S70GL02GP12FFI010

S70GL02GP12FFI010 Datasheet

S70GL-P Flash

Part	Datasheet
S70GL02GP12FFI010	S70GL02GP12FFI010 (pdf)

Related Parts	Information
S70GL02GP13FFIV20	S70GL02GP13FFIV20
S70GL02GP12FFI013	S70GL02GP12FFI013
S70GL02GP12FFI020	S70GL02GP12FFI020
S70GL02GP12FFI022	S70GL02GP12FFI022
S70GL02GP12FFI023	S70GL02GP12FFI023
S70GL02GP12FFI012	S70GL02GP12FFI012
S70GL02GP12FAIR20	S70GL02GP12FAIR20

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S70GL-P Flash S70GL02GP 2 Gigabit, Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology Data Sheet S70GL-P Flash Cover Sheet The S70GL02GP is not recommended for new designs. At this time, there is no direct replacement. Customers are advised to use the S29GL01GP or contact your local sales representative for more information. Please refer to the S29GL01GP data sheet for specifications and ordering information. Notice to Readers This document states the current technical specifications regarding the Spansion product s described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions. Publication Number S70GL-P_00 Issue Date May 19, 2008 Data Sheet Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: Combination Some data sheets contain a combination of products with different designations Advance Information, Preliminary, or Full Production . This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table in the table notes . The disclaimer on the first page refers the reader to the notice on this page. Full Production No Designation on Document When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product s described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office. S70GL-P Flash S70GL-P_00_02 May 19, 2008 S70GL-P Flash S70GL02GP 2 Gigabit, Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology Data Sheet The S70GL02GP is not recommended for new designs. At this time, there is no direct replacement. Customers are advised to use the S29GL01GP or contact your local sales representative for more information. Please refer to the S29GL01GP data sheet for specifications and ordering information. The Spansion S70GL02GP 2-Gigabit Mirrorbit Flash memory device is fabricated on 90 nm process technology. This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that require higher density, better performance and lower power consumption. Distinctive Characteristics - Two 1024 Megabit S29GL01GP in a single 64-ball FortifiedBGA package see publication S29GL-P_00 for full specifications - Single 3V read/program/erase V - Enhanced VersatileI/O control All input levels address, control, and DQ input levels and outputs are determined by voltage on VIO input. VIO range is to VCC - 90 nm MirrorBit process technology - 8-word/16-byte page read buffer - 32-word/64-byte write buffer reduces overall programming time for multiple-word writes - Secured Silicon Sector region 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number Can be programmed and locked at the factory or by the customer - Uniform 64Kword/128KByte Sector Architecture S70GL02GP two thousand forty-eight sectors - 100,000 erase cycles per sector typical - 20-year data retention typical - Offered Packages 64-ball Fortified BGA - Suspend and Resume commands for Program and Erase operations - Write operation status bits indicate program and erase operation completion - Unlock Bypass Program command to reduce programming time - Support for CFI Common Flash Interface - Persistent and Password methods of Advanced Sector Protection - WP#/ACC input Accelerates programming time when VACC is applied for greater throughput during system production Protects first or last sector of each die, regardless of sector protection settings - Hardware reset input RESET# resets device - Ready/Busy# output RY/BY# detects program or erase cycle completion Publication Number S70GL-P_00 Issue Date May 19, 2008 Data Sheet Performance Characteristics Max. Read Access Times ns Note 1 Parameter Random Access Time tACC Page Access Time tPACC CE# Access Time tCE OE# Access Time tOE 110 120 130 110 120 130 Notes Access times are dependent on VCC and VIO operating ranges. See Ordering Information on page 7 for further details. V1 VCC = V. V2 VCC = VIO = V. V3 VIO = VCC = 3 V. Contact a sales representative for availability. Current Consumption typical values Random Access Read 8-Word Page Read Program/Erase Standby 30 mA 1 mA 50 mA 2 µA Program & Erase Times typical values Single Word Programming Effective Write Buffer Programming VCC Per Word Effective Write Buffer Programming VACC Per Word Sector Erase Time 64 Kword Sector 60 µs 15 µs 15 µs S70GL-P Flash S70GL-P_00_02 May 19, 2008 Data Sheet May 19, 2008 S70GL-P_00_02 S70GL-P Flash Data Sheet Table of Contents General Description 3 Distinctive Characteristics 3 Performance Characteristics 4 Ordering Information 7 Recommended Combinations 7 Input/Output Descriptions & Logic Symbol 8 S70GL-P Flash S70GL-P_00_02 May 19, 2008 Data Sheet Ordering Information The ordering part number is formed by a valid combination of the following: S70GL02GP PACKING TYPE 0 = Tray standard see Note 3 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER VIO range, protection when WP# =VIL 01 = VIO = VCC = to V, highest address sector protected 02 = VIO = VCC = to V, lowest address sector protected V1 = VIO = to VCC, VCC = to V, highest address sector protected V2 = VIO = to VCC, VCC = to V, lowest address sector protected R1 = VIO = VCC = to V, highest address sector protected R2 = VIO = VCC = to V, lowest address sector protected TEMPERATURE RANGE I = Industrial to +85°C = Commercial 0°C to +85°C PACKAGE MATERIALS SET A = Pb Note 1 F = Pb-free PACKAGE TYPE F = Fortified Ball Grid Array, mm pitch package SPEED OPTION 11 = 110 ns 12 = 120 ns 13 = 130 ns DEVICE NUMBER/DESCRIPTION S70GL02GP Volt-only, 2048 Megabit 128 M x 16-Bit/256 M x 8-Bit Page-Mode Flash Memory Manufactured on 90 nm MirrorBit process technology Recommended Combinations Recommended Combinations table below list various configurations planned to be available in volume. The table below will be updated as new combinations are released. Check with your local sales representative to confirm availability of specific configuration not listed or to check on newly released combinations. Base OPN S29GL-P Recommended Combinations Note 1 Speed ns Package & Temperature Model Number Packing Type S70GL02GP FFC, FAC Note 2 R1, R2 0, 2, 3 Note 3 Notes Contact a local sales representative for availability. BGA package marking omits leading “S29” and packing type designator from ordering part number. Packing Type “0” is standard option. Ordering Part Number x = Packing Type S70GL02GP11FFCR1x S70GL02GP11FFCR2x S70GL02GP11FACR1x S70GL02GP11FACR2x May 19, 2008 S70GL-P_00_02 S70GL-P Flash Data Sheet Input/Output Descriptions & Logic Symbol Table identifies the input and output package connections provided on the device. Table Input/Output Descriptions Symbol DQ15/A-1 CE# OE# WE# VCC VIO VSS RY/BY# BYTE# RESET# WP#/ACC Type Input I/O I/O Input Supply Output Input Input Input Reserved Address lines for GL02GP Data input/output. DQ15 Data input/output in word mode. A-1 LSB address input in byte mode. Chip Enable. Output Enable. Write Enable. Device Power Supply. Versatile IO Input. Ground. Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At VIL, the device is actively erasing or programming. At High Z, the device is in ready. Selects data bus width. At VIL, the device is in byte configuration and data I/O pins DQ0DQ7 are active. At VIH, the device is in word configuration and data I/O pins DQ0-DQ15 are active. Hardware Reset. Low = device resets and returns to reading array data. Write Protect/Acceleration Input. At VIL, disables program and erase functions in the outermost sectors. At VHH, accelerates programming automatically places device in unlock bypass mode. Should be at VIH for all other conditions. Reserved for future use. Not connected internally. S70GL-P Flash S70GL-P_00_02 May 19, 2008 Data Sheet Special Handling Instructions for BGA Package Special handling is required for Flash Memory products in BGA packages. Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time. Figure 64-ball Fortified Ball Grid Array 64-ball Fortified BGA Top View, Balls Facing Down A16 BYTE# DQ15/A-1 VSS DQ7 DQ14 DQ13 DQ6 WE# RESET# A21 DQ12 Ordering Information Erase And Program Performance Common Flash Memory Interface Initial Release. Changed data sheet designation Added Product Life-cycle notice Removed Table of Figures and Table of Tables - Changed sample OPN - Added Commercial temperature range - Changed configuration in “Device Number/description” - Modified “Recommended Combination” table & removed TSOP package option Chip Program Time removed comment Removed section see publication S29GL-P_00 for details May 19, 2008 S70GL-P_00_02 S70GL-P Flash Data Sheet Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated 1 for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system , or 2 for any use where chance of failure is intolerable i.e., submersible repeater and artificial satellite . Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright 2006-2008 Spansion Inc. All rights reserved. the Spansion Logo, Eclipse , ORNAND , HD-SIM and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners. S70GL-P Flash S70GL-P_00_02 May 19, 2008

PDF Datasheet Preview

S70GL-P Flash

S70GL02GP 2 Gigabit, Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology

Data Sheet

S70GL-P Flash Cover Sheet
The S70GL02GP is not recommended for new designs. At this time, there is no direct replacement. Customers are advised to use the S29GL01GP or contact your local sales representative for more information. Please refer to the S29GL01GP data sheet for specifications and ordering information.

Notice to Readers This document states the current technical specifications regarding the Spansion product s described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

Publication Number S70GL-P_00

Issue Date May 19, 2008

Data Sheet

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions.

Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.”

Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content:
Combination Some data sheets contain a combination of products with different designations Advance Information, Preliminary, or Full Production . This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table in the table notes . The disclaimer on the first page refers the reader to the notice on this page.
Full Production No Designation on Document When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product s described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.”

Questions regarding these document designations may be directed to your local sales office.

S70GL-P Flash

S70GL-P_00_02 May 19, 2008

S70GL-P Flash

S70GL02GP 2 Gigabit, Volt-only Page Mode Flash Memory featuring 90 nm MirrorBit Process Technology

Data Sheet
The S70GL02GP is not recommended for new designs. At this time, there is no direct replacement. Customers are advised to use the S29GL01GP or contact your local sales representative for more information. Please refer to the S29GL01GP data sheet for specifications and ordering information.

The Spansion S70GL02GP 2-Gigabit Mirrorbit Flash memory device is fabricated on 90 nm process technology. This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that require higher density, better performance and lower power consumption.

Distinctive Characteristics
- Two 1024 Megabit S29GL01GP in a single 64-ball FortifiedBGA package see publication S29GL-P_00 for full specifications
- Single 3V read/program/erase V - Enhanced VersatileI/O control

All input levels address, control, and DQ input levels and outputs are determined by voltage on VIO input. VIO range is to VCC
- 90 nm MirrorBit process technology - 8-word/16-byte page read buffer - 32-word/64-byte write buffer reduces overall programming
time for multiple-word writes - Secured Silicon Sector region
128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number

Can be programmed and locked at the factory or by the customer - Uniform 64Kword/128KByte Sector Architecture

S70GL02GP two thousand forty-eight sectors - 100,000 erase cycles per sector typical - 20-year data retention typical
- Offered Packages 64-ball Fortified BGA
- Suspend and Resume commands for Program and Erase operations
- Write operation status bits indicate program and erase operation completion
- Unlock Bypass Program command to reduce programming time
- Support for CFI Common Flash Interface - Persistent and Password methods of Advanced Sector

Protection - WP#/ACC input

Accelerates programming time when VACC is applied for greater throughput during system production

Protects first or last sector of each die, regardless of sector protection settings
- Hardware reset input RESET# resets device - Ready/Busy# output RY/BY# detects program or erase
cycle completion

Publication Number S70GL-P_00

Issue Date May 19, 2008

Data Sheet

Performance Characteristics

Max. Read Access Times ns Note 1

Parameter

Random Access Time tACC Page Access Time tPACC CE# Access Time tCE OE# Access Time tOE
110 120 130
110 120 130
Notes Access times are dependent on VCC and VIO operating ranges. See Ordering Information on page 7 for further details.

V1 VCC = V. V2 VCC = VIO = V. V3 VIO = VCC = 3 V.

Contact a sales representative for availability.

Current Consumption typical values Random Access Read 8-Word Page Read Program/Erase Standby
30 mA 1 mA 50 mA 2 µA

Program & Erase Times typical values Single Word Programming Effective Write Buffer Programming VCC Per Word Effective Write Buffer Programming VACC Per Word Sector Erase Time 64 Kword Sector
60 µs 15 µs 15 µs

S70GL-P Flash

S70GL-P_00_02 May 19, 2008

Data Sheet

May 19, 2008 S70GL-P_00_02

S70GL-P Flash

Data Sheet

Table of Contents
General Description 3 Distinctive Characteristics 3 Performance Characteristics 4 Ordering Information 7

Recommended Combinations 7 Input/Output Descriptions & Logic Symbol 8

S70GL-P Flash

S70GL-P_00_02 May 19, 2008

Data Sheet
Ordering Information
The ordering part number is formed by a valid combination of the following:

S70GL02GP

PACKING TYPE 0 = Tray standard see Note 3 2 = 7” Tape and Reel 3 = 13” Tape and Reel

MODEL NUMBER VIO range, protection when WP# =VIL 01 = VIO = VCC = to V, highest address sector protected 02 = VIO = VCC = to V, lowest address sector protected V1 = VIO = to VCC, VCC = to V, highest address sector protected V2 = VIO = to VCC, VCC = to V, lowest address sector protected R1 = VIO = VCC = to V, highest address sector protected R2 = VIO = VCC = to V, lowest address sector protected

TEMPERATURE RANGE I = Industrial to +85°C = Commercial 0°C to +85°C

PACKAGE MATERIALS SET A = Pb Note 1 F = Pb-free

PACKAGE TYPE F = Fortified Ball Grid Array, mm pitch package

SPEED OPTION 11 = 110 ns 12 = 120 ns 13 = 130 ns

DEVICE NUMBER/DESCRIPTION S70GL02GP Volt-only, 2048 Megabit 128 M x 16-Bit/256 M x 8-Bit Page-Mode Flash Memory Manufactured on 90 nm MirrorBit process technology

Recommended Combinations

Recommended Combinations table below list various configurations planned to be available in volume. The table below will be updated as new combinations are released. Check with your local sales representative to confirm availability of specific configuration not listed or to check on newly released combinations.

Base OPN

S29GL-P Recommended Combinations Note 1

Speed ns

Package & Temperature

Model Number Packing Type

S70GL02GP

FFC, FAC Note 2

R1, R2
0, 2, 3 Note 3
Notes Contact a local sales representative for availability. BGA package marking omits leading “S29” and packing type designator from ordering part number. Packing Type “0” is standard option.
Ordering Part Number x = Packing Type

S70GL02GP11FFCR1x S70GL02GP11FFCR2x S70GL02GP11FACR1x S70GL02GP11FACR2x

May 19, 2008 S70GL-P_00_02

S70GL-P Flash

Data Sheet

Input/Output Descriptions & Logic Symbol

Table identifies the input and output package connections provided on the device.

Table Input/Output Descriptions

Symbol DQ15/A-1

CE# OE# WE# VCC VIO VSS RY/BY#

BYTE#

RESET#

WP#/ACC

Type Input I/O I/O Input Supply Output

Input

Input

Input

Reserved

Address lines for GL02GP

Data input/output.

DQ15 Data input/output in word mode. A-1 LSB address input in byte mode.

Chip Enable.

Output Enable.

Write Enable.

Device Power Supply.

Versatile IO Input.

Ground.

Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At VIL, the device is actively erasing or programming. At High Z, the device is in ready. Selects data bus width. At VIL, the device is in byte configuration and data I/O pins DQ0DQ7 are active. At VIH, the device is in word configuration and data I/O pins DQ0-DQ15 are active.

Hardware Reset. Low = device resets and returns to reading array data.

Write Protect/Acceleration Input. At VIL, disables program and erase functions in the outermost sectors. At VHH, accelerates programming automatically places device in unlock bypass mode. Should be at VIH for all other conditions. Reserved for future use. Not connected internally.

S70GL-P Flash

S70GL-P_00_02 May 19, 2008

Data Sheet

Special Handling Instructions for BGA Package

Special handling is required for Flash Memory products in BGA packages. Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.

Figure 64-ball Fortified Ball Grid Array
64-ball Fortified BGA Top View, Balls Facing Down

A16 BYTE# DQ15/A-1 VSS

DQ7 DQ14 DQ13 DQ6

WE# RESET# A21

DQ12
Ordering Information

Erase And Program Performance Common Flash Memory Interface

Initial Release.

Changed data sheet designation Added Product Life-cycle notice Removed Table of Figures and Table of Tables - Changed sample OPN - Added Commercial temperature range - Changed configuration in “Device Number/description” - Modified “Recommended Combination” table & removed TSOP package option Chip Program Time removed comment Removed section see publication S29GL-P_00 for details

May 19, 2008 S70GL-P_00_02

S70GL-P Flash

Data Sheet

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated 1 for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system , or 2 for any use where chance of failure is intolerable i.e., submersible repeater and artificial satellite . Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products.

Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document.

Copyright 2006-2008 Spansion Inc. All rights reserved. the Spansion Logo, Eclipse , ORNAND , HD-SIM and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.

S70GL-P Flash

S70GL-P_00_02 May 19, 2008

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived S70GL02GP12FFI010 Datasheet file may be downloaded here without warranties.

Datasheet ID: S70GL02GP12FFI010 508322