UP-T03-CB
UP-T03-CB Datasheet
| Part | Datasheet |
|---|---|
UP-T03-CB |
UP-T03-CB (pdf) |
| PDF Datasheet Preview |
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| METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP10 for Single TO-3 Outline Natural Conv. °C/W Forced Air °C/W Mounting Envelope x Series UP10 for Single TO-3 Outline Technical DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. B. N.C Horiz. & Vert. With Dissipator. C. 200 FPM w/Diss. D. 500 FPM w/Diss. E. 1000 FPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. Ordering Information Unplated UP10-TO3-U CTS IERC PART NO. Comm'l. Black Mil. Black Anodize Anodize UP10-TO3-CB UP10-TO3-B Semiconductor Hole patt. Accommodated ref. no. TO-3 Max. Weight Grams HOLE PATTERNS Hole pattern no. 432 accommodates TO-3s. Available in UP10 series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel 818 842-7277 Fax 818 848-8872 |
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