HP1-TO3-CB

HP1-TO3-CB Datasheet

HP1 Series for Single TO-3 or Stud Mount Devices

Part	Datasheet
HP1-TO3-CB	HP1-TO3-CB (pdf)

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METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP1 Series for Single TO-3 or Stud Mount Devices Series HP1 Technical DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. A. N.C. Horiz. & Vert. With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-000-U HP1-TO3-U HP1-TO3-33U HP1-TO3-44U HP1-436-U HP1-TO6-U HP1-TO15-U HP1-420-U HP1-000-CB HP1-TO3-CB HP1-TO3-33CB HP1-TO3-44CB HP1-436-CB HP1-T06-CB HP1-TO15-CB HP1-420-CB Mil. Black Anodize Semiconductor Accommodated HP1-000-B HP1-TO3-B HP1-TO3-33B HP1-TO3-44B HP1-436-B HP1-T06-B HP1-TO15-B HP1-420-B Undrilled TO-3 TO-3 IC TO-3 panel mount TO-3 4-pin TO-6, TO-36 TO-15, DO-5 Universal Hole patt. Ref. No. see pg. 1-28 -16 17 31 18 19 23 27 Max. Weight Grams HP1 Series for Single TO-66 Outline DESCRIPTION OF CURVES B. N.C. Horiz. Device Only Mounted to G-10. D. N.C. Horiz. & Vert. With Dissipator. E. 200 RPM w/Diss. F. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt for unplated part in natural convection only. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-TO66-U HP1-TO66-35U HP1-TO66-49U HP1-TO66-CB HP1-TO66-35CB HP1-TO66-49CB Mil. Black Anodize Semiconductor Accommodated HP1-TO66-B HP1-TO66-35B HP1-TO66-49B TO-66 TO-66 IC TO-66 IC Socket Hole patt. Ref. No. see pg. 1-28 24 25 26 Max. Weight Grams HP1 Series for Dual TO-66 Outline DESCRIPTION OF CURVES C. N.C. Horiz. Device Only Mounted to G-10. G. N.C. Horiz. & Vert. With Dissipator. H. 200 RPM w/Diss. I. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2°C at equivalent power levels. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-TO66-4U HP1-TO66-36U HP1-TO66-4CB HP1-TO66-36CB Mil. Black Anodize Semiconductor Accommodated HP1-TO66-4B Two TO-66s HP1-TO66-36B Two TO-66 Ics Hole patt. Ref. No. see pg. 1-30 32 34 Max. Weight Grams HP1 Series for Three TO-66 Outline DESCRIPTION OF CURVES D. N.C. Horiz. Device Only Mounted to G-10. J. N.C. Horiz. & Vert. With Dissipator. K. 200 RPM w/Diss. L. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is °C/W/Joint Compound. • Derate °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2°C at equivalent power levels in natural convection. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize HP1-TO66-8U HP1-TO66-39U HP1-TO66-8CB HP1-TO66-39CB Mil. Black Anodize Semiconductor Accommodated HP1-TO66-8B Two TO-66s HP1-TO66-39B Two TO-66 Ics Hole patt. Ref. No. see pg. 1-30 33 35 Max. Weight Grams HOLE PATTERNS Hole pattern no. 1 accommodates T0-3s. Available in UP, Hole pattern no. 202 accommodates T0-3 ICs. Available in UP1, UP2, HP1, and HP3 series heat dissipators. UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 436 accommodates t0-3s 4-pin . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 3 accommodates TO-15s, DO-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 114 accommodates TO-66s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 226 accommodates TO-66 ICs socket . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. Hole pattern no. 213 accommodates one TO-3 panel mounted . Available in HP1 and HP3 series heat dissipators only. Hole pattern no. 150 accommodates two TO-66s. Available in HP1 and HP3 series heat dissipators only. Hole pattern no. 185 accommodates three TO-66s. Available in HP1 and HP3 series heat dissipators only. Hole pattern no. 201 accommodates two TO-66s ICs. Available in HP1 and HP3 series heat dissipators only. Hole pattern no. 203 accommodates three TO-66 ICs. Available in HP1 and HP3 series heat dissipators only. Hole pattern no. 420 Universal accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel 818 842-7277 Fax 818 848-8872

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METAL CASE, CASE-MOUNTED SEMICONDUCTORS

HP1 Series for Single TO-3 or Stud Mount Devices

Series HP1

Technical

DESCRIPTION OF CURVES A. N.C. Horiz. Device

Only Mounted to G-10. A. N.C. Horiz. & Vert.

With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is °C/W/Joint Compound.
• Derate °C/watt for unplated part in natural convection only.
Ordering Information

IERC PART NO.

Unplated

Comm’l. Black Anodize

HP1-000-U HP1-TO3-U HP1-TO3-33U HP1-TO3-44U HP1-436-U HP1-TO6-U HP1-TO15-U HP1-420-U

HP1-000-CB HP1-TO3-CB HP1-TO3-33CB HP1-TO3-44CB HP1-436-CB HP1-T06-CB HP1-TO15-CB HP1-420-CB

Mil. Black Anodize

Semiconductor Accommodated

HP1-000-B HP1-TO3-B HP1-TO3-33B HP1-TO3-44B HP1-436-B HP1-T06-B HP1-TO15-B HP1-420-B

Undrilled TO-3 TO-3 IC TO-3 panel mount TO-3 4-pin TO-6, TO-36 TO-15, DO-5 Universal

Hole patt. Ref. No. see pg.
1-28
-16 17 31 18 19 23 27

Max. Weight Grams

HP1 Series for Single TO-66 Outline

DESCRIPTION OF CURVES B. N.C. Horiz. Device

Only Mounted to G-10. D. N.C. Horiz. & Vert.

With Dissipator. E. 200 RPM w/Diss. F. 500 RPM w/Diss. E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is °C/W/Joint Compound.
• Derate °C/watt for unplated part in natural convection only.
Ordering Information

IERC PART NO.

Unplated

Comm’l. Black

Anodize

HP1-TO66-U HP1-TO66-35U HP1-TO66-49U

HP1-TO66-CB HP1-TO66-35CB HP1-TO66-49CB

Mil. Black Anodize

Semiconductor Accommodated

HP1-TO66-B HP1-TO66-35B HP1-TO66-49B

TO-66 TO-66 IC TO-66 IC Socket

Hole patt. Ref. No. see pg.
1-28 24 25 26

Max. Weight Grams

HP1 Series for Dual TO-66 Outline

DESCRIPTION OF CURVES C. N.C. Horiz. Device

Only Mounted to G-10. G. N.C. Horiz. & Vert.

With Dissipator. H. 200 RPM w/Diss. I. 500 RPM w/Diss. E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is °C/W/Joint Compound.
• Derate °C/watt per device for unplated part in natural convection only.
• Case Temperatures Match Within 2°C at equivalent power levels.
Ordering Information

IERC PART NO.

Unplated

Comm’l. Black

Anodize

HP1-TO66-4U HP1-TO66-36U

HP1-TO66-4CB HP1-TO66-36CB

Mil. Black Anodize

Semiconductor Accommodated

HP1-TO66-4B Two TO-66s HP1-TO66-36B Two TO-66 Ics

Hole patt. Ref. No. see pg.
1-30 32 34

Max. Weight Grams

HP1 Series for Three TO-66 Outline

DESCRIPTION OF CURVES D. N.C. Horiz. Device

Only Mounted to G-10. J. N.C. Horiz. & Vert.

With Dissipator. K. 200 RPM w/Diss. L. 500 RPM w/Diss. E. 1000 RPM w/Diss.
• Thermal Resistance Case to Sink is °C/W/Joint Compound.
• Derate °C/watt per device for unplated part in natural convection only.
• Case Temperatures Match Within 2°C at equivalent power levels in natural convection.
Ordering Information

IERC PART NO.

Unplated

Comm’l. Black

Anodize

HP1-TO66-8U HP1-TO66-39U

HP1-TO66-8CB HP1-TO66-39CB

Mil. Black Anodize

Semiconductor Accommodated

HP1-TO66-8B Two TO-66s HP1-TO66-39B Two TO-66 Ics

Hole patt. Ref. No. see pg.
1-30 33 35

Max. Weight Grams

HOLE PATTERNS

Hole pattern no. 1 accommodates T0-3s. Available in UP,

Hole pattern no. 202 accommodates T0-3 ICs. Available in

UP1, UP2, HP1, and HP3 series heat dissipators.

UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 436 accommodates t0-3s 4-pin . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 3 accommodates TO-15s, DO-5s and other ¼” stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 114 accommodates TO-66s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 226 accommodates TO-66 ICs socket . Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

Hole pattern no. 213 accommodates one TO-3 panel mounted . Available in HP1 and HP3 series heat dissipators only.

Hole pattern no. 150 accommodates two TO-66s. Available in HP1 and HP3 series heat dissipators only.

Hole pattern no. 185 accommodates three TO-66s. Available in HP1 and HP3 series heat dissipators only.

Hole pattern no. 201 accommodates two TO-66s ICs. Available in HP1 and HP3 series heat dissipators only.

Hole pattern no. 203 accommodates three TO-66 ICs. Available in HP1 and HP3 series heat dissipators only.

Hole pattern no. 420 Universal accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators.

CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel 818 842-7277 Fax 818 848-8872

Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived HP1-TO3-CB Datasheet file may be downloaded here without warranties.

Datasheet ID: HP1-TO3-CB 507286