PC1-1CB
PC1-1CB Datasheet
PC1-1CB
| Part | Datasheet |
|---|---|
PC1-1CB |
PC1-1CB (pdf) |
| Related Parts | Information |
|---|---|
PA1-1CB |
PA1-1CB |
| PDF Datasheet Preview |
|---|
| HEAT DISSIPATORS FOR PLASTIC CASE, CASE-MOUNTED SEMICONDUCTORS Horizontally mounted, light-weight, low-cost heat dissipators .Accommodates all flat plastic case power semiconductors. .Efficient design requires just. 71 sq. in. of board area PA Series and to height above board. .L'4I'ger PB Series offers greater heat dissipation, additional hole patterns, and dual semiconductor mounting capability. .Only one mounting screw required to secure dissipators to semiconductor and circuit board. .Most effective l:1eatdissipator in perfor- mance/unit cost. PC1-1CB i~ 1u '~ Dimensions are for reference use only. Contact IERC for , dimensions with tolerances or standard part drawings. PA1 Series J..L POWER DISSIPATED WATTS .Thermal Resistance Case to Sink is 'C/W/Joint Compound. .Derate 'C/watt for unplated part in natural convection only. Ordering Information Unplated PC1.IU PCI-ICB PC1.1B TO-126, TO-127, TO-220 Max. Weight Grams Dimensions are for reference use only. ContectlERC for dimensions with tolerances or standsrd part drawings. .Thermal .Uprate .Derate 1 2 3 4 5 6 7 8 9 10111213 1415 POWER DISSIPATED WATTS Resistance Case to Sink is °C/W/Joint Compound. °C/watt for black part in natural convection only. °C/watt for Insulube~ part in natural convection only. Ordering Information Unplated PAlU PAl-lU IERC PART NO. I Com'l. Black Mil. Black Anodize Anodize PAlCB PAl.lCB PAlO PA1.lo Insulube~ 448 PAl-l Note See page iv for other finishes. Semiconductor Accommodated Undrllled TO-126, TO-1n TO-220 Max. Weight Grams |
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