FNW700R64-18Z

FNW700R64-18Z Datasheet


FNW700R Power Modules DC-DC Converters

Part Datasheet
FNW700R64-18Z FNW700R64-18Z FNW700R64-18Z (pdf)
Related Parts Information
FNW700R64-18 FNW700R64-18 FNW700R64-18
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FNW700R Power Modules DC-DC Converters
36 75 Vdc Input 28Vdc Output 700W Output

Data Sheet
• RF Power Amplifier
• Wireless Networks
• Switching Networks

Options
• Output OCP/OVP auto restart
• Shorter pins
• Unthreaded heatsink holes
• High power density 127 W/in3
• Industry standard pin-out
• Low output ripple and noise
• Industry standard Full brick footprint
116.6mm x 60.7mm x 12.7mm x
• Remote Sense
• 2:1 input voltage range
• Single tightly regulated main output
• Constant switching frequency
• Latch after fault shutdown
• Over temperature protection auto restart
• Loosely regulated auxiliary output
• Power good signal
• Output voltage adjustment trim +10%/-40%
• Wide operating case temperature range -40°C to 100°C
• CE mark meets 73/23/EEC and 93/68/EEC directives§
• UL60950-1/CSA† C22.2 No. 60950-1-03 Certified CCSAUS and 0805:2001-12 EN60950-1 Licensed
• ISO** 9001 and ISO 14001 certified manufacturing facilities

The FNW700R series of dc-dc converters are a new generation of isolated DC/DC power modules providing up to 700W output power in an industry standard full size brick footprint, which makes it an ideal choice for high voltage and high power applications. Threaded-through holes are provided to allow easy mounting or addition of a heatsink for hightemperature applications. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections

October 1, 2015
2012 General Electric Company. All rights reserved.

FNW700R Power Modules DC-DC Converters
36 75 Vdc Input 28Vdc Output 700W Output

Absolute Maximum Ratings

Data Sheet

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter

Device

Unit

Input Voltage Continuous

Operating Ambient Temperature

See Thermal Considerations section

Note When the operating ambient temperature is within 55C~85C,
the application of the module refers to the derating curves of Figure 15
and Figure

Operating Case Temperature See Thermal Considerations section

Storage Temperature I/O Isolation Voltage, input to case Output to case

Tstg
1500

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter

Operating Input Voltage

Maximum Input Current VIN=36V to 75V, IO=IO, max Inrush Transient Input Reflected Ripple Current, peak-to-peak 5Hz to 20MHz, 12uH source impedance VIN=0V to 75V, IO= IOmax see Figure 10 Input Ripple Rejection 120Hz

Device

Unit

IIN,max
mAp-p

CAUTION This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to being an integrated part of complex power architecture. To preserve maximum flexibility, internal fusing is not included. Always use an input line fuse, to achieve maximum safety and system protection. The safety agencies require a fast-acting fuse with a maximum rating of 30A see Safety Considerations section . Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

October 1, 2015
The output power of the module should not exceed the rated power for the module as listed in the ordering Information table.

Although the maximum TC temperature of the power modules is 100 °C, you can limit this temperature to a lower value for extremely high reliability.

Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures.

Thermal Derating

Thermal derating is presented for two different applications 1 coupled to a cold plate inside a sealed clamshell chassis, without any internal air circulation, and 2 traditional open chassis or cards with force air flow. In application 1, the module is cooled entirely by conduction of heat from the module primarily through the top surface to a coldplate, with some conduction through the module’s pins to the power layers in the system board for application 2 the module is cooled by heat removal into a forced airflow that passes through the interior of the module and over the top baseplate and/or an attached heatsink.

OUTPUT CURRENT , Io A
0 20 30 40 50 60 70 80 90 100 CASE TEMERATURE, TC, oC

Figure Derating Output Current vs. case temeprature for FNW700R in Conduction cooling cold plate applications Ta <72ºC in vicinity of module interior VIN = 48V.

O U TPU T C U R EN T , Io A
400 lfm 15
10 m/S
200 lfm m/S
100 lfm 0

AMBIENT TEMERATURE, TA, oC

Figure Derating Output Current vs. Local Ambient Temperature and Airflow, No Heatsink, Vin = 48V.

O U TP U T C U R E N T , I o A
400 lfm
200 lfm 10
100 lfm
0 20 30 40 50 60 70 80 90 AMBIENT TEMERATURE, TA, oC

Figure Derating Output Current vs. Local Ambient Temperature and Airflow, 1” Transverse Heatsink, Vin = 48V.

October 1, 2015
2012 General Electric Company. All rights reserved.

Page 10

FNW700R Power Modules DC-DC Converters
36 75 Vdc Input 28Vdc Output 700W Output

Layout Considerations

The FNW700R power module series are aluminum base board packaged style, as such component clearance between the bottom of the power module and the mounting Host board is limited. Avoid placing copper areas on the outer layer directly underneath the power module.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules Soldering and Cleaning Application Note.

Data Sheet

October 1, 2015
2012 General Electric Company. All rights reserved.

Page 11

FNW700R Power Modules DC-DC Converters
36 75 Vdc Input 28Vdc Output 700W Output

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches]. Tolerances x.x mm  mm [x.xx in.  in.] unless otherwise indicated
x.xx mm  mm [x.xxx in  in.]

Data Sheet

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Ordering Information

Please contact your GEZ Sales Representative for pricing, availability and optional features.

Table Device Code

Input Voltage

Output Voltage

Output Current

Efficiency

Connector Type

Product codes
48V 36-75Vdc

Through hole

FNW700R4
48V 36-75Vdc

Through hole

FNW700R64
48V 36-75Vdc

Through hole

FNW700R64-18

Comcodes

CC109141231 CC109145018 CC109141396

Table Device Options

Option Auto restart hiccup protection Pin Length mm ± 0.25mm , in. ± in. Unthreaded heatsink mounting holes

Device Code Suffix 4 6 18

Contact Us

For more information, call us at

USA/Canada +1 877 546 3243, or +1 972 244 9288

Asia-Pacific:

Europe, Middle-East and Africa:

GE Critical Power reserves the right to make changes to the product s or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product s or information.

October 1, 2015
2012 General Electric Company. All International rights reserved.

Version
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Datasheet ID: FNW700R64-18Z 645653