MB39C308BGF-G-ERE1

MB39C308BGF-G-ERE1 Datasheet

MB39C308

Part	Datasheet
MB39C308BGF-G-ERE1	MB39C308BGF-G-ERE1 (pdf)

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The following document contains information on Cypress products. FUJITSU MICROELECTRONICS DATA SHEET DS04-27261-6E ASSP for Power Management Applications of Ultra Mobile PC 6ch DC/DC Converter IC for LPIA Platform VR MB39C308 • DESCRIPTION The MB39C308 is a 6ch DC/DC buck converter LSI, which integrates all of necessary power supplies for UltraMobile PC powered by 2-cell Li-ion battery. And the MB39C308 uses current mode topology with N-channel synchronous rectification to realize high conversion efficiency. The MB39C308 is the Power Management IC supporting the LPIA Low Power Intel Architecture which Intel Corporation proposes as the low power consumption platform for UMPC. The CH1 and CH2 are flexible to adopt the output current capability by selection of external FETs and easy to optimize efficiency. The CH3, CH4, CH5 and CH6 integrate the switching FETs capable of high current for downsizing the power supply solution. The MB39C308 uses Fujitsu’s LDMOS process technology and supplies all power without dispersing power from a lithium-ion battery. • FEATURES • Input voltage range V to V • Topology Current Mode • Integrated FET Driver for external MOSFETs CH1, CH2 • Integrated Switching MOSFETs CH3, CH4, CH5, CH6 • Fixed Preset Output Voltage CH1, CH2, CH5 • Selectable Preset Output Voltage CH3, CH4, CH6 Channel Output voltage Output current Remarks CH3 CH4 V/1.5 V/0.75 V Max A DDR2/DDR3 are selectable. Max A Max A V/1.05 V Max A Two values are selectable. * It is the reference value at the typical EVB. Continued Copyright 2007-2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved MB39C308 Continued • PWM switching frequency CH4 MHz/0.35 MHz • Various protection - Over current protection OCP - Input over voltage protection IVP • ORDERING INFORMATION MB39C308BGF Package 208-ball plastic PFBGA BGA-208P-M02 • EV BOARD ORDERING INFORMATION EV board part No. MB39C308EVB-11 Remarks Remarks PFBGA-208 • RoHS COMPLIANCE INFORMATION OF LEAD Pb FREE VERSION The LSI products of Fujitsu Microelectronics with “E1” are compliant with RoHS Directive , and has observed the standard of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls PBB , and polybrominated diphenyl ethers PBDE A product whose part number has trailing characters “E1” is RoHS compliant. • MARKING FORMAT LEAD FREE VERSION J APA N MB 39 C308 XXXX XXX INDEX Lead-free version DS04-27261-6E MB39C308 • LABELING SAMPLE LEAD FREE VERSION Lead-free mark JEITA logo JEDEC logo MB123456P - 789 - GE1 3N 1MB123456P-789-GE1 1000 3N 2 1561190005 107210 1,000 MB123456P - 789 - GE1 QC PASS 2006/03/01 ASSEMBLED IN JAPAN MB123456P - 789 - GE1 1/1 0605 - Z01A 1000 1561190005 The part number of a lead-free product has the trailing characters “E1”. DS04-27261-6E MB39C308 • MB39C308BGF RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL [Fujitsu Microelectronics Recommended Mounting Conditions] Item Condition Mounting Method Mounting times Storage period Storage conditions IR infrared reflow , Manual soldering partial heating method 2 times Before opening Please use it within two years after Manufacture. page - DESCRIPTION 1 - FEATURES 1 - APPLICATIONS 2 - PIN ASSIGNMENT 3 - PIN DESCRIPTIONS 4 - BLOCK DIAGRAM 7 - ABSOLUTE MAXIMUM RATINGS 9 - RECOMMENDED OPERATING CONDITIONS 10 - ELECTRICAL CHARACTERISTICS 12 - CHANNEL CONTROL FUNCTION 19 - POWER GOOD FUNCTION 19 - PROTECTION 20 - DESCRIPTION OF SOFT-START AND SOFT-STOP OPERATION 21 - PRESET FUNCTION OF CH3/CH4/CH6 OUTPUT VOLTAGE 23 - TYPICAL CHARACTERISTICS 24 - NOTES FOR UNCONNECTED PINS 26 - APPLICATION NOTE 30 - REFERENCE DATA 37 - TYPICAL APPLICATION CIRCUIT 45 - PARTS LIST 47 - PRINTED CIRCUIT BOARD LAYOUT 49 - USAGE PRECAUTION 53 - ORDERING INFORMATION 55 - EV BOARD ORDERING INFORMATION 55 - RoHS COMPLIANCE INFORMATION OF LEAD Pb FREE VERSION 55 - MARKING FORMAT LEAD FREE VERSION 55 - LABELING SAMPLE LEAD FREE VERSION 56 - MB39C308BGF RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL 57 - PACKAGE DIMENSION 58 DS04-27261-6E MB39C308 FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel +81-3-5322-3329 For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel +1-408-737-5600 Fax +1-408-737-5999 Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. 151 Lorong Chuan, #05-08 New Tech Park 556741 Singapore Tel +65-6281-0770 Fax +65-6281-0220 Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel +49-6103-690-0 Fax +49-6103-690-122 FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm. 3102, Bund Center, No.222 Yan An Road E , Shanghai 200002, China Tel +86-21-6146-3688 Fax +86-21-6335-1605 Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic of Korea Tel +82-2-3484-7100 Fax +82-2-3484-7111 FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel +852-2377-0226 Fax +852-2376-3269 Specifications are subject to change without notice. For further information please contact each office. All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated 1 for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system , or 2 for use requiring extremely high reliability i.e., submersible repeater and artificial satellite . Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. Edited Sales Promotion Department

PDF Datasheet Preview

The following document contains information on Cypress products.

FUJITSU MICROELECTRONICS DATA SHEET

DS04-27261-6E

ASSP for Power Management Applications of Ultra Mobile PC
6ch DC/DC Converter IC for LPIA Platform VR

MB39C308
• DESCRIPTION

The MB39C308 is a 6ch DC/DC buck converter LSI, which integrates all of necessary power supplies for UltraMobile PC powered by 2-cell Li-ion battery. And the MB39C308 uses current mode topology with N-channel synchronous rectification to realize high conversion efficiency. The MB39C308 is the Power Management IC supporting the LPIA Low Power Intel Architecture which Intel Corporation proposes as the low power consumption platform for UMPC.

The CH1 and CH2 are flexible to adopt the output current capability by selection of external FETs and easy to optimize efficiency. The CH3, CH4, CH5 and CH6 integrate the switching FETs capable of high current for downsizing the power supply solution.

The MB39C308 uses Fujitsu’s LDMOS process technology and supplies all power without dispersing power from a lithium-ion battery.
• FEATURES
• Input voltage range

V to V
• Topology

Current Mode
• Integrated FET Driver for external MOSFETs CH1, CH2
• Integrated Switching MOSFETs

CH3, CH4, CH5, CH6
• Fixed Preset Output Voltage

CH1, CH2, CH5
• Selectable Preset Output Voltage

CH3, CH4, CH6

Channel

Output voltage

Output current

Remarks

CH3 CH4

V/1.5 V/0.75 V

Max A DDR2/DDR3 are selectable.

Max A

Max A

V/1.05 V Max A Two values are selectable.
* It is the reference value at the typical EVB.

Continued

Copyright 2007-2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved

MB39C308

Continued
• PWM switching frequency

CH4 MHz/0.35 MHz
• Various protection
- Over current protection OCP
- Input over voltage protection IVP
• ORDERING INFORMATION

MB39C308BGF

Package
208-ball plastic PFBGA BGA-208P-M02
• EV BOARD ORDERING INFORMATION

EV board part No. MB39C308EVB-11

Remarks

Remarks PFBGA-208
• RoHS COMPLIANCE INFORMATION OF LEAD Pb FREE VERSION

The LSI products of Fujitsu Microelectronics with “E1” are compliant with RoHS Directive , and has observed the standard of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls PBB , and polybrominated diphenyl ethers PBDE A product whose part number has trailing characters “E1” is RoHS compliant.
• MARKING FORMAT LEAD FREE VERSION

J APA N MB 39 C308 XXXX XXX

INDEX

Lead-free version

DS04-27261-6E

MB39C308
• LABELING SAMPLE LEAD FREE VERSION

Lead-free mark

JEITA logo

JEDEC logo

MB123456P - 789 - GE1
3N 1MB123456P-789-GE1 1000
3N 2 1561190005 107210
1,000

MB123456P - 789 - GE1

QC PASS
2006/03/01

ASSEMBLED IN JAPAN

MB123456P - 789 - GE1
1/1 0605 - Z01A 1000
1561190005

The part number of a lead-free product has the trailing characters “E1”.

DS04-27261-6E

MB39C308
• MB39C308BGF RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL
[Fujitsu Microelectronics Recommended Mounting Conditions]

Item

Condition

Mounting Method Mounting times

Storage period

Storage conditions

IR infrared reflow , Manual soldering partial heating method
2 times

Before opening

Please use it within two years after Manufacture.
page - DESCRIPTION 1 - FEATURES 1 - APPLICATIONS 2 - PIN ASSIGNMENT 3 - PIN DESCRIPTIONS 4 - BLOCK DIAGRAM 7 - ABSOLUTE MAXIMUM RATINGS 9 - RECOMMENDED OPERATING CONDITIONS 10 - ELECTRICAL CHARACTERISTICS 12 - CHANNEL CONTROL FUNCTION 19 - POWER GOOD FUNCTION 19 - PROTECTION 20 - DESCRIPTION OF SOFT-START AND SOFT-STOP OPERATION 21 - PRESET FUNCTION OF CH3/CH4/CH6 OUTPUT VOLTAGE 23 - TYPICAL CHARACTERISTICS 24 - NOTES FOR UNCONNECTED PINS 26 - APPLICATION NOTE 30 - REFERENCE DATA 37 - TYPICAL APPLICATION CIRCUIT 45 - PARTS LIST 47 - PRINTED CIRCUIT BOARD LAYOUT 49 - USAGE PRECAUTION 53 - ORDERING INFORMATION 55 - EV BOARD ORDERING INFORMATION 55 - RoHS COMPLIANCE INFORMATION OF LEAD Pb FREE VERSION 55 - MARKING FORMAT LEAD FREE VERSION 55 - LABELING SAMPLE LEAD FREE VERSION 56 - MB39C308BGF RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL 57 - PACKAGE DIMENSION 58

DS04-27261-6E

MB39C308

FUJITSU MICROELECTRONICS LIMITED

Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel +81-3-5322-3329

For further information please contact:

North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel +1-408-737-5600 Fax +1-408-737-5999

Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. 151 Lorong Chuan, #05-08 New Tech Park 556741 Singapore Tel +65-6281-0770 Fax +65-6281-0220

Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel +49-6103-690-0 Fax +49-6103-690-122

FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm. 3102, Bund Center, No.222 Yan An Road E , Shanghai 200002, China Tel +86-21-6146-3688 Fax +86-21-6335-1605

Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic of Korea Tel +82-2-3484-7100 Fax +82-2-3484-7111

FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel +852-2377-0226 Fax +852-2376-3269

Specifications are subject to change without notice. For further information please contact each office.
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated 1 for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system , or 2 for use requiring extremely high reliability i.e., submersible repeater and artificial satellite . Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.

Edited Sales Promotion Department

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived MB39C308BGF-G-ERE1 Datasheet file may be downloaded here without warranties.

Datasheet ID: MB39C308BGF-G-ERE1 508286