831502B03900

831502B03900 Datasheet


P/N 831502B03900

Part Datasheet
831502B03900 831502B03900 831502B03900 (pdf)
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Board Level Heat Sinks

P/N 831502B03900

TO-220, TO-262

Temp Rise Above Ambient - 0C Mounting Surface

Thermal Resistance -0C / Watt Mounting Surface to Ambient

PRODUCT SPECIFICATIONS
• Devices TO-220 & TO-262
• Size x mm
• Material Aluminum, mm Thick
• Type Stamped
• IC Mounting Integrated Spring
• PCB Mounting Solderable Tab
• Finish Black Anodized
• Package Bulk
• No Hardware Device Attachment
• Constant Spring Force Tension
• Vertical Mounting via Solderable Tab
• RoHS Compliant

CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
0 100
60 40

Air Velocity - LFM

Heat Dissapated - Watts

COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121 Ph 858 348-6200 Fax 858 566-4577 E-mail Web:
1000 10 8
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Datasheet ID: 831502B03900 506123