B10-03B
B10-03B Datasheet
B10 RF Relays
| Part | Datasheet |
|---|---|
B10-03B |
B10-03B (pdf) |
| Related Parts | Information |
|---|---|
B10-05B |
B10-05B |
| PDF Datasheet Preview |
|---|
| B10 RF Relays Ball Grid Array Relays Coto’s Ball Grid Array BGA construction offers a breakthrough in reed relay performance. This patented technology1 allows for shorter RF paths in a controlled 50 environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. BGA packaging allows relays to be integrated easily on boards designed for surface mount processing. Series Features BGA Surface Mount Ability to pass GHz signals Rise time < Characteristic Impedance Low Capacitance Patented Design1 Applications IC Testers In-Line Relay Testers Memory Testers Mixed Signal Testers High Bandpass Applications Dimensions in Inches Millimeters Notes 1 Protected by one or more of the following U.S. patents or patents pending 6025768, 6052045, 6294971 and other foreign patents. 40 COTO TECHNOLOGY USA Tel 401 943-2686 / Fax 401 942-0920 6 Europe Tel +31-45-5439343 / Fax +31-45-5427216 B10 RF Relays Test Parameters Coil Resistance Nominal Voltage Must Operate Voltage Must Release Voltage Coil Resistance Nominal Voltage Must Operate Voltage Must Release Voltage Switching Voltage Switching Current Carry Current Continuous Contact Rating Resistive Load Life Expectancy Signal Switching3 Resistive Load3 Other Load Conditions3 Static Contact Resistance initial Dynamic Contact Resistance initial Insulation Res All Isolated Pins Capacitance Across Contacts Capacitance Open Contact to Coil Capacitance Closed Contact to Coil Across Contacts Dielectric Contact to Coil Strength Contact to Shield Operate Time including bounce Release Time Si diode damped RF Insertion Loss4 Signal Rise Time 10% - 90% Conditions1,2 3.3V Coil |
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