BSM75GB170DN2HOSA1

BSM75GB170DN2HOSA1 Datasheet


BSM 75 GB 170 DN2

Part Datasheet
BSM75GB170DN2HOSA1 BSM75GB170DN2HOSA1 BSM75GB170DN2HOSA1 (pdf)
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BSM 75 GB 170 DN2

IGBT Power Module
• Half-bridge
• Including fast free-wheeling diodes
• Package with insulated metal base plate
• RG on,min = 22 Ohm

Type BSM 75 GB 170 DN2

VCE IC 1700V 110A

Package HALF-BRIDGE 1

Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage RGE = 20 Gate-emitter voltage DC collector current TC = 25 °C TC = 80 °C Pulsed collector current, tp = 1 ms TC = 25 °C TC = 80 °C Power dissipation per IGBT TC = 25 °C Chip temperature Storage temperature

Thermal resistance, chip case Diode thermal resistance, chip case Insulation test voltage, t = 1min. Creepage distance Clearance DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1

Symbol VCE VCGR

VGE IC

ICpuls

Ptot

Tj Tstg RthJC RthJCD Vis -
Ordering Code C67070-A2702-A67

Values

Unit
1700
1700 ± 20

A 110 75
+ 150
-40 + 125
4000
40 / 125 / 56

Oct-27-1997

BSM 75 GB 170 DN2

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Parameter

Values
min.
typ.
max.

Static Characteristics

Gate threshold voltage

VGE th

VGE = VCE, IC = 5 mA

Collector-emitter saturation voltage

VCE sat

VGE = 15 V, IC = 75 A, Tj = 25 °C

VGE = 15 V, IC = 75 A, Tj = 125 °C

Zero gate voltage collector current

ICES

VCE = 1700 V, VGE = 0 V, Tj = 25 °C

VCE = 1700 V, VGE = 0 V, Tj = 125 °C

Gate-emitter leakage current

IGES

VGE = 20 V, VCE = 0 V
gfs 27

Ciss -

Coss -

Crss -

Unit V
mA nA S nF

Oct-27-1997

BSM 75 GB 170 DN2
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Datasheet ID: BSM75GB170DN2HOSA1 637793