BGF 104C E6327

BGF 104C E6327 Datasheet

BGF104

Part	Datasheet
BGF 104C E6327	BGF 104C E6327 (pdf)

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Data Sheet, V2.1, Oct. 2006 BGF104 HSMMC Interface Filter and ESD Protection Small Signal Discretes Edition 2006-10-17 Published by Infineon Technologies AG 81726 München, Germany Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF104 Previous Version 2006-03-03 Layout conformation BGF104 Data Sheet V2.1, 2006-10-17 BGF104 HSMMC Interface Filter and ESD Protection HSMMC Interface Filter and ESD Protection Feature • ESD protection and filter for High Speed Multi Media Card interface • ESD protection up to 15 kV at the external IOs • 16 pin green wafer level package with SnAgCu solder balls • 500 µm solder ball pitch • 300 µm solder ball diameter WLP-16-1 Int. IOs VMMC A4 MMCclk B4 MMCcmd C4 MMCdat0 C3 MMCdat1 D4 MMCdat2 D3 MMCdat3 R7, R8, R9, R10, R11, R1, 50 R2, 50 R3, 50 R4, 50 R5, 50 R6, 50 Ext. IOs Vdd A3 clk A2 cmd A1 dat0 B2 dat1 B1 dat2 C1 dat3 D1 Figure 1 Blockdiagram B3, C2, D2 GND B GF1 0 4 _ sch e m a tic.vsd The BGF104 is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected up to 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green package with a size of only mm x mm and a total height of mm. Type BGF104 Package WLP-16-1 Marking BGF104 Chip N0708 Data Sheet

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Data Sheet, V2.1, Oct. 2006

BGF104

HSMMC Interface Filter and ESD Protection

Small Signal Discretes

Edition 2006-10-17

Published by Infineon Technologies AG 81726 München, Germany

Infineon Technologies AG All Rights Reserved.

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics “Beschaffenheitsgarantie” . With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

BGF104

Previous Version 2006-03-03

Layout conformation

BGF104

Data Sheet

V2.1, 2006-10-17

BGF104

HSMMC Interface Filter and ESD Protection

HSMMC Interface Filter and ESD Protection

Feature
• ESD protection and filter for High Speed Multi Media Card
interface
• ESD protection up to 15 kV at the external IOs
• 16 pin green wafer level package with SnAgCu solder
balls
• 500 µm solder ball pitch
• 300 µm solder ball diameter

WLP-16-1

Int. IOs

VMMC

A4 MMCclk B4 MMCcmd C4 MMCdat0 C3 MMCdat1 D4 MMCdat2 D3 MMCdat3

R7, R8, R9, R10, R11,

R1, 50 R2, 50 R3, 50 R4, 50 R5, 50 R6, 50

Ext. IOs Vdd A3 clk A2 cmd A1 dat0 B2 dat1 B1 dat2 C1 dat3 D1

Figure 1 Blockdiagram

B3, C2, D2 GND

B GF1 0 4 _ sch e m a tic.vsd

The BGF104 is an ESD protection and filter circuit for a high speed multi media card interface. External pins are protected up to 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green package with a size of only mm x mm and a total height of mm.

Type BGF104

Package WLP-16-1

Marking BGF104

Chip N0708

Data Sheet

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived BGF104CE6327 Datasheet file may be downloaded here without warranties.

Datasheet ID: BGF104CE6327 637714