet
BSP299 E6327	BSP299 E6327 (pdf)

Related Parts	Information
BSP299L6327HUSA1	BSP299L6327HUSA1

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BSP299 SIPMOS Small-Signal Transistor • N channel • Enhancement mode • Avalanche rated • VGS th = V • Pb-free lead plating RoHS compliant • Qualified according to AEC Q101 Pin 1 G Pin 2 D Pin 3 S Pin 4 D Type BSP 299 Type BSP 299 VDS 500 V Pb-free Yes RDS on Package SOT-223 Tape and Reel Information L6327 Marking BSP299 Maximum Ratings Parameter Continuous drain current TA = 25 °C DC drain current, pulsed TA = 25 °C Avalanche energy, single pulse ID = A, RGS = 25 T j = 25 °C Gate source voltage Power dissipation TA = 25 °C ESD Class JESD22-A114-HBM Symbol ID IDpuls EAS VGS Ptot Values Unit ± 20 Class 1b 2011-06-01 BSP299 Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1 Therminal resistance, junction-soldering point DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Tj Tstg R thJA R thJS 1 Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection Values Unit -55 + 150 °C -55 + 150 55 / 150 / 56 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Values Unit min. typ. max.

PDF Datasheet Preview

BSP299

SIPMOS Small-Signal Transistor
• N channel
• Enhancement mode
• Avalanche rated
• VGS th = V
• Pb-free lead plating RoHS compliant
• Qualified according to AEC Q101

Pin 1 G

Pin 2 D

Pin 3 S

Pin 4 D

Type BSP 299

Type BSP 299

VDS 500 V

Pb-free Yes

RDS on

Package SOT-223

Tape and Reel Information L6327

Marking BSP299

Maximum Ratings Parameter Continuous drain current TA = 25 °C DC drain current, pulsed TA = 25 °C Avalanche energy, single pulse

ID = A, RGS = 25

T j = 25 °C Gate source voltage Power dissipation TA = 25 °C ESD Class JESD22-A114-HBM

Symbol ID IDpuls EAS

VGS Ptot

Values

Unit
± 20

Class 1b
2011-06-01

BSP299

Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1 Therminal resistance, junction-soldering point DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1

Tj Tstg R thJA R thJS
1 Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection

Values

Unit
-55 + 150 °C
-55 + 150
55 / 150 / 56

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Values

Unit
min.
typ.
max.

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Datasheet ID: BSP299E6327 637831