B82469G1152M

B82469G1152M Datasheet


B82469G1

Part Datasheet
B82469G1152M B82469G1152M B82469G1152M (pdf)
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PDF Datasheet Preview
SMT power inductors

Low profile Size x mm

Series/Type:

B82469G1

Date:

October 2008

EPCOS AG Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS’ prior express consent is prohibited.

SMT power inductors

Size s mm

Preliminary data

Rated inductance NH to 22 NH

Rated current A to A

Construction
• Magnetically shielded
• Special ferrite core shape
• Winding enamel copper wire
• Winding welded to terminals
• Low profile
• Temperature range up to 125 °C
• High rated current
• Low DC resistance
• Suitable for lead-free reflow soldering
• RoHS-compatible
• Filtering of supply voltages
• Coupling, decoupling
• DC/DC converters
• Handheld devices e.g. mobile phones, MP3 players, etc.
• EDP Electronic Data Processing
• Consumer electronics

Terminals
• Base material CuSn6P
• Layer composition Ni, Sn lead-free
• Electro-plated

Marking
• Marking on component To be determined
• Minimum data on reel:
Manufacturer, ordering code, L value, quantity, date of packing

Delivery mode and packing unit
• 12-mm blister tape, wound on 180-mm reel
• Packing unit 1000 pcs./reel

B82469G1

Please read Cautions and warnings and Important notes at the end of this document.
2 10/08

SMT power inductors

Size s mm

Preliminary data

Dimensional drawing and layout recommendation

B82469G1

IND0841-C
max.
1 Soldering area

IND0840-Z-E

Dimensions in mm

Taping and packing Blister tape

Reel
max.
min. A

Direction of unreeling
1 Limit tolerance over 10 pitches

IND0833-N-E

Dimensions in mm

IND0397-K

Please read Cautions and warnings and Important notes at the end of this document.
3 10/08

SMT power inductors

Size s mm

Preliminary data

Technical data and measuring conditions

B82469G1

Rated inductance LR Rated temperature TR Rated current IR Saturation current Isat,typ DC resistance Rtyp Solderability lead-free

Resistance to soldering heat Climatic category Storage conditions

Weight

Measured with LCR meter Agilent 4294 A at frequency fL, V, 20 °C
85 °C

Max. permissible DC with temperature increase of 40 K at rated temperature

Max. permissible DC with inductance decrease of approx. 30%, typical values Measured at 20 °C, tolerance typical values

Dip and look method Sn95.5Ag3.8Cu0.7 245 ±5 °C, 3 s Wetting of soldering area 90% based on IEC 60068-2-58
260 °C, 10 s based on IEC 60068-2-58
55/125/56 to IEC 60068-1
Characteristics and ordering codes

LR uH
10 15 22

Tolerance fL
±20% M

Isat,typ A

Rtyp Ω
Ordering code

B82469G1501M000 B82469G1102M000 B82469G1152M000 B82469G1222M000 B82469G1332M000 B82469G1472M000 B82469G1682M000 B82469G1103M000 B82469G1153M000 B82469G1223M000

Please read Cautions and warnings and Important notes at the end of this document.
4 10/08

SMT power inductors

Size s mm

Preliminary data

Current derating Iop/IR versus ambient temperature TA rated temperature TR = 85 °C

Iop IR

IND0508-Z
0 20 40 60 80 100 120 150

B82469G1
5 10/08

Cautions and warnings
• Please note the recommendations in our Inductors data book latest edition and in the data sheets. Particular attention should be paid to the derating curves given there. The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing.
• If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation.
• The following points must be observed if the components are potted in customer applications Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. The effect of the potting material can change the high-frequency behaviour of the components.
• Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core.
• Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer.

Please read Cautions and warnings and Important notes at the end of this document.
6 10/08

Important notes

The following applies to all products named in this publication:

Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application.

As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application.

We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of a passive electronic component could endanger human life or health e.g. in accident prevention or life-saving systems , it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer e.g. installation of protective circuitry or redundancy that no injury or damage is sustained by third parties in the event of malfunction or failure of a passive electronic component.

The warnings, cautions and product-specific notes must be observed.

In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions e.g. because they are classed as hazardous . Useful information on this will be found in our Material Data Sheets on the Internet Should you have any more detailed questions, please contact our sales offices.

We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available.

The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.

Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association ZVEI .

The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at
7 10/08
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Datasheet ID: B82469G1152M 511673