MB88121CPMC1-GS-ERE2

MB88121CPMC1-GS-ERE2 Datasheet


FME-MB88121-1.48E

Part Datasheet
MB88121CPMC1-GS-ERE2 MB88121CPMC1-GS-ERE2 MB88121CPMC1-GS-ERE2 (pdf)
Related Parts Information
MB88121CPMC1-GE1 MB88121CPMC1-GE1 MB88121CPMC1-GE1
MB88121CPMC1-GS-N2E2 MB88121CPMC1-GS-N2E2 MB88121CPMC1-GS-N2E2
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The following document contains information on Cypress products. Although the document is marked with the name “Spansion” and “Fujitsu”, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers.
Continuity of Ordering Part Numbers Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document.

For More Information Please contact your local sales office for additional information about Cypress products and solutions.

About Cypress NASDAQ CY delivers high-performance, high-quality solutions at the heart of today’s most advanced embedded systems, from automotive, industrial and networking platforms to highly interactive consumer and mobile devices. With a broad, differentiated product portfolio that includes NOR flash memories, F-RAM and SRAM, Traveo microcontrollers, the industry’s only programmable system-on-chip solutions, analog and PMIC Power Management ICs, capacitive touch-sensing controllers, and Wireless BLE Low-Energy and USB connectivity solutions, Cypress is committed to providing its customers worldwide with consistent innovation, bestin-class support and exceptional system value.

FME-MB88121-1.48E

Automotive Solutions

CMOS

FlexRay ASSP

MB88121/MB88121A/MB88121B/MB88121C
• DESCRIPTION

The MB88121 Series FlexRay ASSP application specific standard product facilitates to add FlexRay connectivity to 8-bit, 16-bit and 32-bit microcontrollers that do not comprise embedded FlexRay protocol cores. The device features a FlexRay communication controller based on the ERAY*1 IP core provided by Bosch. The most recent FlexRay communication controller complies to the protocol definition of the FlexRay consortium. Fujitsu intends to update the communications controller when new protocol definitions are released. Please, refer to the chapter ‘product lineup’ for a cross reference between device version and protocol version supported. Several parallel and serial interfaces provide connectivity to a vast number of host processors.

All types of host interfaces are selectable by mode pins that supersede any programming by the user. The configurable parallel host interface connects to most 16-bit and 32-bit microcontrollers while SPI offers serial interfacing options. A DMA support unit avoids that the application on the host processor has to wait until the input buffer becomes available for writing.

The version suffix ’B/C’ of the ASSP is operated from a single 3.3V or V supply and includes an on board voltage regulator that provides V to the internal core. This creates a major advantage in terms of EMI and power consumption.

The internal PLL clock frequency multiplier provides an internal 80 MHz clock from an external 4 MHz, 5 MHz, 8 MHz, 10 MHz, 16 MHz*2 or 20 MHz*2 clock. Alternatively the user may choose to drive the clock input with a square wave signal from the host processor.
*1 License of Robert Bosch GmbH
*2 MB88121C only

MB88121
• PACKAGE

FlexRay ASSP
64-pin Plastic LQFP

FPT-64P-M03/M24

The device is offered in a standard 64-pin quad flatpack package with a pin pitch of mm.
• FEATURES
• FlexRay communication controller based on ERAY*1 IP core from Bosch
• Data rates of up to 10 Mbit/s on each channel
• Up to 128 message buffers configurable
• 8 Kbyte of Message RAM for storage of e.g. 128 message buffers with max. 48 byte data section or up to 30 message buffers with 254 byte data section
• Configuration of message buffers with different payload lengths possible
• One configurable receive FIFO
• Each message buffer can be configured as receive buffer, as transmit buffer or as part of the receive FIFO
• Host access to message buffers via Input and Output Buffer Input Buffer Holds message to be transferred to the Message RAM Output Buffer Holds message read from the Message RAM
• Filtering for slot counter, cycle counter, and channel
• Maskable module interrupts
• Network Management supported
• Configurable parallel host interface
• SPI interface 8 Mbit/s MB88121B/C only
• DMA support unit MB88121A/B/C only
• 0.18um CMOS Process Technology
• Single voltage supply V / V , internal voltage regulator for V core voltage offering low EMI and low
power consumption MB88121B/C only
• Package 64-pin*2 plastic LQFP;
*1 License of Robert Bosch GmbH *2 Other packages such as 48-pin plastic LQFP featuring only SPI host interface are under consideration.

MB88121

FlexRay ASSP
• PRODUCT LINEUP

Part Number Parameter

MB88121

MB88121A

MB88121B

MB88121C

System clock

Direct clock input 80MHz or 40MHz for 5Mbit/s .

On-chip PLL evaluation pending External clock 10 MHz, internal clock
80 MHz 50% duty cycle .

On-chip PLL jitter evaluation
pending External clock input
4/5/8/10 MHz
• ORDERING INFORMATION

Part number MB88121BPFV MB88121BPMC1 MB88121CPMC1

Package
64-pin Plastic LQFP FPT-64P-M03
64-pin Plastic LQFP FPT-64P-M24
64-pin Plastic LQFP FPT-64P-M24

FlexRay ASSP

Remarks ES only ES only

MB88121
• PACKAGE DIMENSION
64-pin Plastic LQFP FPT-64P-M03

FlexRay ASSP

Note 1 * These dimensions do not include resin protrusion. Note 2 Pins width and pins thickness including plating thickness. Note 3 Pins width do not include tie bar cutting remainder.

Dimensions in mm inches Note The values in parentheses are reference values.

MB88121

FlexRay ASSP
64-pin plastic LQFP

Lead pitch

Package width x package length

Lead shape
mm x mm

Gullwing

Sealing method

Code Reference

Plastic mold P-LFQFP64-10x10-0.50

FPT-64P-M24
64-pin plastic LQFP FPT-64P-M24
12.00±0.20 .472±.008 SQ
*10.00±0.10 .394±.004 SQ

Note 1 * These dimensions do not include resin protrusion. Note 2 Pins width and pins thickness include plating thickness. Note 3 Pins width do not include tie bar cutting remainder.

Details of "A" part

INDEX

LEAD No. 1

C 2006-2010 FUJITSU SEMICONDUCTOR LIMITED F64036S-1c D -1-3

NOM.

Details of "B" part

Mounting height
0~8°

Stand off

Dimensions in mm inches . Note The values in parentheses are reference values

MB88121
The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Fujitsu semiconductor device Fujitsu does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third party or does Fujitsu warrant non-infringement of any third-party’s intellectual property right or other right by using such information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated 1 for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system , or 2 for use requiring extremely high reliability i.e., submersible repeater and artificial satellite . Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan.
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Datasheet ID: MB88121CPMC1-GS-ERE2 508290