834100T00000
834100T00000 Datasheet
| Part | Datasheet |
|---|---|
834100T00000 |
834100T00000 (pdf) |
| PDF Datasheet Preview |
|---|
| Board Level Heat Sinks P/N & Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient D PAK, TO-252 PRODUCT SPECIFICATIONS • Devices D PAK, TO-252 • Size x mm • Material Copper, mm Thick • Type Stamped • PCB Mounting Surface Mount Technology • Finish Tin Plate • Package Bulk or Tape & Reel • No Hardware Device Attachment • Direct SMT Contact to PCB • Solderable Legs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Body Configurations • Contact Applications Engineering 30 20 Air Velocity - LFM Heat Dissipated - Watts 1000 25 15 10 Packaging Bulk Tape & Reel Notes Contact Factory for Tape and Reel Specs COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
| More datasheets: ELSW-E91B3-0LPNM-DB6B8 | ELSW-J11G3-0LPNM-DG1G3 | ELSW-J31M3-0CPGS-D3000 | SCMF | AMMC-3041-W50 | AMMC-3041-W10 | 485PS2 | B39401R724U310 | 210-283 | 2983 |
Notice: we do not provide any warranties that information, datasheets, application notes, circuit diagrams, or software stored on this website are up-to-date or error free. The archived 834100T00000 Datasheet file may be downloaded here without warranties.