UP1-TO3B

UP1-TO3B Datasheet

UP1 Series for TO-3 Outline and Stud Mount Devices

Part	Datasheet
UP1-TO3B	UP1-TO3B (pdf)

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METAL CASE, CASE-MOUNTED SEMICONDUCTORS UP1 Series for TO-3 Outline and Stud Mount Devices Natural Conv. °C/W Forced Air °C/W Mounting Envelope x Series UP1 Series for TO-3 Outline and Stud Mount Devices Technical DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. B. N.C Horiz. & Vert. With Dissipator. C. 200 FPM w/Diss. D. 500 FPM w/Diss. E. 1000 FPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. • Derate °C/watt for part in natural convection only. Ordering Information Unplated UP1-000-U UP1-T03-U UP1-T03-46U UP1-436-U UP1-T06-U UP1-T015-U UP-420-U UP1-T0V-7U CTS IERC PART NO. Comm'l. Black Mil. Black Anodize Anodize UP1-000-CB UP1-000-B UP1-T03-CB UP1-T03-B UP1-T03-46CB UP1-T03-46B UP1-436-CB UP1-436-B UP1-T06-CB UP1-T06-B UP1-T015-CB UP1-T015-B UP1-420-CB UP1-420-B UP1-T0V-7CB UP1-T0V-7B Semiconductor Hole patt. Accommodated ref. no. Undrilled T0-3 T0-3 IC TO-3 4-pin T0-6, T0-36 T0-15, D0-5 Universal Universal Max. Weight Grams HOLE PATTERNS Hole pattern no. 1 accommodates T0-3s. Available in UP, Hole pattern no. 202 accommodates T0-3 ICs. Available in UP1, UP2, HP1, and HP3 series heat dissipators. UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 436 accommodates t0-3s 4-pin . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

PDF Datasheet Preview

METAL CASE, CASE-MOUNTED SEMICONDUCTORS

UP1 Series for TO-3 Outline and Stud Mount Devices

Natural Conv. °C/W Forced Air °C/W Mounting Envelope x

Series UP1 Series for TO-3 Outline and Stud Mount Devices

Technical

DESCRIPTION OF CURVES A. N.C. Horiz. Device Only

Mounted to G-10. B. N.C Horiz. & Vert. With

Dissipator. C. 200 FPM w/Diss. D. 500 FPM w/Diss. E. 1000 FPM w/Diss.
• Thermal Resistance Case to Sink is °C/W/Joint Compound.
• Derate °C/watt for unplated part in natural convection only.
• Derate °C/watt for part in natural convection only.
Ordering Information

Unplated

UP1-000-U UP1-T03-U UP1-T03-46U UP1-436-U UP1-T06-U UP1-T015-U UP-420-U UP1-T0V-7U

CTS IERC PART NO.

Comm'l. Black

Mil. Black

Anodize

Anodize

UP1-000-CB

UP1-000-B

UP1-T03-CB

UP1-T03-B

UP1-T03-46CB

UP1-T03-46B

UP1-436-CB

UP1-436-B

UP1-T06-CB

UP1-T06-B

UP1-T015-CB

UP1-T015-B

UP1-420-CB

UP1-420-B

UP1-T0V-7CB

UP1-T0V-7B

Semiconductor Hole patt. Accommodated ref. no.

Undrilled

T0-3

T0-3 IC

TO-3 4-pin

T0-6, T0-36

T0-15, D0-5

Universal

Universal

Max. Weight Grams

HOLE PATTERNS

Hole pattern no. 1 accommodates T0-3s. Available in UP,

Hole pattern no. 202 accommodates T0-3 ICs. Available in

UP1, UP2, HP1, and HP3 series heat dissipators.

UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 436 accommodates t0-3s 4-pin . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

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Datasheet ID: UP1-TO3B 507295