833900T00000
833900T00000 Datasheet
| Part | Datasheet |
|---|---|
833900T00000 |
833900T00000 (pdf) |
| PDF Datasheet Preview |
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| Board Level Heat Sinks P/N & Temp Rise Above Ambient - oC Mounting Surface Thermal Resistance - oC/ Watt Mounting Surface to Ambient D PAK, TO-263, SO-10, MO-184 PRODUCT SPECIFICATIONS • Devices D PAK, TO-263, SO-10, MO-184 • Size x mm • Material Copper, mm Thick • Type Stamped • PCB Mounting Surface Mount Technology • Finish Tin Plate • Package Bulk or Tape & Reel • No Hardware Device Attachment • Direct SMT Contact to PCB • Solderable Legs • RoHS Compliant CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 0 100 Air Velocity - LFM Heat Dissipated - Watts 1000 10 8 Packaging Bulk Tape & Reel Notes Contact Factory for Tape and Reel Specs COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web: |
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