CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18
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CY7C1515V18-167BZC (pdf) |
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CY7C1513V18-250BZC |
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CY7C1515V18-167BZXI |
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CY7C1515V18-250BZC |
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CY7C1513V18-200BZC |
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CY7C1515V18-200BZC |
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CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 72-Mbit QDR -II SRAM 4-Word Burst Architecture Functional Description • Separate independent read and write data ports Supports concurrent transactions • 300 MHz clock for high bandwidth • 4-word burst for reducing address bus frequency • Double Data Rate DDR interfaces on both read and write ports data transferred at 600 MHz at 300 MHz • Two input clocks K and K for precise DDR timing SRAM uses rising edges only • Two input clocks for output data C and C to minimize clock skew and flight time mismatches • Echo clocks CQ and CQ simplify data capture in high-speed systems • Single multiplexed address input bus latches address inputs for read and write ports • Separate port selects for depth expansion • Synchronous internally self-timed writes • Available in x8, x9, x18, and x36 configurations • Full data coherency, providing most current data • Core VDD = ± 0.1V IO VDDQ = 1.4V to VDD • Available in 165-Ball FBGA package 15 x 17 x mm • Offered in both Pb-free and non Pb-free packages • Variable drive HSTL output buffers • JTAG compatible test access port • Delay Lock Loop DLL for accurate data placement Configurations The CY7C1511V18, CY7C1526V18, CY7C1513V18, and CY7C1515V18 are 1.8V Synchronous Pipelined SRAMs, equipped with QDR -II architecture. QDR-II architecture consists of two separate ports the read port and the write port to access the memory array. The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations. QDR-II architecture has separate data inputs and data outputs to completely eliminate the need to “turn-around” the data bus that exists with common IO devices. Each port can be accessed through a common address bus. Addresses for read and write addresses are latched on alternate rising edges of the input K clock. Accesses to the QDR-II read and write ports are completely independent of one another. To maximize data throughput, both read and write ports are equipped with DDR interfaces. Each address location is associated with four 8-bit words CY7C1511V18 , 9-bit words CY7C1526V18 , 18-bit words CY7C1513V18 , or 36-bit words CY7C1515V18 that burst sequentially into or out of the device. Because data can be transferred into and out of the device on every rising edge of both input clocks K and K and C and C , memory bandwidth is maximized while simplifying system design by eliminating bus “turn-arounds”. Depth expansion is accomplished with port selects, which enables each port to operate independently. All synchronous inputs pass through input registers controlled by the K or K input clocks. All data outputs pass through output registers controlled by the C or C or K or K in a single clock domain input clocks. Writes are conducted with on-chip synchronous self-timed write circuitry. CY7C1511V18 8M x 8 CY7C1526V18 8M x 9 CY7C1513V18 4M x 18 CY7C1515V18 2M x 36 Selection Guide Description Maximum Operating Frequency Maximum Operating Current 300 MHz 1020 1230 278 MHz 278 865 870 950 1140 250 MHz 250 790 795 865 1040 200 MHz 200 655 660 715 850 167 MHz 167 570 575 615 725 Unit MHz mA • San Jose, CA 95134-1709 • 408-943-2600 [+] Feedback Logic Block Diagram CY7C1511V18 CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 D[7:0] A 20:0 21 Address Register K DOFF VREF WPS NWS[1:0] CLK Gen. Control Logic Write Add. Decode Read Add. Decode Write Reg Address Register A 20:0 2M x 8 Array 2M x 8 Array 2M x 8 Array 2M x 8 Array Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit for actual products offered. Speed MHz Ordering Code Package Diagram Package Type Operating Range 300 CY7C1511V18-300BZC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Commercial CY7C1526V18-300BZC CY7C1513V18-300BZC CY7C1515V18-300BZC CY7C1511V18-300BZXC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-300BZXC CY7C1513V18-300BZXC CY7C1515V18-300BZXC CY7C1511V18-300BZI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Industrial CY7C1526V18-300BZI CY7C1513V18-300BZI CY7C1515V18-300BZI CY7C1511V18-300BZXI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-300BZXI CY7C1513V18-300BZXI CY7C1515V18-300BZXI 278 CY7C1511V18-278BZC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Commercial CY7C1526V18-278BZC CY7C1513V18-278BZC CY7C1515V18-278BZC CY7C1511V18-278BZXC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-278BZXC CY7C1513V18-278BZXC CY7C1515V18-278BZXC CY7C1511V18-278BZI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Industrial CY7C1526V18-278BZI Ordering Information continued Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit for actual products offered. Speed MHz Ordering Code Package Diagram Package Type Operating Range 250 CY7C1511V18-250BZC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Commercial CY7C1526V18-250BZC CY7C1513V18-250BZC CY7C1515V18-250BZC CY7C1511V18-250BZXC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-250BZXC CY7C1513V18-250BZXC CY7C1515V18-250BZXC CY7C1511V18-250BZI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Industrial CY7C1526V18-250BZI CY7C1513V18-250BZI CY7C1515V18-250BZI CY7C1511V18-250BZXI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-250BZXI CY7C1513V18-250BZXI CY7C1515V18-250BZXI 200 CY7C1511V18-200BZC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Commercial CY7C1526V18-200BZC CY7C1513V18-200BZC CY7C1515V18-200BZC CY7C1511V18-200BZXC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-200BZXC CY7C1513V18-200BZXC CY7C1515V18-200BZXC CY7C1511V18-200BZI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Industrial CY7C1526V18-200BZI Ordering Information continued Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit for actual products offered. Speed MHz Ordering Code Package Diagram Package Type Operating Range 167 CY7C1511V18-167BZC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Commercial CY7C1526V18-167BZC CY7C1513V18-167BZC CY7C1515V18-167BZC CY7C1511V18-167BZXC 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-167BZXC CY7C1513V18-167BZXC CY7C1515V18-167BZXC CY7C1511V18-167BZI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Industrial CY7C1526V18-167BZI CY7C1513V18-167BZI CY7C1515V18-167BZI CY7C1511V18-167BZXI 51-85195 165-Ball Fine Pitch Ball Grid Array 15 x 17 x mm Pb-Free CY7C1526V18-167BZXI CY7C1513V18-167BZXI CY7C1515V18-167BZXI Page 29 of 32 [+] Feedback Package Diagram CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Figure 165-ball FBGA 15 x 17 x mm , 51-85195 ! " # % & ' * + , 0 2 ! " # % & ' * + , 0 2 51-85195-*A Page 30 of 32 [+] Feedback CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Document History Page Document Title 72-Mbit QDR -II SRAM 4-Word Burst Architecture Document Number 38-05363 SUBMISSION DATE ORIG. OF CHANGE DESCRIPTION OF CHANGE ** 226981 SYT Removed CY7C1526V18 from the title Included 300-MHz Speed Bin Added footnote #1 and accordingly edited the VSS/144M And VSS/288M on the Pin Definitions table Added Industrial temperature grade Replaced TBDs for IDD and ISB1 for 300 MHz, 250 MHz, 200 MHz and 167 MHz speed grades Changed the CIN from 5 pF to pF and CO from 7 pF to 8 pF in the Capacitance Table Changed typo of bit # 47 to bit # 108 under the EXTEST OUTPUT BUS TRI-STATE on Page 17 Removed the capacitance value column for the x9 option from Capacitance Table Added lead-free product information Updated the Ordering Information by Shading and unshading as per availability *C 403231 See ECN Converted from Preliminary to Final Added CY7C1526V18 part number to the title Added 278-MHz speed Bin Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901 North First Street” to “198 Champion Court” Changed C/C Pin Description in the features section and Pin Description Added power-up sequence details and waveforms Added foot notes #16, 17, 18 on page# 19 Changed the description of IX from Input Load Current to Input Leakage Current on page# 20 Modified the IDD and ISB values Modified test condition in Footnote #19 on page # 20 from VDDQ < VDD to VDDQ < VDD Replaced Package Name column with Package Diagram in the Ordering Information table Updated Ordering Information Table *D 467290 See ECN Modified the ZQ Definition from Alternately, this pin can be connected directly to VDD to Alternately, this pin can be connected directly to VDDQ Included Maximum Ratings for Supply Voltage on VDDQ Relative to GND Changed the Maximum Ratings for DC Input Voltage from VDDQ to VDD Changed tTCYC from 100 ns to 50 ns, changed tTH and tTL from 40 ns to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH from 10 ns to 5 ns and changed tTDOV from 20 ns to 10 ns in TAP AC Switching Characteristics table Modified Power-Up waveform Changed the Maximum rating of Ambient Temperature with Power Applied from to +85°C to +125°C Added additional notes in the AC parameter section Modified AC Switching Waveform Updated the Typo in the AC Switching Characteristics Table Updated the Ordering Information Table Page 31 of 32 [+] Feedback CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Document History Page Document Title 72-Mbit QDR -II SRAM 4-Word Burst Architecture Document Number 38-05363 *E 2511080 See ECN VKN/AESA Updated Logic Block diagram Updated Power-up sequence waveform and it’s description Updated IDD/ISB specs Added footnote #21 related to IDD Changed ΘJA spec from to Changed ΘJC spec from to Changed DLL minimum operating frequency from 80MHz to 120MHz Changed tCYC max spec to 8.4ns for all speed bins Modified footnotes 23 and 30 *F 2549270 08/06/08 PYRS Publish in External Web Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales. Products PSoC Clocks & Buffers Wireless Memories Image Sensors psoc.cypress.com clocks.cypress.com wireless.cypress.com memory.cypress.com image.cypress.com PSoC Solutions General psoc.cypress.com/solutions Low Power/Low Voltage psoc.cypress.com/low-power Precision Analog psoc.cypress.com/precision-analog LCD Drive psoc.cypress.com/lcd-drive CAN 2.0b psoc.cypress.com/can psoc.cypress.com/usb Cypress Semiconductor Corporation, The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code software and/or firmware is owned by Cypress Semiconductor Corporation Cypress and is protected by and subject to worldwide patent protection United States and foreign , United States copyright laws and international treaty provisions. 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Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Page 32 of 32 QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC, and Samsung. All product and company names mentioned in this document are the trademarks of their respective holders. [+] Feedback |
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