0402ESDA-MLP
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0402ESDA-MLPT (pdf) |
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Technical Data 4367 Effective February 2016 Supersedes September 2010 0402ESDA-MLP ESD suppressor HALOGEN Pb HF FREE Product description • Ultra-low capacitance pF ideal for high speed data applications • Provides Electro Static Discharge ESD protection with fast response time <1 ns allowing equipment to pass IEC 61000-4-2 Level 4 test • Single-line, bi-directional device • 0402 1005 metric compact design utilizes less board space • Lead free, Halogen free and RoHS compliant Applications • ESD port protection for mobile/smart phones • Game console ESD port protection • High speed ESD data port protection • Set-top-boxes • Tablets, notebooks, netbooks, laptops • High definition television HDTV • Media players • Digital cameras • Medical equipment • Computers and peripherals ESD port protection • Consumer electronics Ordering • Specify part number and termination suffix e.g. 0603ESDA-MLP1 0603ESDA-MLP=part number, 1=Termination suffix Termination suffixes • 1 Dip termination, Packaged Tape and reel, 10 000 parts per 7” diameter reel Technical Data 4367 Effective February 2016 Product specifications Part number4 0402ESDA-MLP Rated voltage mVaDCx imum Clamping voltage1 V typical Trigger voltage2 V typical Capacitance 1 MHz pF typical Capacitance 1 MHz pF maximum Attenuation change GHz dB typical 0402ESDA-MLP ESD Leakage current 1ty2pVicDaC l nA ESD capability IEC61000-42 Direct discharge kV typical ESD capability IEC61000-42 Air discharge kV typical ESD pulse withstand3 typical >1000 Clamping voltage Per IEC61000-4-2, Level 4 waveform 8 kV direct 30 A measured 30 ns after initial pulse. Trigger voltage Trigger measurement made using Transmission Line Pulse TLP method. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. Part Number Definition 0402ESDA-MLP 0402ESDA= Product code and size -MLP= Form designation [in] Design considerations The location in the circuit for the 0402ESDA-MLP has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design pad directly on the signal/data line and second pad directly on common ground . 0402ESDA-MLP ESD Environmental data Operating temperature - 55 °C to +125 °C Storage temperature component - 55 °C to +125 °C Load humidity 12 VDC per EIA/IS- 722 +85 °C, 85% relative humidity for 1000 hours Thermal shock 10 cycles, - 55 °C to +125 °C, 30 minute dwell time Moisture resistance MIL-STD-202G, method 106G, 10 cycles Mechanical shock EIA/IS- 722 paragraph Mechanical vibration EIA/IS- 722 paragraph Resistance to solvent EIA/IS- 722 paragraph Packaging information Supplied in tape-and-reel packaging, 10 000 parts per reel, 7” diameter reel. Technical Data 4367 Effective February 2016 Technical Data 4367 Effective February 2016 Wave solder profile Reflow soldering not recommended First Wave Second Wave 0402ESDA-MLP ESD Temperatur e Tsmax Tstyp |
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